SCHEMBL7048388

SCHEMBL7048388

CCNc1ccc(C2(c3ccc(NC)cc3)c3ccccc3-c3ccccc32)cc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.46
MAPT P10636 3/20 0.46
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
KDM4E B2RXH2 1/20 0.46
OPRK1 P41145 1/20 0.46
GFER P55789 1/20 0.43
POLB P06746 2/20 0.43
ESR1 P03372 1/20 0.40
ESR2 Q92731 1/20 0.40
PDK2 Q15119 2/20 0.39
TSHR P16473 1/20 0.35
ADRA2A P08913 2/20 0.33
ADRA2B P18089 1/20 0.33
ADRA2C P18825 1/20 0.33
RPS6KA2 Q15349 2/20 0.31
MITF O75030 1/20 0.31
USP2 O75604 1/20 0.31
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29579333 1.00 LMNA (0.46) LMNAMAPTMEN1KMT2ASMN1; SMN2
SCHEMBL7052319 0.94 LMNA (0.52) LMNAMAPTMEN1KMT2ASMN1; SMN2
SCHEMBL30771578 0.88 MEN1 (0.57) LMNAMAPTMEN1KMT2ASMN1; SMN2
SCHEMBL6538799 0.88 MEN1 (0.57) LMNAMAPTMEN1KMT2ASMN1; SMN2
SCHEMBL7051590 0.86 MAPT (0.67) LMNAMAPTMEN1KMT2ASMN1; SMN2
SCHEMBL29579600 0.81 LMNA (0.41) LMNAMAPTMEN1KMT2ASMN1; SMN2
SCHEMBL7050458 0.81 LMNA (0.41) LMNAMAPTMEN1KMT2ASMN1; SMN2
SCHEMBL7050425 0.81 MAPT (0.73) LMNAMAPTMEN1KMT2ASMN1; SMN2
SCHEMBL7051594 0.81 MAPT (0.49) LMNAMAPTMEN1KMT2ASMN1; SMN2
SCHEMBL15693180 0.79 MEN1 (0.39) LMNAMAPTMEN1KMT2ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP claimed
EP-2900726-A2 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN Hexcel Composites Limited (GB) 2015-08-05 EP claimed
US-20150210847-A1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LIMITED (GB) 2015-07-30 US claimed
CN-111295407-B Resin composition and resin infusion method 塞特工业公司 2023-06-27 CN disclosed
US-11370908-B2 Curable compositions and related methods 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-06-28 US disclosed
CN-110114384-B Curable composition 3M创新有限公司 2022-06-07 CN disclosed
US-20220080553-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M INNOVATIVE PROPERTIES CO (US) 2022-03-17 US disclosed
US-20220001514-A1 ABRASIVE ARTICLE WITH MICROPARTICLE-COATED ABRASIVE GRAINS 3M INNOVATIVE PROPERTIES COMPANY 2022-01-06 US disclosed
US-20210363289-A1 RESIN COMPOSITIONS AND RESIN INFUSION PROCESS CYTEC INDUSTRIES INC. (US) 2021-11-25 US disclosed
EP-3898097-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M Innovative Properties Company (US) 2021-10-27 EP disclosed
US-20210292545-A1 PREPREG TORAY INDUSTRIES, INC. (JP) 2021-09-23 US disclosed
EP-0591313-B1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING & MFG (US) 1997-04-02 EP disclosed
WO-1997011112-A1 EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-03-27 WO disclosed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US disclosed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US disclosed
EP-0591313-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS. MINNESOTA MINING & MFG (US) 1994-04-13 EP disclosed
WO-1993000675-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-01-07 WO disclosed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP disclosed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US disclosed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP disclosed