Known targets — ChEMBL curated mechanism
AGTR1DHFRGABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTNR3C2PBP2XPTGS1PTGS2VKORC1blablaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAftsImrcAmrcBmrdApbp1apbp1bpbp2apbp2bpbp3polthyA
The experimentally established mechanism targets of Sulfurous Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Sulfurous Acid SCHEMBL15474479 | 1.00 | — | — | |
| Sulfurous Acid SCHEMBL83300 | 0.94 | CA1 (0.30) | — | |
| Sulfurous Acid SCHEMBL42806 | 0.94 | — | — | |
| Sulfurous Acid SCHEMBL12273732 | 0.94 | CA1 (0.30) | — | |
| Sulfurous Acid SCHEMBL531349 | 0.88 | — | — | |
| Sulfurous Acid SCHEMBL710110 | 0.88 | — | — | |
| Sulfurous Acid SCHEMBL33389 | 0.88 | — | — | |
| Sulfurous Acid SCHEMBL11413366 | 0.88 | — | — | |
| Sulfurous Acid SCHEMBL11050919 | 0.88 | — | — | |
| Sulfurous Acid SCHEMBL916642 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 276 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119392325-B | Cyanide-free gold plating solution for plating gold on micro blind holes and electroplating method | 深圳创智芯联科技股份有限公司 | 2025-04-01 | — | — | CN | claimed |
| CN-119392325-A | Cyanide-free gold plating solution for plating gold on micro blind holes and electroplating method | 深圳创智芯联科技股份有限公司 | 2025-02-07 | — | — | CN | claimed |
| CN-119265555-A | Chemical reduction gold plating solution | 生益电子股份有限公司 | 2025-01-07 | — | — | CN | claimed |
| CN-115710701-B | Electroless gold plating solution and application | 广东东硕科技有限公司 | 2024-12-10 | — | — | CN | claimed |
| CN-118854271-A | Cyanide-free gold plating solution and preparation method and application thereof | 生益电子股份有限公司 | 2024-10-29 | — | — | CN | claimed |
| CN-118629687-A | Back ion beam back etching method for X-ray zone plate to pass through electroplated metal layer | 湖南大学 | 2024-09-10 | — | — | CN | claimed |
| CN-118600498-A | Cyanide-free electroplating solution capable of electroplating soft gold and hard gold | 紫金矿业集团股份有限公司 | 2024-09-06 | — | — | CN | claimed |
| US-20240271306-A1 | HIGH-SPEED PURE GOLD ELECTROFORMING/ELECTROPLATING BATH | P & S, GALVASOLS (IN) | 2024-08-15 | — | — | US | claimed |
| CN-118256968-B | Cyanide-free gold electroplating solution and application thereof | 深圳创智芯联科技股份有限公司 | 2024-07-23 | — | — | CN | claimed |
| CN-118345467-A | Cyanide-free gold plating solution and gold plating method | 光华科学技术研究院(广东)有限公司 | 2024-07-16 | — | — | CN | claimed |
| CN-110184631-B | Cyanide-free gold plating electroplating solution and preparation method and electroplating process thereof | 广州达志新材料科技有限公司 | 2021-05-04 | — | — | CN | claimed |
| CN-111766654-A | Gold grating for realizing ultrahigh extinction ratio coefficient and preparation method thereof | 复旦大学 | 2020-10-13 | — | — | CN | claimed |
| CN-111440101-A | Preparation method of cysteine aurous acid solid | 厦门大学 | 2020-07-24 | — | — | CN | claimed |
| CN-110970147-A | High-resolution hard X-ray tungsten/gold Fresnel zone plate and preparation method thereof | 复旦大学 | 2020-04-07 | — | — | CN | claimed |
| US-20200095685-A1 | SUBSTITUTION-TYPE ELECTROLESS GOLD PLATING SOLUTION CONTAINING PURINE OR PYRIMIDINE-BASED COMPOUND HAVING CARBONYL OXYGEN AND SUBSTITUTION-TYPE ELECTROLESS GOLD PLATING METHOD USING THE SAME | MK CHEM & TECH CO., LTD (KR) | 2020-03-26 | — | — | US | claimed |
| CN-109881223-B | Cyanide-free gold plating solution and preparation method and application thereof | 深圳市联合蓝海科技开发有限公司 | 2020-02-14 | — | — | CN | claimed |
| EP-0618308-B1 | Electroless gold plating bath | UYEMURA C & CO LTD (JP) | 1998-06-17 | — | — | EP | claimed |
| US-4435253-A | CARBOXYLIC ACID ADDED TO MAINTAIN HARDNESS OF DEPOSIT | OMI INTERNATIONAL CORPORATION (US) | 1984-03-06 | — | — | US | claimed |
| US-4366035-A | Electrodeposition of gold alloys | ENGELHARD CORPORATION (US) | 1982-12-28 | — | — | US | claimed |
| US-3966880-A | Method for producing alkali metal gold sulfite | AMERICAN CHEMICAL & REFINING COMPANY INC. (US) | 1976-06-29 | — | — | US | claimed |