SCHEMBL6937952

SCHEMBL6937952

O=C(O)c1cccc2c(Oc3cccc(Oc4ccc5c6c(cccc46)C(=O)OC5=O)c3)ccc(C(=O)O)c12

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TYMS P04818 7/20 0.60
▸ POLB P06746 5/20 0.44
▸ KDM4E B2RXH2 4/20 0.44
▸ BCL2 P10415 2/20 0.41
▸ MCL1 Q07820 2/20 0.41
▸ ALDH1A1 P00352 3/20 0.40
▸ L3MBTL1 Q9Y468 3/20 0.40
▸ RECQL P46063 2/20 0.40
▸ CASP6 P55212 2/20 0.40
▸ TDP1 Q9NUW8 2/20 0.40
▸ APOBEC3A P31941 1/20 0.40
▸ APOBEC3G Q9HC16 1/20 0.40
▸ MEN1 O00255 2/20 0.39
▸ KMT2A Q03164 2/20 0.39
▸ GAA P10253 1/20 0.39
▸ APEX1 P27695 1/20 0.38
▸ CTDSP1 Q9GZU7 1/20 0.38
▸ RXFP1 Q9HBX9 1/20 0.38
▸ CYSLTR1 Q9Y271 1/20 0.37
▸ MAPT P10636 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3006980 0.80 POLB (0.50) POLBKDM4EALDH1A1L3MBTL1MEN1
SCHEMBL8427336 0.77 TYMS (1.00) TYMSPOLBKDM4EALDH1A1L3MBTL1
SCHEMBL30714778 0.77 TYMS (1.00) TYMSPOLBKDM4EALDH1A1L3MBTL1
SCHEMBL17726870 0.75 MAPT (0.43) TYMSPOLBBCL2MCL1ALDH1A1
SCHEMBL11558315 0.75 TYMS (0.42) TYMSPOLBKDM4EBCL2MCL1
SCHEMBL23430836 0.72 MCL1 (0.56) TYMSPOLBKDM4EBCL2MCL1
SCHEMBL19384682 0.72 TYMS (0.77) TYMSPOLBKDM4EALDH1A1L3MBTL1
SCHEMBL16291732 0.71 TYMS (0.53) TYMSPOLBKDM4EBCL2MCL1
SCHEMBL11051059 0.70 TYMS (0.52) TYMSPOLBKDM4EMCL1ALDH1A1
SCHEMBL3413891 0.70 TYMS (0.68) TYMSPOLBKDM4EALDH1A1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6582879-B2 Specified photo acid generating agent used in heat resistant photoresist composition which contains polyamide oligomer containing ester groups as pendant groups; minimize post-exposure baking process and post-exposure delay effect KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY (KR) 2003-06-24 — — US disclosed
US-20030064315-A1 Reactive photo acid-generating agent and heat-resistant photoresist composition with polyamide precursor KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY 2003-04-03 — — US disclosed
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