Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 4/20 | 0.41 |
| ▸ | MAPT | P10636 | 3/20 | 0.41 |
| ▸ | MEN1 | O00255 | 2/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.41 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.41 |
| ▸ | PDK2 | Q15119 | 4/20 | 0.40 |
| ▸ | POLB | P06746 | 2/20 | 0.39 |
| ▸ | ESR1 | P03372 | 1/20 | 0.38 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.38 |
| ▸ | AKR1A1 | P14550 | 1/20 | 0.37 |
| ▸ | AKR1B1 | P15121 | 1/20 | 0.37 |
| ▸ | HTR6 | P50406 | 1/20 | 0.37 |
| ▸ | PTH1R | Q03431 | 1/20 | 0.37 |
| ▸ | MDM2 | Q00987 | 1/20 | 0.34 |
| ▸ | S100A4 | P26447 | 1/20 | 0.34 |
| ▸ | EGFR | P00533 | 1/20 | 0.34 |
| ▸ | NPC1 | O15118 | 1/20 | 0.34 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29579600 | 1.00 | LMNA (0.41) | LMNAMAPTMEN1KMT2AKDM4E | |
| SCHEMBL7052319 | 0.87 | LMNA (0.52) | LMNAMAPTMEN1KMT2AKDM4E | |
| SCHEMBL7048388 | 0.81 | LMNA (0.46) | LMNAMAPTMEN1KMT2AKDM4E | |
| SCHEMBL29579333 | 0.81 | LMNA (0.46) | LMNAMAPTMEN1KMT2AKDM4E | |
| SCHEMBL7051590 | 0.80 | MAPT (0.67) | LMNAMAPTMEN1KMT2AKDM4E | |
| SCHEMBL19850003 | 0.79 | PDK2 (0.51) | LMNAMAPTMEN1KMT2AKDM4E | |
| SCHEMBL29575912 | 0.79 | PDK2 (0.51) | LMNAMAPTMEN1KMT2AKDM4E | |
| SCHEMBL23567185 | 0.77 | KDM4E (0.71) | LMNAMAPTMEN1KMT2AKDM4E | |
| SCHEMBL9176719 | 0.77 | PDK2 (0.50) | LMNAMAPTMEN1KMT2AKDM4E | |
| SCHEMBL19954813 | 0.76 | ESR1 (0.40) | LMNAMAPTMEN1KMT2AKDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2900726-B1 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | HEXCEL COMPOSITES LTD (GB) | 2020-04-08 | — | — | EP | claimed |
| EP-2900726-A2 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | Hexcel Composites Limited (GB) | 2015-08-05 | — | — | EP | claimed |
| US-20150210847-A1 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | HEXCEL COMPOSITES LIMITED (GB) | 2015-07-30 | — | — | US | claimed |
| US-11370908-B2 | Curable compositions and related methods | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2022-06-28 | — | — | US | disclosed |
| US-20220080553-A1 | RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR | 3M INNOVATIVE PROPERTIES CO (US) | 2022-03-17 | — | — | US | disclosed |
| US-20220001514-A1 | ABRASIVE ARTICLE WITH MICROPARTICLE-COATED ABRASIVE GRAINS | 3M INNOVATIVE PROPERTIES COMPANY | 2022-01-06 | — | — | US | disclosed |
| US-20210363289-A1 | RESIN COMPOSITIONS AND RESIN INFUSION PROCESS | CYTEC INDUSTRIES INC. (US) | 2021-11-25 | — | — | US | disclosed |
| EP-3898097-A1 | RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR | 3M Innovative Properties Company (US) | 2021-10-27 | — | — | EP | disclosed |
| US-11111333-B2 | Resin compositions and resin infusion process | CYTEC INDUSTRIES INC. (US) | 2021-09-07 | — | — | US | disclosed |
| US-11078358-B2 | Curable composition including epoxy resin and curable solid filler | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2021-08-03 | — | — | US | disclosed |
| EP-3814398-A1 | CURABLE COMPOSITIONS AND RELATED METHODS | 3M Innovative Properties Company (US) | 2021-05-05 | — | — | EP | disclosed |
| EP-0591313-B1 | VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS | MINNESOTA MINING & MFG (US) | 1997-04-02 | — | — | EP | disclosed |
| WO-1997011112-A1 | EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1997-03-27 | — | — | WO | disclosed |
| US-5432010-A | Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1995-07-11 | — | — | US | disclosed |
| US-5369192-A | Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1994-11-29 | — | — | US | disclosed |
| EP-0591313-A1 | VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS. | MINNESOTA MINING & MFG (US) | 1994-04-13 | — | — | EP | disclosed |
| WO-1993000675-A1 | VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1993-01-07 | — | — | WO | disclosed |
| EP-0203828-B1 | EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1990-03-28 | — | — | EP | disclosed |
| US-4684678-A | POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1987-08-04 | — | — | US | disclosed |
| EP-0203828-A1 | Epoxy resin curing agent, curing process and composition containing it | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1986-12-03 | — | — | EP | disclosed |