Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.33 |
| ▸ | TSHR | P16473 | 3/20 | 0.33 |
| ▸ | TP53 | P04637 | 2/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.33 |
| ▸ | CA2 | P00918 | 1/20 | 0.33 |
| ▸ | GLA | P06280 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1856455 | 0.92 | HRH3 (0.31) | ALDH1A1GLA | |
| SCHEMBL5583734 | 0.89 | ALDH1A1 (0.32) | ALDH1A1CYP3A4TSHRTP53GLA | |
| SCHEMBL20851113 | 0.84 | ALDH1A1 (0.42) | ALDH1A1CYP3A4TSHRTP53TDP1 | |
| SCHEMBL6760179 | 0.83 | — | — | |
| SCHEMBL4448834 | 0.81 | PTGS1 (0.33) | ALDH1A1GLA | |
| SCHEMBL4448832 | 0.81 | PTGS1 (0.33) | ALDH1A1GLA | |
| SCHEMBL17164006 | 0.77 | ALDH1A1 (0.46) | ALDH1A1CYP3A4TSHRTP53TDP1 | |
| SCHEMBL9108436 | 0.77 | ALDH1A1 (0.31) | ALDH1A1GLA | |
| Ammonia Solution, Strong SCHEMBL22558012 | 0.76 | ALDH1A1 (0.44) | ALDH1A1CYP3A4TSHRTP53TDP1 | |
| SCHEMBL23094088 | 0.74 | CYP3A4 (0.32) | ALDH1A1CYP3A4TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4703449-A1 | THERMALLY CONDUCTIVE COMPOSITION, TWO-COMPONENT CURABLE THERMALLY CONDUCTIVE MATERIAL, SUPPLY FORM OF TWO-COMPONENT CURABLE THERMALLY CONDUCTIVE MATERIAL, AND BATTERY MODULE | Sekisui Chemical Co., Ltd. (JP) | 2026-03-04 | — | — | EP | disclosed |
| EP-4660243-A1 | CURABLE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660241-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| WO-2024162414-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | 積水化学工業株式会社 | 2024-08-08 | — | — | WO | disclosed |
| US-11935673-B2 | Varistor forming paste, cured product thereof, and varistor | NAMICS CORPORATION (JP) | 2024-03-19 | — | — | US | disclosed |
| US-11866635-B2 | Thermosetting material and cured product | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-01-09 | — | — | US | disclosed |
| US-11827766-B2 | Resin material and laminate | SEKISUI CHEMICAL CO., LTD. (JP) | 2023-11-28 | — | — | US | disclosed |
| US-20230013549-A1 | VARISTOR FORMING PASTE, CURED PRODUCT THEREOF, AND VARISTOR | NAMICS CORPORATION (JP) | 2023-01-19 | — | — | US | disclosed |
| CN-113733688-A | Laminate | 积水化学工业株式会社 | 2021-12-03 | — | — | CN | disclosed |
| US-11168216-B2 | Resin material and laminate | SEKISUI CHEMICAL CO., LTD. (JP) | 2021-11-09 | — | — | US | disclosed |
| WO-2010143701-A1 | CONDUCTIVE COMPOSITION, TRANSPARENT CONDUCTIVE FILM, DISPLAY ELEMENT AND INTEGRATED SOLAR BATTERY | FUJIFILM CORPORATION (JP) | 2010-12-16 | — | — | WO | disclosed |
| US-20100297453-A1 | INSULATING SHEET AND MULTILAYER STRUCTURE | SEKISUI CHEMICAL CO., LTD. (JP) | 2010-11-25 | — | — | US | disclosed |
| US-20100256252-A1 | PIGMENT DISPERSION COMPOSITION, CURABLE COLOR COMPOSITION, COLOR FILTER AND METHOD FOR PRODUCING THE SAME | FUJIFILM CORPORATION (JP) | 2010-10-07 | — | — | US | disclosed |
| EP-2218756-A1 | PIGMENT DISPERSION COMPOSITION, CURABLE COLOR COMPOSITION, COLOR FILTER AND METHOD FOR PRODUCING THE SAME | FUJIFILM Corporation (JP) | 2010-08-18 | — | — | EP | disclosed |
| US-20100081070-A1 | COLORED CURABLE COMPOSITION, COLOR FILTER AND PRODUCTION METHOD THEREOF, AND SOLID-STATE IMAGING DEVICE | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |
| EP-2168989-A1 | Colored curable composition, color filter and production method thereof, and solid-state imaging device | Fujifilm Corporation (JP) | 2010-03-31 | — | — | EP | disclosed |
| US-20100039028-A1 | DISPLAY DEVICE | FUJIFILM CORPORATION (JP) | 2010-02-18 | — | — | US | disclosed |
| US-20090096114-A1 | Epoxy Resin Composition and Semiconductor Device | KOTANI TAKAHIRO | 2009-04-16 | — | — | US | disclosed |
| US-20080268354-A1 | COLORED PHOTOPOLYMERIZABLE COMPOSITION, COLOR FILTER USING THE SAME AND METHOD OF PRODUCING COLOR FILTER | FUJIFILM CORPORATION (JP) | 2008-10-30 | — | — | US | disclosed |
| US-20060157872-A1 | Epoxy resin composition and semiconductor device | KOTANI TAKAHIRO | 2006-07-20 | — | — | US | disclosed |