Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA4 | P22748 | 1/20 | 0.42 |
| ▸ | LTA4H | P09960 | 5/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.33 |
| ▸ | KCNA3 | P22001 | 1/20 | 0.33 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
| ▸ | CA5A | P35218 | 1/20 | 0.32 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.32 |
| ▸ | HTR1B | P28222 | 2/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | HTR1D | P28221 | 1/20 | 0.31 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.31 |
| ▸ | BAX | Q07812 | 1/20 | 0.31 |
| ▸ | MAOA | P21397 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15274214 | 0.87 | ACHE (0.40) | CA4LTA4HTSHRLMNA | |
| SCHEMBL12191026 | 0.82 | ACHE (0.44) | TSHRMAPK1LMNA | |
| SCHEMBL310041 | 0.76 | CA4 (0.48) | CA4LTA4HTSHRKCNA3CA5A | |
| SCHEMBL1147891 | 0.76 | CA4 (0.35) | CA4LTA4HTSHRTRPA1MAPK1 | |
| SCHEMBL2354326 | 0.76 | CA4 (0.48) | CA4LTA4HTSHRKCNA3CA5A | |
| SCHEMBL17328006 | 0.76 | CA4 (0.35) | CA4LTA4HTSHRTRPA1MAPK1 | |
| SCHEMBL704521 | 0.75 | RELA (0.38) | CA4LTA4HTSHRKCNH2 | |
| SCHEMBL5400858 | 0.74 | KCNA3 (0.50) | LTA4HKCNA3HTR1BHTR1D | |
| SCHEMBL1930199 | 0.74 | LTA4H (0.43) | CA4LTA4HTSHRKCNH2KCNA3 | |
| SCHEMBL6916437 | 0.74 | LTA4H (0.43) | CA4LTA4HTSHRKCNH2KCNA3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3507104-B1 | PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BYIN-SITU | BRIDGESTONE CORP (JP) | 2024-03-27 | — | — | EP | disclosed |
| US-20230357511-A1 | PRODUCTION METHOD FOR POLYSILOXANE, COMPOSITION INCLUDING POLYSILOXANE, AND MOLDED BODY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-11-09 | — | — | US | disclosed |
| US-20230331925-A1 | THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-10-19 | — | — | US | disclosed |
| WO-2023171578-A1 | THERMOPLASTIC RESIN, METHOD FOR PRODUCING SAME, THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY | 三菱瓦斯化学株式会社 | 2023-09-14 | — | — | WO | disclosed |
| EP-4219590-A1 | PRODUCTION METHOD FOR POLYSILOXANE, COMPOSITION INCLUDING POLYSILOXANE, AND MOLDED BODY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-08-02 | — | — | EP | disclosed |
| EP-4219589-A1 | THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-08-02 | — | — | EP | disclosed |
| CN-115926169-A | Method for producing polycarbonate copolymer and polysiloxane compound, polycarbonate copolymer, polysiloxane compound, composition, and molded article | 三菱瓦斯化学株式会社 | 2023-04-07 | — | — | CN | disclosed |
| CN-113614144-B | Method for producing polycarbonate copolymer and polysiloxane compound, polycarbonate copolymer, polysiloxane compound, composition, and molded article | 三菱瓦斯化学株式会社 | 2023-03-28 | — | — | CN | disclosed |
| WO-2022065331-A1 | PRODUCTION METHOD FOR POLYSILOXANE, COMPOSITION INCLUDING POLYSILOXANE, AND MOLDED BODY | 三菱瓦斯化学株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022065329-A1 | THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN | 三菱瓦斯化学株式会社 | 2022-03-31 | — | — | WO | disclosed |
| CN-113614144-A | Method for producing polycarbonate copolymer and polysiloxane compound, polycarbonate copolymer, polysiloxane compound, composition, and molded article | 三菱瓦斯化学株式会社 | 2021-11-05 | — | — | CN | disclosed |
| US-10975178-B2 | Production of cis-1,4-polydienes with multiple silane functional groups prepared by in-situ hydrosilylation of polymer cement | BRIDGESTONE CORPORATION (JP) | 2021-04-13 | — | — | US | disclosed |
| WO-2020196343-A1 | METHODS FOR PRODUCING POLYCARBONATE COPOLYMER AND POLYSILOXANE COMPOUND, POLYCARBONATE COPOLYMER, POLYSILOXANE COMPOUND, COMPOSITION AND MOLDED BODY | 三菱瓦斯化学株式会社 | 2020-10-01 | — | — | WO | disclosed |
| US-20190211120-A1 | Production Of Cis-1,4-Polydienes With Multiple Silane Functional Groups Prepared By In-Situ Hydrosilylation Of Polymer Cement | BRIDGESTONE CORPORATION (JP) | 2019-07-11 | — | — | US | disclosed |
| EP-3507104-A1 | PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BYIN-SITU | Bridgestone Corporation (JP) | 2019-07-10 | — | — | EP | disclosed |
| WO-2018045291-A1 | PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BY IN-SITU HYDROSILYLATION OF POLYMER CEMENT | BRIDGESTONE CORPORATION (JP) | 2018-03-08 | — | — | WO | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |