SCHEMBL706757

SCHEMBL706757

CCCO[SiH](OCCC)C(CCC)c1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AOC3 Q16853 2/20 0.38
LMNA P02545 3/20 0.34
OPRM1 P35372 2/20 0.33
OPRK1 P41145 2/20 0.33
HTT P42858 2/20 0.33
OPRD1 P41143 1/20 0.33
OPRL1 P41146 1/20 0.33
POLB P06746 1/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
HTR2A P28223 3/20 0.33
HRH1 P35367 3/20 0.33
SCN1A P35498 2/20 0.33
SCN2A Q99250 2/20 0.33
SCN3A Q9NY46 2/20 0.33
SIGMAR1 Q99720 1/20 0.33
CYP1A2 P05177 1/20 0.33
CHRM2 P08172 1/20 0.33
CHRM4 P08173 1/20 0.33
CHRM5 P08912 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20483787 0.90 POLB (0.41) LMNAOPRM1OPRK1OPRD1OPRL1
SCHEMBL702250 0.90 LTA4H (0.40) AOC3LMNAPOLBSIGMAR1CYP1A2
SCHEMBL19470839 0.88 POLB (0.37) LMNAOPRM1OPRK1OPRD1OPRL1
SCHEMBL702246 0.87 LMNA (0.39) LMNAOPRM1OPRK1HTTOPRD1
SCHEMBL703457 0.87 AOC3 (0.39) AOC3LMNAOPRM1OPRK1OPRD1
SCHEMBL19470875 0.87 NPC1 (0.38) LMNAOPRM1OPRK1OPRD1OPRL1
SCHEMBL20483521 0.87 NPC1 (0.38) LMNAOPRM1OPRK1OPRD1OPRL1
SCHEMBL19470824 0.87 NPC1 (0.38) LMNAOPRM1OPRK1OPRD1OPRL1
SCHEMBL19470863 0.87 NPC1 (0.38) LMNAOPRM1OPRK1OPRD1OPRL1
SCHEMBL19470871 0.87 NPC1 (0.38) LMNAOPRM1OPRK1OPRD1OPRL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107075255-B Encapsulating material composition for LED 日产化学工业株式会社 2020-05-22 CN disclosed
US-10066059-B2 Sealing material composition for LED NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-09-04 US disclosed
US-20170306095-A1 SEALING MATERIAL COMPOSITION FOR LED NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-10-26 US disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed