SCHEMBL4448834

SCHEMBL4448834

Cc1cc(C=Cc2cc(C)c(CC3CO3)c(C)c2)cc(C)c1CC1CO1

nearest known ligand 0.33

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 10/20 0.33
PTGS2 P35354 10/20 0.33
ALOX5 P09917 10/20 0.33
TTR P02766 1/20 0.33
TUBB1 Q9H4B7 1/20 0.32
ALDH1A1 P00352 1/20 0.31
GLA P06280 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4448832 1.00 PTGS1 (0.33) PTGS1PTGS2ALOX5TTRTUBB1
SCHEMBL708659 0.81 ALDH1A1 (0.33) ALDH1A1GLA
SCHEMBL4446564 0.80 ALOX5 (0.38) PTGS1PTGS2ALOX5ALDH1A1
SCHEMBL1856455 0.74 HRH3 (0.31) ALDH1A1GLA
SCHEMBL17164006 0.72 ALDH1A1 (0.46) ALDH1A1GLA
SCHEMBL9108436 0.72 ALDH1A1 (0.31) ALDH1A1GLA
SCHEMBL5583734 0.72 ALDH1A1 (0.32) ALDH1A1GLA
SCHEMBL6235094 0.72 ALDH1A1 (0.46) PTGS1PTGS2TUBB1ALDH1A1GLA
SCHEMBL6235098 0.72 ALDH1A1 (0.46) PTGS1PTGS2TUBB1ALDH1A1GLA
Ammonia Solution, Strong SCHEMBL22558012 0.71 ALDH1A1 (0.44) ALDH1A1GLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8921461-B2 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE CO., LTD (JP) 2014-12-30 US disclosed
US-8697803-B2 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2014-04-15 US disclosed
US-8519067-B2 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-08-27 US disclosed
US-20130134610-A1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2013-05-30 US disclosed
US-20130119564-A1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2013-05-16 US disclosed
US-8324326-B2 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-12-04 US disclosed
US-20090096114-A1 Epoxy Resin Composition and Semiconductor Device KOTANI TAKAHIRO 2009-04-16 US disclosed