⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL20578142 | 0.97 | — | — | |
| SCHEMBL15959321 | 0.88 | ACHE (0.44) | — | |
| SCHEMBL27338704 | 0.86 | MAPT (0.42) | — | |
| SCHEMBL80927 | 0.84 | TP53 (0.41) | — | |
| SCHEMBL29364620 | 0.84 | RELA (0.38) | — | |
| Fluoride SCHEMBL27660896 | 0.82 | TP53 (0.39) | — | |
| Water SCHEMBL20720558 | 0.82 | TP53 (0.39) | — | |
| SCHEMBL10613551 | 0.80 | ALDH1A1 (0.50) | — | |
| SCHEMBL29940589 | 0.79 | — | — | |
| SCHEMBL16341837 | 0.78 | GRIK2 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-62207334-A | — | — | None | — | — | JP | disclosed |
| US-9507054-B2 | Composition for forming an article having excellent reflectance and flame retardant properties and article formed therefrom | DOW CORNING CORPORATION (US) | 2016-11-29 | — | — | US | disclosed |
| WO-2016044547-A1 | 3D PRINTING METHOD UTILIZING A PHOTOCURABLE SILICONE COMPOSITION | DOW CORNING CORPORATION (US) | 2016-03-24 | — | — | WO | disclosed |
| US-20150362628-A1 | Composition For Forming An Article Having Excellent Reflectance And Flame Retardant Properties And Article Formed Therefrom | DOW SILICONES CORPORATION | 2015-12-17 | — | — | US | disclosed |
| US-9187602-B2 | Heteroelement siloxane compounds and polymers | DOW CORNING CORPORATION (US) | 2015-11-17 | — | — | US | disclosed |
| US-20150171249-A1 | PHOTOVOLTAIC CELL MODULE AND METHOD OF FORMING | DOW SILICONES CORPORATION | 2015-06-18 | — | — | US | disclosed |
| US-9012547-B2 | Hydrosilylation cured silicone resins plasticized by organophosphorous compounds | DOW CORNING CORPORATION (US) | 2015-04-21 | — | — | US | disclosed |
| EP-2599836-B1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | ADEKA CORP (JP) | 2015-03-25 | — | — | EP | disclosed |
| US-20150000735-A1 | Method Of Forming A Photovoltaic Cell Module Having Improved Impact Resistance | DOW CORNING CORPORATION | 2015-01-01 | — | — | US | disclosed |
| US-8920931-B2 | Phosphosiloxane resins, and curable silicone compositions, free-standing films, and laminates comprising the phosphosiloxane resins | DOW CORNING CORPORATION (US) | 2014-12-30 | — | — | US | disclosed |
| US-8252882-B2 | Polyimide resin produced by using silphenylene compound | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-08-28 | — | — | US | disclosed |
| US-20120126435-A1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | ADEKA CORPORATION (JP) | 2012-05-24 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-8048978-B2 | Silphenylene compound and process for producing the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-11-01 | — | — | US | disclosed |
| US-20110251371-A1 | POLYIMIDE RESIN PRODUCED BY USING SILPHENYLENE COMPOUND | SUGO MICHIHIRO | 2011-10-13 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20090156753-A1 | SILPHENYLENE COMPOUND AND PROCESS FOR PRODUCING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-06-18 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| JP-S62207334-A | SILICON CARBIDE POLYMER | NIPPON PETROCHEM CO LTD | 1987-09-11 | — | — | JP | disclosed |