SCHEMBL700196

SCHEMBL700196

[Ca+2].[O-2].[O-2].[O-2].[Ru+4]

nearest known ligand 0.00

Known targets — ChEMBL curated mechanism

GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHMGCRMMP1MMP13MMP7MMP8PTGS1PTGS2ileSpolrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11243524 0.87
SCHEMBL2432896 0.87
SCHEMBL5456316 0.87
SCHEMBL5067686 0.82
SCHEMBL10576947 0.82
SCHEMBL2679973 0.82
SCHEMBL7621984 0.82
SCHEMBL11674077 0.82
SCHEMBL36860 0.82
SCHEMBL16274558 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 179 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11685991-B2 Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process ASM IP HOLDING B.V. (NL) 2023-06-27 US claimed
US-20210095372-A1 A METHOD FOR DEPOSITING A RUTHENIUM-CONTAINING FILM ON A SUBSTRATE BY A CYCLICAL DEPOSITION PROCESS UNIVERSITEIT GENT (BE) 2021-04-01 US claimed
EP-3737779-A1 A METHOD FOR DEPOSITING A RUTHENIUM-CONTAINING FILM ON A SUBSTRATE BY A CYCLICAL DEPOSITION PROCESS ASM IP Holding B.V. (NL) 2020-11-18 EP claimed
CN-111699278-A Method for depositing ruthenium-containing films on substrates by cyclic deposition process ASM IP私人控股有限公司 2020-09-22 CN claimed
US-10354824-B2 Piezoelectronic switch device for RF applications INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2019-07-16 US claimed
US-9881759-B2 Piezoelectronic switch device for RF applications INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2018-01-30 US claimed
US-20170084413-A1 PIEZOELECTRONIC SWITCH DEVICE FOR RF APPLICATIONS INTERNATIONAL BUSINESS MACHINES CORPORATION 2017-03-23 US claimed
US-9472368-B2 Piezoelectronic switch device for RF applications INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2016-10-18 US claimed
US-20160268083-A1 PIEZOELECTRONIC SWITCH DEVICE FOR RF APPLICATIONS INTERNATIONAL BUSINESS MACHINES CORPORATION 2016-09-15 US claimed
US-9436159-B2 Apparatus and method for displaying holographic three-dimensional image SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-09-06 US claimed
US-20090194805-A1 Non-Volatile Memory Device SAMSUNG ELECTRONICS CO., LTD. 2009-08-06 US claimed
US-20090061538-A1 Methods of forming ferroelectric capacitors and methods of manufacturing semiconductor devices using the same SAMSUNG ELECTRONICS CO., LTD. 2009-03-05 US claimed
US-20090035877-A1 METHODS OF FORMING A FERROELECTRIC LAYER AND METHODS OF MANUFACTURING A FERROELECTRIC CAPACITOR INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. 2009-02-05 US claimed
US-20080001209-A1 Non-volatile memory device and method of manufacturing the non-volatile memory device SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-01-03 US claimed
US-20070128775-A1 Method of manufacturing a semiconductor device having a tungsten carbon nitride layer SAMSUNG ELECTRONICS CO., LTD. 2007-06-07 US claimed
US-20070059929-A1 Method of forming a tantalum carbon nitride layer and method of manufacturing a semiconductor device using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-03-15 US claimed
US-20070045689-A1 Ferroelectric Structures Including Multilayer Lower Electrodes and Multilayer Upper Electrodes, and Methods of Manufacturing Same SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-03-01 US claimed
US-20060273366-A1 Methods of manufacturing ferroelectric capacitors and semiconductor devices SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-12-07 US claimed
US-20060214204-A1 Ferroelectric structures and devices including upper/lower electrodes of different metals and methods of forming the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-09-28 US claimed
US-5470668-A Metal oxide films on metal THE REGENTS OF THE UNIVERSITY OF CALIF. (US) 1995-11-28 US claimed