Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTPN1 | P18031 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | TRPA1 | O75762 | 2/20 | 0.38 |
| ▸ | ATM | Q13315 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 3/20 | 0.35 |
| ▸ | MAPT | P10636 | 3/20 | 0.35 |
| ▸ | RAB9A | P51151 | 1/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | ACHE | P22303 | 1/20 | 0.34 |
| ▸ | GAA | P10253 | 2/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | AKR1B10 | O60218 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL707854 | 0.85 | ALDH1A1 (0.38) | PTPN1ALDH1A1KDM4EHPGDHSD17B10 | |
| SCHEMBL10535392 | 0.84 | TRPA1 (0.36) | ALDH1A1HSD17B10TRPA1ATMSMN1; SMN2 | |
| SCHEMBL7184008 | 0.83 | ALDH1A1 (0.35) | PTPN1ALDH1A1KDM4EHPGDHSD17B10 | |
| SCHEMBL7186486 | 0.80 | TRPA1 (0.33) | ALDH1A1HPGDHSD17B10TRPA1ATM | |
| SCHEMBL447683 | 0.76 | TRPA1 (0.41) | ALDH1A1TRPA1ATMSMN1; SMN2TSHR | |
| SCHEMBL5409861 | 0.76 | TRPA1 (0.41) | ALDH1A1KDM4ETRPA1ATMSMN1; SMN2 | |
| SCHEMBL18315768 | 0.74 | TRPA1 (0.39) | ALDH1A1TRPA1ATMSMN1; SMN2TSHR | |
| SCHEMBL4435873 | 0.73 | TRPA1 (0.40) | ALDH1A1TRPA1ATMSMN1; SMN2TSHR | |
| SCHEMBL1894227 | 0.72 | TRPA1 (0.38) | ALDH1A1TRPA1ATMSMN1; SMN2TSHR | |
| SCHEMBL17865460 | 0.72 | MAPT (0.42) | ALDH1A1KDM4ETRPA1ATMSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4208312-A | ACYLOXYSILANE COMPONENT TO EXTEND POT LIFE | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 1980-06-17 | — | — | US | claimed |
| EP-3039079-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DDP SPECIALTY ELECTRONIC MAT US 9 LLC (US) | 2022-05-18 | — | — | EP | disclosed |
| US-9909007-B2 | Curable silicone composition, cured product thereof, and optical semiconductor device | DOW CORNING CORPORATION (US) | 2018-03-06 | — | — | US | disclosed |
| EP-2914664-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO LTD (JP) | 2016-09-07 | — | — | EP | disclosed |
| US-20160215141-A1 | Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2016-07-28 | — | — | US | disclosed |
| EP-3039079-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | Dow Corning Corporation (US) | 2016-07-06 | — | — | EP | disclosed |
| US-9312196-B2 | Curable silicone composition, cured product thereof, and optical semiconductor | DOW CORNING TORAY CO., LTD. (JP) | 2016-04-12 | — | — | US | disclosed |
| US-20150252220-A1 | Curable Silicone Composition, And Semiconductor Sealing Material And Optical Semiconductor Device Using The Same | DOW CORNING TORAY CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |
| US-20150252221-A1 | Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor | DOW TORAY CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |
| EP-2914664-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | Dow Corning Toray Co., Ltd. (JP) | 2015-09-09 | — | — | EP | disclosed |
| EP-2730620-A1 | CURABLE SILICON COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | Dow Corning Toray Co., Ltd. (JP) | 2014-05-14 | — | — | EP | disclosed |
| WO-2014069610-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO., LTD. (JP) | 2014-05-08 | — | — | WO | disclosed |
| WO-2014046309-A1 | CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR SEALING MATERIAL AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME | DOW CORNING TORAY CO., LTD. (JP) | 2014-03-27 | — | — | WO | disclosed |
| WO-2014002919-A1 | COATING AGENT, ELECTRICAL-ELECTRONIC EQUIPMENT, AND METHOD FOR PROTECTING METAL PARTS OF ELECTRICAL-ELECTRONIC EQUIPMENT | DOW CORNING TORAY CO., LTD. (JP) | 2014-01-03 | — | — | WO | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20090061633-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-6268440-B1 | MIXING WATER BASED COMPOSITE RESINS AND POLYSILOXANES WITH CONDENSATION REACTION, DISPERSION AND DISSOLVING | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2001-07-31 | — | — | US | disclosed |