SCHEMBL7112583

SCHEMBL7112583

O=C(OCC/C=C/c1ccccc1)OCC/C=C/c1ccccc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 2/20 0.53
PAM P19021 1/20 0.53
AKR1B10 O60218 1/20 0.46
AKR1B1 P15121 1/20 0.46
PPARA Q07869 2/20 0.45
PPARD Q03181 1/20 0.45
LMNA P02545 2/20 0.45
MAOB P27338 1/20 0.45
IDO1 P14902 2/20 0.44
HDAC3 O15379 2/20 0.44
HDAC4 P56524 2/20 0.44
HDAC1 Q13547 2/20 0.44
HDAC7 Q8WUI4 2/20 0.44
HDAC2 Q92769 2/20 0.44
HDAC10 Q969S8 2/20 0.44
HDAC11 Q96DB2 2/20 0.44
HDAC8 Q9BY41 2/20 0.44
HDAC6 Q9UBN7 2/20 0.44
HDAC9 Q9UKV0 2/20 0.44
HDAC5 Q9UQL6 2/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9595722 0.89 TDP1 (0.55) NAAAPAMPPARAPPARDHDAC3
SCHEMBL7112586 0.89 NAAA (0.53) NAAAPAMAKR1B10AKR1B1PPARA
SCHEMBL8427382 0.86 AKR1B10 (0.59) NAAAPAMAKR1B10AKR1B1LMNA
SCHEMBL24450098 0.86 NAAA (0.51) NAAAPAMAKR1B10AKR1B1PPARA
SCHEMBL18426756 0.86 NAAA (0.51) NAAAPAMAKR1B10AKR1B1PPARA
SCHEMBL27981236 0.84 TDP1 (0.58) NAAAPAMLMNAMAOBPLIN1
SCHEMBL29021601 0.84 TDP1 (0.58) NAAAPAMLMNAMAOBPLIN1
SCHEMBL138625 0.83 THRB (0.55) NAAAPAMAKR1B10AKR1B1PPARA
SCHEMBL29102005 0.82 GRIK1 (0.43) NAAALMNAMAOBALDH1A1CYP1A2
SCHEMBL15539566 0.82 NAAA (0.48) NAAAPAMAKR1B10AKR1B1PPARA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0794218-B1 Polycarbonate resin composition stabilized against radiation MITSUBISHI ENG PLASTICS CORP (JP) 2003-10-15 EP disclosed
US-6040367-A EXCELLENT RESISTANCE TO AN IONIZING RADIATION, IN WHICH HETEROCYCLIC COMPOUND CONTAINING OXYMETHYLENE UNITS MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2000-03-21 US disclosed
US-5948838-A 0.01 TO 5 PARTS BY WEIGHT OF A COMPOUND CONTAINING OXYMETHYLENE UNIT MITSUBISHI ENGINEERING-PLASTICS CORP. (JP) 1999-09-07 US disclosed
EP-0794218-A2 Polycarbonate resin composition stabilized against radiation MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 1997-09-10 EP disclosed