SCHEMBL7072763

SCHEMBL7072763

CC=C(C)C(=O)Oc1ccc(CCC)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 5/20 0.61
KMT2A Q03164 2/20 0.49
PLA2G1B P04054 1/20 0.49
ATG4B Q9Y4P1 1/20 0.49
ALDH1A1 P00352 2/20 0.48
NPC1 O15118 2/20 0.46
MAPT P10636 2/20 0.46
RAB9A P51151 2/20 0.46
CASP3 P42574 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
SENP8 Q96LD8 1/20 0.46
SENP7 Q9BQF6 1/20 0.46
SENP6 Q9GZR1 1/20 0.46
THRA P10827 1/20 0.43
L3MBTL1 Q9Y468 2/20 0.42
ACACB O00763 1/20 0.42
ACACA Q13085 1/20 0.42
PLK1 P53350 1/20 0.41
POLB P06746 1/20 0.41
CTDSP1 Q9GZU7 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7065317 0.86 THRB (0.68) THRBKMT2APLA2G1BATG4BALDH1A1
SCHEMBL8653178 0.85 THRB (0.63) THRBKMT2APLA2G1BATG4BALDH1A1
SCHEMBL16504635 0.84 LMNA (0.46) KMT2AALDH1A1MAPTRAB9ASMN1; SMN2
SCHEMBL1516212 0.81 THRB (0.63) THRBKMT2APLA2G1BATG4BALDH1A1
SCHEMBL3899589 0.80 THRB (0.66) THRBKMT2APLA2G1BATG4BALDH1A1
SCHEMBL7078922 0.79 ALDH1A1 (0.55) THRBKMT2AALDH1A1NPC1SMN1; SMN2
SCHEMBL12257673 0.79 MAPT (0.49) THRBKMT2APLA2G1BATG4BALDH1A1
SCHEMBL11785681 0.79 THRB (0.64) THRBKMT2APLA2G1BATG4BALDH1A1
SCHEMBL11058761 0.79 LMNA (0.50) KMT2ARAB9ACASP3SENP7SENP6
SCHEMBL234883 0.78 THRB (0.68) THRBKMT2APLA2G1BATG4BALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed
CN-110088680-B Double-layer photosensitive layer roll 旭化成株式会社 2022-12-30 CN disclosed
CN-115185157-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-10-14 CN disclosed
CN-113820920-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-12-21 CN disclosed
CN-107850844-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-09-07 CN disclosed
US-8409790-B2 Method of producing a relief image for printing EASTMAN KODAK COMPANY (US) 2013-04-02 US disclosed
EP-0919871-B1 Photoimageable composition having improved flexibility, adhesion and stripping characteristics NICHIGO MORTON CO LTD (JP) 2003-06-18 EP disclosed
US-6558876-B1 Flexographic element having an infrared radiation ablatable layer capable of being selectively removed by a laser beam E. I. DU PONT DE NEMOURS AND COMPANY 2003-05-06 US disclosed
US-5928839-A COATING METAL LAYERS WITH LAYERS OF CURABLE PHOTOIMAGEABLE COMPOSITION, POLYMERIZABLE ACRYLATE MONOMER, OLIGOMER FORMED BY REACTION OF AN EPOXY RESIN AND ACRYLIC OR METHACRYLIC ACID, PHOTOSENSITIVE INITIATOR, EPOXY RESIN, CURING AGENT, CURING MORTON INTERNATIONAL, INC. (US) 1999-07-27 US disclosed
EP-0919871-A1 Photoimageable composition having improved flexibility, adhesion and stripping characteristics Nichigo-Morton Co Ltd (JP) 1999-06-02 EP disclosed
WO-1996041240-A1 WATER PHOTORESIST EMULSIONS AND METHODS OF PREPARATION THEREOF W.R. GRACE & CO.-CONN. (US) 1996-12-19 WO disclosed
US-4716093-A IMPROVED DEVELOPMENT AND STRIPPING E. I. DU PONT DE NEMOURS AND COMPANY (US) 1987-12-29 US disclosed
US-4257915-A USE IN PHOTOPOLYMERIZATION OF ETHYLENICALLY UNSATURATED MONOMERS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1981-03-24 US disclosed