Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.48 |
| ▸ | CA12 | O43570 | 2/20 | 0.41 |
| ▸ | CA1 | P00915 | 2/20 | 0.41 |
| ▸ | CA2 | P00918 | 2/20 | 0.41 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.41 |
| ▸ | CA4 | P22748 | 1/20 | 0.41 |
| ▸ | CA7 | P43166 | 1/20 | 0.41 |
| ▸ | CA9 | Q16790 | 1/20 | 0.41 |
| ▸ | NFE2L2 | Q16236 | 5/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | POLB | P06746 | 2/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | TP53 | P04637 | 1/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL647735 | 0.92 | SMN1; SMN2 (0.50) | SMN1; SMN2CA12CA1CA2CA14 | |
| SCHEMBL703492 | 0.92 | SMN1; SMN2 (0.50) | SMN1; SMN2CA12CA1CA2CA14 | |
| SCHEMBL7804610 | 0.91 | SMN1; SMN2 (0.44) | SMN1; SMN2CA12CA1CA2CA14 | |
| Ammonia Solution, Strong SCHEMBL28823190 | 0.89 | SMN1; SMN2 (0.43) | SMN1; SMN2CA12CA1CA2CA14 | |
| SCHEMBL21066749 | 0.89 | SMN1; SMN2 (0.43) | SMN1; SMN2CA12CA1CA2CA14 | |
| SCHEMBL645536 | 0.88 | SMN1; SMN2 (0.48) | SMN1; SMN2CA12CA1CA2CA14 | |
| SCHEMBL5410345 | 0.88 | SMN1; SMN2 (0.42) | SMN1; SMN2CA12CA1CA2CA14 | |
| SCHEMBL5420968 | 0.88 | SMN1; SMN2 (0.42) | SMN1; SMN2CA12CA1CA2CA14 | |
| SCHEMBL5404842 | 0.88 | SMN1; SMN2 (0.42) | SMN1; SMN2CA12CA1CA2CA14 | |
| SCHEMBL5414911 | 0.88 | SMN1; SMN2 (0.42) | SMN1; SMN2CA12CA1CA2CA14 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8283260-B2 | Process for restoring dielectric properties | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-10-09 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100041234-A1 | Process For Restoring Dielectric Properties | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2010-02-18 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20090298671-A1 | Compositions for Preparing Low Dielectric Materials Containing Solvents | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-12-03 | — | — | US | disclosed |
| US-7500397-B2 | Activated chemical process for enhancing material properties of dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-03-10 | — | — | US | disclosed |
| US-7482676-B2 | Compositions for preparing low dielectric materials | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-01-27 | — | — | US | disclosed |
| US-20080264672-A1 | Photoimprintable Low Dielectric Constant Material and Method for Making and Using Same | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-10-30 | — | — | US | disclosed |
| US-20080199977-A1 | Activated Chemical Process for Enhancing Material Properties of Dielectric Films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-08-21 | — | — | US | disclosed |
| US-20060183055-A1 | Method for defining a feature on a substrate | VERSUM MATERIALS US, LLC | 2006-08-17 | — | — | US | disclosed |
| EP-1691410-A2 | Method for defining a feature on a substrate | Air Products and Chemicals, Inc. (US) | 2006-08-16 | — | — | EP | disclosed |
| EP-1583141-A2 | Solvents and methods using same for removing silicon-containing residues from a substrate | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2005-10-05 | — | — | EP | disclosed |
| EP-1577935-A2 | Compositions for preparing low dielectric materials containing solvents | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2005-09-21 | — | — | EP | disclosed |
| US-20050196974-A1 | Compositions for preparing low dielectric materials containing solvents | VERSUM MATERIALS US, LLC | 2005-09-08 | — | — | US | disclosed |
| US-20050196535-A1 | Solvents and methods using same for removing silicon-containing residues from a substrate | AIR PRODUCTS AND CHEMICALS, INC. | 2005-09-08 | — | — | US | disclosed |
| EP-1561841-A2 | Cleaning CVD Chambers following deposition of porogen-containing materials | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2005-08-10 | — | — | EP | disclosed |
| US-20050161060-A1 | Cleaning CVD chambers following deposition of porogen-containing materials | AIR PRODUCTS AND CHEMICALS, INC. | 2005-07-28 | — | — | US | disclosed |
| US-20040048960-A1 | Compositions for preparing low dielectric materials | AIR PRODUCTS AND CHEMICALS, INC. | 2004-03-11 | — | — | US | disclosed |
| EP-1376671-A1 | Compositions for preparing materials with a low dielectric constant | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-01-02 | — | — | EP | disclosed |