SCHEMBL707692

SCHEMBL707692

O=P(O)(O)OC(CO)OP(=O)(O)O

nearest known ligand 0.46

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
SMPD1 P17405 3/20 0.46
FDPS P14324 1/20 0.35
BLM P54132 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
PTPN1 P18031 1/20 0.32
PGK1 P00558 1/20 0.31
PGK2 P07205 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9822690 0.78 SMPD1 (0.54) SMPD1FDPSBLMTDP1PTPN1
Glycerylphosphate SCHEMBL59773 0.77 SMPD1 (0.37) SMPD1FDPSBLMTDP1PTPN1
Glycerylphosphate SCHEMBL28209454 0.74 SMPD1 (0.35) SMPD1FDPSBLMTDP1PTPN1
Glycerylphosphate SCHEMBL9391484 0.74 SMPD1 (0.35) SMPD1FDPSBLMTDP1PTPN1
Glycerylphosphate SCHEMBL27579867 0.74 SMPD1 (0.35) SMPD1FDPSBLMTDP1PTPN1
Glycerylphosphate SCHEMBL2130013 0.74 SMPD1 (0.35) SMPD1FDPSBLMTDP1PTPN1
Glycerylphosphate SCHEMBL14482182 0.74 SMPD1 (0.35) SMPD1FDPSBLMTDP1PTPN1
Glycerylphosphate SCHEMBL2487169 0.74 SMPD1 (0.35) SMPD1FDPSBLMTDP1PTPN1
Glycerylphosphate SCHEMBL28755288 0.74 SMPD1 (0.35) SMPD1FDPSBLMTDP1PTPN1
Glycerylphosphate SCHEMBL28311028 0.74 SMPD1 (0.35) SMPD1FDPSBLMTDP1PTPN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 139 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4158079-B1 GOLD PLATING BATH AND GOLD PLATED FINAL FINISH MACDERMID ENTHONE INC (US) 2026-05-27 EP claimed
US-20240158941-A1 Gold Plating Bath and Gold Plated Final Finish MACDERMID ENTHONE INC. 2024-05-16 US claimed
WO-2023050980-A1 PLATING SOLUTION FOR ELECTROPLATING GOLD ON NICKEL PLATING, METHOD FOR ELECTROPLATING GOLD ON NICKEL PLATING, AND GOLD-PLATED ITEM 深圳市联合蓝海黄金材料科技股份有限公司 2023-04-06 WO claimed
WO-2022241881-A1 CATALYST FOR DEHYDROGENATION OF ALKANES INTO OLEFINS AND PREPARATION THEREOF, AND DEHYDROGENATION METHOD 中南大学 2022-11-24 WO claimed
CN-112456809-B Composition for glass etching and etching process 蓝思科技(长沙)有限公司 2022-11-04 CN claimed
WO-2022174632-A1 CYANIDE-FREE ALKALINE COPPER PLATING ELECTROPLATING SOLUTION FOR ZINC ALLOY DIE CASTING MEMBER, PREPARATION METHOD THEREFOR, AND ELECTROPLATING METHOD 张志梁 2022-08-25 WO claimed
WO-2022105557-A1 HIGH-STRENGTH PORTLAND CEMENT SLURRY FOR ULTRA-HIGH-TEMPERATURE CEMENTING, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF 中国石油天然气集团有限公司 2022-05-27 WO claimed
CN-113198513-A Catalyst for preparing olefin by dehydrogenating alkane, preparation method and dehydrogenation method thereof 中南大学 2021-08-03 CN claimed
CN-113105879-A Composite salt-resistant stuck remover and application thereof 长江大学 2021-07-13 CN claimed
CN-112321539-A Method for epoxidizing large cycloolefin by hydrogen peroxide method 中国天辰工程有限公司 2021-02-05 CN claimed
CN-112144102-A Recovered electrolyte for LED electroplating alloy and preparation method thereof 无锡华友微电子有限公司 2020-12-29 CN claimed
CN-111423152-A Special grinding aid for improving later strength of cement 华润水泥技术研发(广西)有限公司 2020-07-17 CN claimed
EP-1465251-B1 Method for producing metal/ceramic bonded substrate DOWA METALTECH CO LTD (JP) 2019-01-23 EP claimed
US-7219826-B2 Forming a desired fillet on the peripheral portion of a metal circuit; brazing DOWA MINING CO., LTD. (JP) 2007-05-22 US claimed
US-20040262367-A1 Forming a desired fillet on the peripheral portion of a metal circuit; brazing DOWA METALTECH CO., LTD. (JP) 2004-12-30 US claimed
EP-1465251-A2 Method for producing metal/ceramic bonded substrate Dowa Mining Co., Ltd. (JP) 2004-10-06 EP claimed
US-5302531-A Mixture of complexing agent, metal compound and indicator MILES INC. (US) 1994-04-12 US claimed
EP-0551670-A1 Processes for preparing powdered detergent compositions UNILEVER N.V. (NL) 1993-07-21 EP claimed
EP-0259525-A1 Water treatment method and product Crystalclear Co. S.A. (CH) 1988-03-16 EP claimed
JP-62292714-A None JP disclosed
EP-4158079-B1 GOLD PLATING BATH AND GOLD PLATED FINAL FINISH MACDERMID ENTHONE INC (US) 2026-05-27 EP disclosed
US-12624172-B2 Method for producing wetting agent for semiconductor, containing polyvinyl alcohol composition, polishing composition containing wetting agent for semiconductor, obtained by the production method, and method for producing polishing composition FUJIMI INCORPORATED (JP) 2026-05-12 US disclosed
US-20260103621-A1 METHOD OF PRODUCING POLISHING COMPOSITION AND POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2026-04-16 US disclosed
US-20250207030-A1 POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2025-06-26 US disclosed
EP-4503097-A1 POLISHING COMPOSITION Fujimi Incorporated (JP) 2025-02-05 EP disclosed
EP-4498403-A1 POLISHING COMPOSITION Fujimi Incorporated (JP) 2025-01-29 EP disclosed
EP-4418306-A1 POLISHING COMPOSITION Fujimi Incorporated (JP) 2024-08-21 EP disclosed
US-20240158941-A1 Gold Plating Bath and Gold Plated Final Finish MACDERMID ENTHONE INC. 2024-05-16 US disclosed
US-20230331930-A1 METHOD FOR PRODUCING WETTING AGENT FOR SEMICONDUCTOR, CONTAINING POLYVINYL ALCOHOL COMPOSITION, POLISHING COMPOSITION CONTAINING WETTING AGENT FOR SEMICONDUCTOR, OBTAINED BY THE PRODUCTION METHOD, AND METHOD FOR PRODUCING POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2023-10-19 US disclosed
CN-115976600-A Aluminum alloy anodic oxidation treatment process 昆山新莱洁净应用材料股份有限公司 2023-04-18 CN disclosed
WO-2023051640-A1 CYANIDE-FREE GOLD ELECTROPLATING SOLUTION AND USE THEREOF, METHOD FOR PREPARING GOLD BUMP BY ELECTROPLATING, GOLD BUMP, AND ELECTRONIC COMPONENT 深圳市联合蓝海黄金材料科技股份有限公司 2023-04-06 WO disclosed
WO-2023050980-A1 PLATING SOLUTION FOR ELECTROPLATING GOLD ON NICKEL PLATING, METHOD FOR ELECTROPLATING GOLD ON NICKEL PLATING, AND GOLD-PLATED ITEM 深圳市联合蓝海黄金材料科技股份有限公司 2023-04-06 WO disclosed
EP-4158079-A1 GOLD PLATING BATH AND GOLD PLATED FINAL FINISH MacDermid Enthone Inc. (US) 2023-04-05 EP disclosed
CN-115785824-A Chemical mechanical polishing solution, preparation method and application thereof 北京天科合达半导体股份有限公司 2023-03-14 CN disclosed
CN-115746965-A Environment-friendly cleaning agent for ceramic filter plate and cleaning process thereof 广东麒瑞新材料科技有限公司 2023-03-07 CN disclosed
CN-113461917-B Liquid polyester titanium composite catalyst and preparation method and application thereof 珠海华润化学材料科技有限公司 2023-01-24 CN disclosed
CN-112456809-B Composition for glass etching and etching process 蓝思科技(长沙)有限公司 2022-11-04 CN disclosed
CN-115231534-A Core-shell type nano metal phosphide material and preparation method and application thereof 西北工业大学深圳研究院 2022-10-25 CN disclosed
WO-2022174632-A1 CYANIDE-FREE ALKALINE COPPER PLATING ELECTROPLATING SOLUTION FOR ZINC ALLOY DIE CASTING MEMBER, PREPARATION METHOD THEREFOR, AND ELECTROPLATING METHOD 张志梁 2022-08-25 WO disclosed
CN-114807922-A Preparation method for reducing scratches for stainless steel shell stamping part production 江苏程奥金属科技有限公司 2022-07-29 CN disclosed
CN-114759173-A Trivalent chromium ion doped modified mixed ferric sodium pyrophosphate positive electrode material, preparation and application 上海电力大学 2022-07-15 CN disclosed
CN-114695870-A Modified iron-based pyrophosphate compound cathode material, preparation method and application thereof in sodium-ion battery 上海电力大学 2022-07-01 CN disclosed
CN-114652625-A Hair dye agent, and preparation method and application thereof 浙江大学滨海产业技术研究院 2022-06-24 CN disclosed
CN-113832508-B Cyanide-free electrogilding solution, use thereof, method for producing gold bumps by electrogilding, gold bumps and electronic components 深圳市联合蓝海黄金材料科技股份有限公司 2022-06-03 CN disclosed
WO-2022105557-A1 HIGH-STRENGTH PORTLAND CEMENT SLURRY FOR ULTRA-HIGH-TEMPERATURE CEMENTING, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF 中国石油天然气集团有限公司 2022-05-27 WO disclosed
CN-112094669-B Compound oil/wax product solid remover and application thereof 中科合成油内蒙古有限公司 2022-05-24 CN disclosed
CN-114516738-A High-strength silicate cement slurry for ultra-high temperature well cementation and preparation method and application thereof 中国石油天然气集团有限公司 2022-05-20 CN disclosed
CN-114106804-B High-temperature-resistant esterification type composite scale inhibitor and preparation method thereof 胜利油田胜利化工有限责任公司 2022-05-17 CN disclosed
CN-114369345-A High-barrier full-biodegradable mulching film with fertilizer effect and preparation method thereof 万华化学(四川)有限公司 2022-04-19 CN disclosed
CN-114256459-A Fluoro-mixed ferric manganese sodium pyrophosphate binary positive electrode material, preparation method and application thereof in sodium ion battery 上海电力大学 2022-03-29 CN disclosed
CN-114106804-A High-temperature-resistant esterification type composite scale inhibitor and preparation method thereof 胜利油田胜利化工有限责任公司 2022-03-01 CN disclosed
CN-114108040-A Cyanide-free gold plating solution and gold electroforming part manufactured by cyanide-free electroplating process 周大福珠宝文化产业园(武汉)有限公司 2022-03-01 CN disclosed
CN-113198513-B Catalyst for preparing olefin by dehydrogenating alkane, preparation method and dehydrogenation method thereof 中南大学 2022-02-25 CN disclosed
CN-114057175-A Fluoride ion doped modified ferric sodium pyrophosphate used as sodium ion battery positive electrode material, and preparation method and application thereof 上海电力大学 2022-02-18 CN disclosed
CN-113930965-A Fabric sterilization composition 广州立白企业集团有限公司 2022-01-14 CN disclosed
CN-112808736-B Purification and harmless treatment method of phosphogypsum 贵州昊华工程技术有限公司 2021-12-31 CN disclosed
CN-113832508-A Cyanide-free electrogilding solution, use thereof, method for producing gold bumps by electrogilding, gold bumps and electronic components 深圳市联合蓝海黄金材料科技股份有限公司 2021-12-24 CN disclosed
WO-2021242458-A1 GOLD PLATING BATH AND GOLD PLATED FINAL FINISH MACDERMID ENTHONE INC. (US) 2021-12-02 WO disclosed
US-20210371998-A1 Gold Plating Bath and Gold Plated Final Finish MACDERMID ENTHONE INC. 2021-12-02 US disclosed
EP-3705601-B1 ELECTROLESS GOLD PLATING BATH UEMURA KOGYO KK (JP) 2021-11-03 EP disclosed
CN-113422034-A Metal ion doped modified iron-based polyanion compound cathode material and preparation method thereof 上海电力大学 2021-09-21 CN disclosed
CN-113198513-A Catalyst for preparing olefin by dehydrogenating alkane, preparation method and dehydrogenation method thereof 中南大学 2021-08-03 CN disclosed
CN-113151870-A Cyanide-free alkaline copper plating electroplating solution for zinc alloy die castings, and preparation method and electroplating method thereof 张志梁 2021-07-23 CN disclosed
CN-113041165-A Low-pH-value zero-damage plant permanent wave agent and production method and use method thereof 广州威帕化妆品有限公司 2021-06-29 CN disclosed
CN-112958079-A Catalyst for preparing peroxyacetic acid disinfectant and preparation method of disinfectant 中国天辰工程有限公司 2021-06-15 CN disclosed
CN-112825856-A Method for quickly preparing peroxyacetic acid disinfectant by using low-concentration hydrogen peroxide 中国天辰工程有限公司 2021-05-25 CN disclosed
CN-109329300-B Rust-removing and withering-preventing agent for rice seedlings 祖子蘅 2021-05-18 CN disclosed
CN-112808736-A Purification and harmless treatment method of phosphogypsum 贵州昊华工程技术有限公司 2021-05-18 CN disclosed
US-10975475-B2 Electroless gold plating bath C. UYEMURA & CO., LTD. (JP) 2021-04-13 US disclosed
CN-112456809-A Composition for glass etching and etching process 蓝思科技(长沙)有限公司 2021-03-09 CN disclosed
CN-112415869-A Compatible and environment-friendly aqueous photoresist stripping liquid applied to various metal processes and preparation method thereof 无锡高琪微电子材料科技有限公司 2021-02-26 CN disclosed
CN-112321539-A Method for epoxidizing large cycloolefin by hydrogen peroxide method 中国天辰工程有限公司 2021-02-05 CN disclosed
CN-112144102-A Recovered electrolyte for LED electroplating alloy and preparation method thereof 无锡华友微电子有限公司 2020-12-29 CN disclosed
CN-112094669-A Compound oil/wax product solid remover and application thereof 中科合成油内蒙古有限公司 2020-12-18 CN disclosed
CN-111809189-A Water-based stainless steel cleaning agent and preparation method thereof 清研高装科技(天津)有限公司 2020-10-23 CN disclosed
CN-109370795-B Oil removing agent for continuously processing polyester/ammonia and nylon/ammonia blended knitted fabric and preparation method thereof 太仓宝霓实业有限公司 2020-10-02 CN disclosed
US-20200283906-A1 ELECTROLESS GOLD PLATING BATH C. UYEMURA & CO., LTD. (JP) 2020-09-10 US disclosed
EP-3705601-A1 ELECTROLESS GOLD PLATING BATH C. Uyemura & Co., Ltd. (JP) 2020-09-09 EP disclosed
CN-111423152-A Special grinding aid for improving later strength of cement 华润水泥技术研发(广西)有限公司 2020-07-17 CN disclosed
CN-111297721-A Application of hydroxyethyl diphosphate in soap-based shower gel 广东科誉新材料有限公司 2020-06-19 CN disclosed
CN-108893747-B Plane grinding cleaning agent and preparation method thereof 苏州鸿宇工业清洗技术有限公司 2020-03-31 CN disclosed
CN-110897931-A Transparent shower gel adopting cold blending process and preparation method thereof 广东科誉新材料有限公司 2020-03-24 CN disclosed
EP-1465251-B1 Method for producing metal/ceramic bonded substrate DOWA METALTECH CO LTD (JP) 2019-01-23 EP disclosed
US-20180127638-A1 TIME RELEASED DELIVERY OF FUNCTIONAL CHEMICALS COVESTRO LLC 2018-05-10 US disclosed
CN-106629637-A Method for preparing high-stability superfine aluminum nitride via low-temperature carbothermal reduction nitriding process 河北利福光电技术有限公司 2017-05-10 CN disclosed
CN-106318482-A Vehicle fuel with lowered particulate matter emission 广西东奇能源技术有限公司 2017-01-11 CN disclosed
CN-106053461-A Stable diazo-method direct bilirubin detection kit 山东博科生物产业有限公司 2016-10-26 CN disclosed
US-20150377002-A1 ENVIRONMENTALLY FRIENDLY BASE FLUIDS AND METHODS FOR MAKING AND USING SAME FALANA OLUSEGUN M (US) 2015-12-31 US disclosed
EP-2914681-A1 NOVEL STRONTIUM CARBONATE BRIDGING MATERIALS AND METHODS FOR MAKING AND USING SAME Clearwater International, LLC (US) 2015-09-09 EP disclosed
US-9085724-B2 Environmentally friendly base fluids and methods for making and using same Lubri3ol Oilfield Chemistry LLC (US) 2015-07-21 US disclosed
US-20140323360-A1 NOVEL STRONTIUM CARBONATE BRIDGING MATERIALS AND METHODS FOR MAKING AND USING SAME CLEARWATER INTERNATIONAL, LLC (US) 2014-10-30 US disclosed
WO-2014071019-A1 NOVEL STRONTIUM CARBONATE BRIDGING MATERIALS AND METHODS FOR MAKING AND USING SAME CLEARWATER INTERNATIONAL, LLC (US) 2014-05-08 WO disclosed
EP-1619227-B1 METHOD FOR RELEASING ADHERED ARTICLE SEKISUI CHEMICAL CO LTD (JP) 2014-05-07 EP disclosed
EP-2586306-A1 Synergistic microbicidal compositions containing 1,2-benzisothiazolin-3-one (BIT) and gluconic acid Rohm and Haas Company (US) 2013-05-01 EP disclosed
EP-2586307-A1 Synergistic microbicidal compositions containing 1,2-benzisothiazolin-3-one (BIT) and capric acid Rohm and Haas Company (US) 2013-05-01 EP disclosed
EP-2586309-A1 Synergistic microbicidal compositions containing 2-methyl-4-isothiazolin-3-one (MIT) or 1,2-benzisothiazolin-3-one (BIT) and maleic acid Rohm and Haas Company (US) 2013-05-01 EP disclosed
EP-2586308-A1 Synergistic microbicidal compositions containing 2-methyl-4-isothiazolin-3-one (MIT) or 1,2-benzisothiazolin-3-one (BIT) and propionic acid Rohm and Haas Company (US) 2013-05-01 EP disclosed
EP-2586310-A1 Synergistic microbicidal compositions containing 1,2-benzisothiazolin-3-one (BIT) and decylene glycol Rohm and Haas Company (US) 2013-05-01 EP disclosed
CN-101319319-B Electroless gold plating bath, electroless gold plating method, and electronic component UYEMURA C CO LTD 2012-04-25 CN disclosed
US-20120071367-A1 ENVIRONMENTALLY FRIENDLY BASE FLUIDS AND METHODS FOR MAKING AND USING SAME CLEARWATER INTERNATIONAL, LLC (US) 2012-03-22 US disclosed
US-8138212-B2 Synergistic microbicidal compositions ROHM AND HAAS COMPANY (US) 2012-03-20 US disclosed
US-8124174-B2 Electroless gold plating method and electronic parts C. UYEMURA & CO., LTD. (JP) 2012-02-28 US disclosed
CN-101319318-B Electroless gold plating bath, electroless gold plating method and electronic parts C. UYEMURA & CO., LTD. (JP) 2012-02-22 CN disclosed
US-7988773-B2 Gold cyanide salt, complexing agent, aldehyde, amine; plating copper, nickel, palladium base metal part; prevent diffusion of cobalt, prevent oxidation of nickel, improve corrosion resistance of circuits or terminals C. UYEMURA & CO., LTD. (JP) 2011-08-02 US disclosed
US-7985285-B2 Gold cyanide salt, complexing agent, aldehyde, amine; plating copper, nickel, palladium base metal part; prevent diffusion of cobalt, prevent oxidation of nickel, improve corrosion resistance of circuits or terminals C. UYEMURA & CO., LTD. (JP) 2011-07-26 US disclosed
US-7971659-B2 Foamer/sulfur scavenger composition and methods for making and using same CLEARWATER INTERNATIONAL, LLC (US) 2011-07-05 US disclosed
US-7909959-B2 Method for releasing adhered article SEKISUI CHEMICAL CO., LTD. (JP) 2011-03-22 US disclosed
EP-2289335-A2 Synergistic microbicidal compositions containing 2-methyl-4-isothiazolin-3-one (MIT) or 1,2-benzisothiazolin-3-one (BIT) Rohm and Haas Company (US) 2011-03-02 EP disclosed
US-20110028525-A1 Synergistic Microbicidal Compositions DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC 2011-02-03 US disclosed
CN-101319318-A Electroless gold plating bath, electroless gold plating method and electronic parts UYEMURA C CO LTD (JP) 2008-12-10 CN disclosed
CN-101319319-A Electroless gold plating bath, electroless gold plating method and electronic parts UYEMURA C CO LTD (JP) 2008-12-10 CN disclosed
US-20080277140-A1 ELECTROLESS GOLD PLATING METHOD AND ELECTRONIC PARTS C. UYEMURA & CO., LTD. (JP) 2008-11-13 US disclosed
US-20080153135-A1 Methods and apparatus for conducting amplification reactions on high density hydrophilic patterned microplates APPLIED BIOSYSTEMS, INC. 2008-06-26 US disclosed
US-20080138507-A1 Electroless gold plating bath, electroless gold plating method and electronic parts C. UYEMURA & CO., LTD. 2008-06-12 US disclosed
US-20080138506-A1 Electroless gold plating bath, electroless gold plating method and electronic parts C. UYEMURA & CO., LTD. 2008-06-12 US disclosed
US-7219826-B2 Forming a desired fillet on the peripheral portion of a metal circuit; brazing DOWA MINING CO., LTD. (JP) 2007-05-22 US disclosed
US-7074752-B2 Fabric care compositions THE PROCTER & GAMBLE COMPANY (US) 2006-07-11 US disclosed
US-20060144515-A1 Method for releasing adhered article SEKISUI CHEMICAL CO., LTD. (JP) 2006-07-06 US disclosed
US-7026275-B2 Method of reducing photoelectric device leakage current in conjugated polymer and conjugated polymer composition INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2006-04-11 US disclosed
EP-1619227-A1 METHOD FOR RELEASING ADHERED ARTICLE SEKISUI CHEMICAL CO., LTD. (JP) 2006-01-25 EP disclosed
US-6861401-B2 Fabric care compositions THE PROCTER & GAMBLE COMPANY (US) 2005-03-01 US disclosed
US-20040262367-A1 Forming a desired fillet on the peripheral portion of a metal circuit; brazing DOWA METALTECH CO., LTD. (JP) 2004-12-30 US disclosed
US-20040250849-A1 Method of reducing photoelectric device leakage current in conjugated polymer and conjugated polymer composition INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 2004-12-16 US disclosed
US-6824704-B2 ELIMINATING REFRIGERATION STORAGE; BLEACHING WITH AQUEOUS OXIDIZER SOLUTION CONTAINING POLYACRYLIC ACID THICKENING AGENT AND CHELATING AGENT THE GILLETTE COMPANY 2004-11-30 US disclosed
EP-1465251-A2 Method for producing metal/ceramic bonded substrate Dowa Mining Co., Ltd. (JP) 2004-10-06 EP disclosed
US-20040079920-A1 Stable tooth whitening gels containing high percentages of hydrogen peroxide RANIR, LLC 2004-04-29 US disclosed
US-20030170592-A1 Stable tooth whitening gels containing high percentages of hydrogen peroxide MCNEIL-PPC, INC. 2003-09-11 US disclosed
US-6555020-B1 Polyacrylic acid thickening agent; aminocarboxylic acid/salt stabilizing agent. DEN-MAT CORPORATION 2003-04-29 US disclosed
US-20020137653-A1 A bleach scavenging system comprising acyclic mercaptans, sulfides and/or disulfides and a Group IA and/or IIA metal metabisulfite, sulfite, bisulfite or thiosulfite; laundering; colorfastness; allowing polyamines to chelant heavy metals THE PROCTER & GAMBLE COMPANY (US) 2002-09-26 US disclosed
EP-1214390-A1 FABRIC CARE COMPOSITIONS THE PROCTER & GAMBLE COMPANY (US) 2002-06-19 EP disclosed
WO-2001021746-A1 FABRIC CARE COMPOSITIONS THE PROCTER & GAMBLE COMPANY (US) 2001-03-29 WO disclosed
US-5302531-A Mixture of complexing agent, metal compound and indicator MILES INC. (US) 1994-04-12 US disclosed
US-5096595-A Containing at least one oxidized tert amine group W. R. GRACE & CO.-CONN. (US) 1992-03-17 US disclosed
EP-0291588-B1 SIZING AGENT KABUSHIKI KAISHA CHIYODA KAGAKU KENKYUSHO (JP) 1991-09-04 EP disclosed
US-4826570-A PARTIAL ESTER OF ALKENYL SUCCINIC ACID, PAPERMAKING KABUSHIKI KAISHA CHIYODA KAGAKU KENKYUSHO (JP) 1989-05-02 US disclosed
EP-0291588-A1 Sizing agent KABUSHIKI KAISHA CHIYODA KAGAKU KENKYUSHO (JP) 1988-11-23 EP disclosed
JP-S62292714-A AGENT FOR CLEANING PROSTHETIC MATERIAL FOR ORAL CAVITY AND FOR DISSOLVING DENTAL CALCULUS G C DENTAL IND CORP 1987-12-19 JP disclosed
US-4240921-A ALKALI METAL HYDROXIDE, NONIONIC SURFACTANTS AND ALKYL GLUCOSIDE OR GLYCIDYL ETHER STAUFFER CHEMICAL COMPANY (US) 1980-12-23 US disclosed
US-4147652-A Liquid cleaning concentrate STAUFFER CHEMICAL COMPANY (US) 1979-04-03 US disclosed
US-4147652-A Liquid cleaning concentrate STAUFFER CHEMICAL COMPANY (US) 1979-04-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12624172-B2 Method for producing wetting agent for semiconductor, containing polyvinyl alcohol composition, polishing composition containing wetting agent for semiconductor, obtained by the production method, and method for producing polishing composition VCL, SMARCA1, SMARCD1 SMPD1 3079/4885FDPS 3662/4885BLM 864/4885
US-20180127638-A1 TIME RELEASED DELIVERY OF FUNCTIONAL CHEMICALS LIPA, LIPC, CES2 SMPD1 1041/4885FDPS 709/4885BLM 3230/4885
US-20260103621-A1 METHOD OF PRODUCING POLISHING COMPOSITION AND POLISHING COMPOSITION C1S, LMNA, CHIT1 SMPD1 709/4885FDPS 4183/4885BLM 7/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.