SCHEMBL7105773

SCHEMBL7105773

Cc1ccc(N2CCN(c3ccc(C)cc3)CCN(c3ccc(C)cc3)CCN(c3ccc(C)cc3)CC2)cc1

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ADRB1 P08588 1/20 0.70
▸ KMT2A Q03164 2/20 0.61
▸ MEN1 O00255 1/20 0.61
▸ AKR1C3 P42330 1/20 0.57
▸ MAPT P10636 7/20 0.55
▸ NPSR1 Q6W5P4 1/20 0.55
▸ LMNA P02545 2/20 0.52
▸ DHFR P00374 1/20 0.52
▸ ALDH1A1 P00352 2/20 0.50
▸ HTT P42858 2/20 0.50
▸ NPC1 O15118 2/20 0.50
▸ RAB9A P51151 2/20 0.50
▸ USP2 O75604 1/20 0.50
▸ POLB P06746 1/20 0.50
▸ HPGD P15428 1/20 0.50
▸ ALOX15 P16050 1/20 0.50
▸ HSD17B10 Q99714 1/20 0.50
▸ TDP1 Q9NUW8 1/20 0.50
▸ L3MBTL1 Q9Y468 1/20 0.50
▸ KDM4E B2RXH2 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10063748 1.00 ADRB1 (0.70) ADRB1KMT2AMEN1AKR1C3MAPT
SCHEMBL3414344 1.00 ADRB1 (0.70) ADRB1KMT2AMEN1AKR1C3MAPT
SCHEMBL81814 0.90 MAPT (0.65) ADRB1KMT2AMEN1AKR1C3MAPT
SCHEMBL16800666 0.90 ADRB1 (0.59) ADRB1KMT2AMEN1AKR1C3MAPT
SCHEMBL171804 0.90 MAPT (0.62) ADRB1KMT2AMEN1MAPTNPSR1
SCHEMBL15489560 0.90 MAPT (0.65) ADRB1KMT2AMEN1AKR1C3MAPT
SCHEMBL327765 0.89 ADRB1 (0.64) ADRB1KMT2AMEN1AKR1C3MAPT
SCHEMBL18118476 0.89 ADRB1 (0.64) ADRB1KMT2AMEN1AKR1C3MAPT
SCHEMBL818462 0.89 ADRB1 (0.58) ADRB1KMT2AMEN1AKR1C3MAPT
SCHEMBL25160622 0.88 ALDH1A1 (0.59) ADRB1KMT2AMEN1AKR1C3MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1308540-A1 Plating bath and method for depositing a metal layer on a substrate Shipley Co. L.L.C. (US) 2003-05-07 — — EP claimed
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