SCHEMBL7018271

SCHEMBL7018271

CCCc1ccc(N)c(C(=O)O)c1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.68
CDC25B P30305 1/20 0.68
CASP6 P55212 1/20 0.68
RCE1 Q9Y256 1/20 0.68
KDM4E B2RXH2 4/20 0.53
KMT2A Q03164 2/20 0.53
GFER P55789 1/20 0.53
RXFP1 Q9HBX9 1/20 0.53
MCL1 Q07820 3/20 0.52
MAPT P10636 2/20 0.52
PKM P14618 2/20 0.52
MEN1 O00255 1/20 0.52
USP2 O75604 1/20 0.52
POLB P06746 1/20 0.52
THRB P10828 1/20 0.52
APEX1 P27695 1/20 0.52
RECQL P46063 1/20 0.52
BLM P54132 1/20 0.52
TDP1 Q9NUW8 1/20 0.52
KAT8 Q9H7Z6 2/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10364256 0.90 ALDH1A1 (0.64) ALDH1A1CDC25BCASP6RCE1KDM4E
SCHEMBL25170829 0.89 ALDH1A1 (0.78) ALDH1A1CDC25BCASP6RCE1KDM4E
SCHEMBL30291197 0.89 ALDH1A1 (0.78) ALDH1A1CDC25BCASP6RCE1KDM4E
SCHEMBL2076751 0.87 KAT8 (0.70) ALDH1A1CDC25BCASP6RCE1KMT2A
SCHEMBL10801712 0.87 KAT8 (0.70) ALDH1A1CDC25BCASP6RCE1KMT2A
SCHEMBL27553918 0.86 PPARA (0.51) ALDH1A1CDC25BCASP6RCE1KDM4E
SCHEMBL648210 0.85 ALDH1A1 (0.72) ALDH1A1CDC25BCASP6RCE1KDM4E
SCHEMBL31236857 0.84 ALDH1A1 (0.70) ALDH1A1CDC25BCASP6RCE1KDM4E
SCHEMBL1355572 0.83 SORT1 (0.56) ALDH1A1CDC25BCASP6RCE1KDM4E
SCHEMBL21247582 0.83 ALDH1A1 (0.51) ALDH1A1CDC25BCASP6RCE1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110809607-B Resin composition, laminate, method for producing same, electrode, secondary battery, and electric double layer capacitor 东丽株式会社 2022-05-17 CN disclosed
CN-109792019-B Separator for nonaqueous electrolyte battery and nonaqueous electrolyte battery 东丽株式会社 2021-12-03 CN disclosed
CN-108368259-B Resin composition 东丽株式会社 2020-11-20 CN disclosed
CN-110809607-A Resin composition, laminate, method for producing same, electrode, secondary battery, and electric double layer capacitor 东丽株式会社 2020-02-18 CN disclosed
CN-104067699-B Dielectric film resin combination and its utilization 株式会社钟化 2017-03-29 CN disclosed
CN-106463706-A Method for manufacturing electrode 宇部兴产株式会社 2017-02-22 CN disclosed
CN-106165164-A Method for manufacturing electrode 宇部兴产株式会社 2016-11-23 CN disclosed
CN-102575008-B The method preparing polyimidesiloxane solution composition, and polyimidesiloxane solution composition 宇部兴产株式会社 2016-09-14 CN disclosed
CN-103282830-B Novel photosensitive resin composition and use thereof 株式会社钟化 2016-06-22 CN disclosed
CN-105705999-A Photosensitive thermosetting resin composition and flexible printed wiring board 太阳油墨制造株式会社 2016-06-22 CN disclosed
CN-1768089-A Thermosetting resin composition, multilayer body using same, and circuit board KANEGAFUCHI CHEMICAL IND (JP) 2006-05-03 CN disclosed
CN-1767176-A Flexible wiring board for tape carrier package having improved flame resistance UBE INDUSTRIES (JP) 2006-05-03 CN disclosed
CN-1230436-C Imidazo[1,5,-A] pyrimido[5,4-d]benzazepine derivatives as GABAA receptor medulators HOFFMANN LA ROCHE (CH) 2005-12-07 CN disclosed
CN-1599884-A Photosensitive resin composition and photosensitive films and laminates made by using the same KANEGAFUCHI CHEMICAL IND (JP) 2005-03-23 CN disclosed
CN-1522387-A Photosensitive resin composition, and photosensitive dry film resist and photosensitive coverlay film using the same 钟渊化学工业株式会社 2004-08-18 CN disclosed
CN-1509289-A Imidazo [1, 5-a ] pyrimido [5, 4-d ] [1] benzazepine * derivatives as GABA A receptor modulators - 2004-06-30 CN disclosed
CN-1509317-A Thermosetting resin composition and laminates and circuit board substrates made by using same ��Ԩ��ѧ��ҵ��ʽ���� 2004-06-30 CN disclosed
WO-2003106435-A1 FUSED-RING PYRIMIDIN-4(3H)-ONE DERIVATIVES, PROCESSES FOR THE PREPARATION AND USES THEREOF SANKYO COMPANY, LIMITED (JP) 2003-12-24 WO disclosed
CN-1416452-A Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof HITACHI CHEMICAL CO LTD (JP) 2003-05-07 CN disclosed
EP-0142057-A2 Thiazoloquinazoline derivatives, their preparation and pharmaceutical compositions containing same F. HOFFMANN-LA ROCHE AG (CH) 1985-05-22 EP disclosed