SCHEMBL705574

SCHEMBL705574

CC(=O)O[SiH2]C(C)(c1ccccc1)c1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.47
KMT2A Q03164 1/20 0.47
KCNN4 O15554 1/20 0.41
CYP2C19 P33261 1/20 0.41
HIF1A Q16665 1/20 0.41
ALDH1A1 P00352 6/20 0.41
ALOX15 P16050 1/20 0.41
HDAC3 O15379 1/20 0.40
HDAC4 P56524 1/20 0.40
HDAC1 Q13547 1/20 0.40
HDAC7 Q8WUI4 1/20 0.40
HDAC2 Q92769 1/20 0.40
HDAC10 Q969S8 1/20 0.40
HDAC11 Q96DB2 1/20 0.40
HDAC8 Q9BY41 1/20 0.40
HDAC6 Q9UBN7 1/20 0.40
HDAC9 Q9UKV0 1/20 0.40
HDAC5 Q9UQL6 1/20 0.40
MAPK1 P28482 1/20 0.39
CES1 P23141 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Biphenyl SCHEMBL27640086 0.77 MAPT (0.44) MAPTCYP2C19ALDH1A1CYP1A2TDP1
SCHEMBL707772 0.77 KCNN4 (0.38) MAPTKMT2AKCNN4CYP2C19HIF1A
SCHEMBL11379208 0.75 CYP2C19 (0.52) MAPTKMT2AKCNN4CYP2C19HIF1A
SCHEMBL2872078 0.73 MAPK1 (0.46) MAPTKMT2AKCNN4CYP2C19HIF1A
SCHEMBL706549 0.71 MAPK1 (0.44) MAPTKMT2AKCNN4CYP2C19HIF1A
SCHEMBL6564044 0.70 MAPT (0.43) MAPTKMT2AALDH1A1KDM4E
SCHEMBL42458 0.69 ALDH1A1 (0.56) MAPTKMT2AKCNN4CYP2C19HIF1A
Tert-Butylbenzene SCHEMBL27818982 0.69 KCNN4 (0.55) MAPTKMT2AKCNN4CYP2C19HIF1A
SCHEMBL27639903 0.69 MAPK1 (0.43) MAPTKMT2AKCNN4CYP2C19HIF1A
Acetic Acid SCHEMBL9574973 0.69 MAPT (0.56) MAPTKMT2AKCNN4CYP2C19HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed