SCHEMBL7056243

SCHEMBL7056243

Cc1nc(-c2cccc(N)c2)c[nH]1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.54
RECQL P46063 1/20 0.54
ALDH1A1 P00352 8/20 0.50
KDM4E B2RXH2 7/20 0.50
MAPT P10636 6/20 0.50
HPGD P15428 6/20 0.50
MEN1 O00255 4/20 0.50
KMT2A Q03164 4/20 0.50
LMNA P02545 3/20 0.50
METAP2 P50579 1/20 0.49
NPC1 O15118 6/20 0.46
RAB9A P51151 6/20 0.46
GLA P06280 1/20 0.46
SMN1; SMN2 Q16637 4/20 0.44
GFER P55789 3/20 0.44
TP53 P04637 3/20 0.44
PKM P14618 1/20 0.44
MAOA P21397 1/20 0.44
MAP4K4 O95819 3/20 0.44
KARS1 Q15046 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10604269 0.81 IDO1 (0.51) KDM4EMETAP2NPC1RAB9A
SCHEMBL13963161 0.80 MAPT (0.41) TSHRALDH1A1KDM4EMAPTMEN1
SCHEMBL8010306 0.79 KEAP1 (0.41) TSHRALDH1A1KDM4EMAPTHPGD
SCHEMBL1008901 0.79 MEN1 (0.46) TSHRALDH1A1KDM4EMAPTHPGD
SCHEMBL15676687 0.79 IDO1 (0.49) TSHRALDH1A1KDM4EMAPTHPGD
SCHEMBL17518810 0.79 IDO1 (0.49) KDM4EMAPTHPGDMEN1KMT2A
SCHEMBL8299017 0.79 PDGFRB (0.49) ALDH1A1KDM4EMAPTNPC1RAB9A
SCHEMBL5004823 0.79 ALDH1A1 (0.50) TSHRRECQLALDH1A1KDM4EMAPT
SCHEMBL8108992 0.77 KDM4E (0.57) TSHRRECQLALDH1A1KDM4EMAPT
Hydrochloric Acid SCHEMBL1307189 0.77 MEN1 (0.44) TSHRALDH1A1KDM4EMAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110776657-B High-thermal-conductivity polyimide film and preparation method thereof 株洲时代华鑫新材料技术有限公司 2022-02-11 CN claimed
CN-110776657-A High-thermal-conductivity polyimide film and preparation method thereof 株洲时代新材料科技股份有限公司 2020-02-11 CN claimed
CN-110776657-B High-thermal-conductivity polyimide film and preparation method thereof 株洲时代华鑫新材料技术有限公司 2022-02-11 CN disclosed
CN-110776657-A High-thermal-conductivity polyimide film and preparation method thereof 株洲时代新材料科技股份有限公司 2020-02-11 CN disclosed
EP-1307431-A2 EFFICIENT LIGAND-MEDIATED ULLMANN COUPLING OF ANILINES AND AZOLES Bristol-Myers Squibb Pharma Company (US) 2003-05-07 EP disclosed
WO-2002008199-A2 EFFICIENT LIGAND-MEDIATED ULLMANN COUPLING OF ANILINES AND AZOLES BRISTOL-MYERS SQUIBB PHARMA COMPANY (US) 2002-01-31 WO disclosed