Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AOC3 | Q16853 | 2/20 | 0.40 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | HTR2A | P28223 | 5/20 | 0.34 |
| ▸ | HRH1 | P35367 | 5/20 | 0.34 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | MMP8 | P22894 | 1/20 | 0.33 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.33 |
| ▸ | OPRD1 | P41143 | 1/20 | 0.33 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.33 |
| ▸ | OPRL1 | P41146 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | IDO1 | P14902 | 1/20 | 0.33 |
| ▸ | TDO2 | P48775 | 1/20 | 0.33 |
| ▸ | RIPK1 | Q13546 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19470844 | 0.89 | POLB (0.40) | LMNAHTR2ASIGMAR1OPRM1OPRD1 | |
| SCHEMBL3110907 | 0.89 | SIGMAR1 (0.40) | LMNAHTR2ASIGMAR1OPRM1OPRD1 | |
| SCHEMBL19470848 | 0.87 | HTR2A (0.41) | HTR2ASIGMAR1OPRM1OPRD1OPRK1 | |
| SCHEMBL19470845 | 0.87 | HTR2A (0.41) | HTR2ASIGMAR1OPRM1OPRD1OPRK1 | |
| SCHEMBL19470821 | 0.87 | HTR2A (0.41) | HTR2ASIGMAR1OPRM1OPRD1OPRK1 | |
| SCHEMBL19470838 | 0.87 | HTR2A (0.41) | HTR2ASIGMAR1OPRM1OPRD1OPRK1 | |
| SCHEMBL705765 | 0.84 | LMNA (0.43) | AOC3LMNAHTR2AHRH1KMT2A | |
| SCHEMBL2244555 | 0.83 | HRH1 (0.50) | HTR2AHRH1IDO1TDO2RIPK1 | |
| SCHEMBL703457 | 0.83 | AOC3 (0.39) | AOC3LMNAHTR2AHRH1SIGMAR1 | |
| SCHEMBL706757 | 0.81 | AOC3 (0.38) | AOC3LMNAHTR2AHRH1SIGMAR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2216682-B1 | POSITIVE PHOTOSENSITIVE COMPOSITION, POSITIVE PERMANENT RESIST, AND METHOD FOR PRODUCING POSITIVE PERMANENT RESIST | ADEKA CORP (JP) | 2013-07-17 | — | — | EP | claimed |
| CN-107075255-B | Encapsulating material composition for LED | 日产化学工业株式会社 | 2020-05-22 | — | — | CN | disclosed |
| US-10066059-B2 | Sealing material composition for LED | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2018-09-04 | — | — | US | disclosed |
| US-20170306095-A1 | SEALING MATERIAL COMPOSITION FOR LED | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2017-10-26 | — | — | US | disclosed |
| EP-2216682-B1 | POSITIVE PHOTOSENSITIVE COMPOSITION, POSITIVE PERMANENT RESIST, AND METHOD FOR PRODUCING POSITIVE PERMANENT RESIST | ADEKA CORP (JP) | 2013-07-17 | — | — | EP | disclosed |
| US-8211619-B2 | Positive photosensitive composition, positive permanent resist, and method for producing positive permanent resist | ADEKA CORPORATION (JP) | 2012-07-03 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100273104-A1 | POSITIVE PHOTOSENSITIVE COMPOSITION, POSITIVE PERMANENT RESIST, AND METHOD FOR PRODUCING POSITIVE PERMANENT RESIST | A D E K A (ADEKA CORPORATION) (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2216682-A1 | POSITIVE PHOTOSENSITIVE COMPOSITION, POSITIVE PERMANENT RESIST, AND METHOD FOR PRODUCING POSITIVE PERMANENT RESIST | Adeka Corporation (JP) | 2010-08-11 | — | — | EP | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |