Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.36 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.36 |
| ▸ | LTA4H | P09960 | 2/20 | 0.35 |
| ▸ | PCSK9 | Q8NBP7 | 1/20 | 0.35 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.34 |
| ▸ | NAAA | Q02083 | 1/20 | 0.34 |
| ▸ | AR | P10275 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.33 |
| ▸ | CES2 | O00748 | 1/20 | 0.33 |
| ▸ | CES1 | P23141 | 1/20 | 0.33 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18108369 | 0.92 | KCNH2 (0.42) | NAAASMN1; SMN2HTTCES2CES1 | |
| SCHEMBL18108181 | 0.92 | KCNH2 (0.42) | NAAASMN1; SMN2HTTCES2CES1 | |
| SCHEMBL706935 | 0.89 | NR1H2 (0.43) | NR1H2NR1H3AR | |
| SCHEMBL708300 | 0.86 | TP53 (0.35) | TSHRTDP1NR1H2NR1H3 | |
| SCHEMBL705811 | 0.86 | ALDH1A1 (0.33) | TSHRTDP1 | |
| SCHEMBL708106 | 0.86 | ALDH1A1 (0.33) | TSHRTDP1 | |
| SCHEMBL706939 | 0.83 | TSHR (0.36) | TSHRLTA4HPCSK9PTGS2NAAA | |
| SCHEMBL18108273 | 0.83 | SIGMAR1 (0.37) | TSHRLTA4HPCSK9PTGS2NAAA | |
| SCHEMBL706954 | 0.81 | ALDH1A1 (0.35) | TSHRTDP1 | |
| SCHEMBL18108206 | 0.81 | LTA4H (0.38) | TSHRNR1H2NR1H3LTA4HPCSK9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9884928-B2 | Polymers functionalized with activated nitrogen heterocycles containing a pendant functional group | BRIDGESTONE CORPORATION (JP) | 2018-02-06 | — | — | US | disclosed |
| US-20160289354-A1 | POLYMERS FUNCTIONALIZED WITH ACTIVATED NITROGEN HETEROCYCLES CONTAINING A PENDANT FUNCTIONAL GROUP | BRIDGESTONE CORPORATION (JP) | 2016-10-06 | — | — | US | disclosed |
| EP-2599836-B1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | ADEKA CORP (JP) | 2015-03-25 | — | — | EP | disclosed |
| US-8470937-B2 | Curable composition for semiconductor encapsulation | ADEKA CORPORATION (JP) | 2013-06-25 | — | — | US | disclosed |
| EP-2599836-A1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Adeka Corporation (JP) | 2013-06-05 | — | — | EP | disclosed |
| US-20120126435-A1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | ADEKA CORPORATION (JP) | 2012-05-24 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |