SCHEMBL711282

SCHEMBL711282

CC(C)[SiH2]OCc1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.46
IDO1 P14902 1/20 0.43
AGXT P21549 1/20 0.41
ALDH1A1 P00352 2/20 0.41
TAAR1 Q96RJ0 4/20 0.40
SLC6A2 P23975 2/20 0.40
SIGMAR1 Q99720 2/20 0.40
MAOA P21397 1/20 0.40
SLC6A4 P31645 1/20 0.40
SLC6A3 Q01959 1/20 0.40
CA1 P00915 1/20 0.40
CA2 P00918 1/20 0.40
CA7 P43166 1/20 0.40
CA9 Q16790 1/20 0.40
CYP2A6 P11509 1/20 0.40
ADORA2A P29274 1/20 0.40
ADORA1 P30542 1/20 0.40
MAPK1 P28482 2/20 0.40
LMNA P02545 1/20 0.40
HPGD P15428 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1313961 0.83 TSHR (0.43) TSHRIDO1AGXTALDH1A1TAAR1
SCHEMBL705406 0.79 TDP1 (0.41) IDO1ALDH1A1SIGMAR1CA1CA2
SCHEMBL1315064 0.79 TRPA1 (0.41) TSHRIDO1AGXTALDH1A1MAPK1
SCHEMBL10624945 0.76 TSHR (0.40) TSHRIDO1AGXTALDH1A1MAPK1
SCHEMBL715341 0.76 IDO1 (0.50) IDO1SIGMAR1SLC6A3MAPK1LMNA
SCHEMBL707197 0.75 IDO1 (0.44) IDO1SIGMAR1MAOAMAPTTDP1
SCHEMBL710880 0.75 TSHR (0.52) TSHRIDO1AGXTALDH1A1SLC6A2
SCHEMBL18297943 0.74 TSHR (0.57) TSHRIDO1AGXTALDH1A1SLC6A2
SCHEMBL28656460 0.74 TDP1 (0.37) IDO1ALDH1A1SIGMAR1CA1CA2
SCHEMBL1317641 0.74 ESR1 (0.41) TSHRIDO1AGXTALDH1A1SLC6A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109641482-B Preparation of cis-1, 4-polydienes having multiple silane functional groups prepared by in situ hydrosilylation of polymer glues 株式会社普利司通 2021-11-05 CN disclosed
CN-106029677-B A kind of manufacturing method of silanol compound, composition and silanol compound 国立研究开发法人产业技术综合研究所 2019-08-06 CN disclosed
CN-109438633-A A kind of organosilicon toughener and its synthetic method with anti-drop effect 广东优科艾迪高分子材料有限公司 2019-03-08 CN disclosed
CN-109337025-A A kind of anti-dripping agent and its synthetic method with toughening effect 广东优科艾迪高分子材料有限公司 2019-02-15 CN disclosed
CN-109320772-A A kind of anti-dripping agent and preparation method thereof containing organosilicon and inorganic silicon 广东优科艾迪高分子材料有限公司 2019-02-12 CN disclosed
CN-109320937-A A kind of organic silicon fibre retardant and preparation method thereof based on poroid inorganic matter 铨盛(云浮)新型聚合物有限公司 2019-02-12 CN disclosed
CN-109320674-A A kind of anti-dripping agent and preparation method thereof containing PTFE and organosilicon 广东优科艾迪高分子材料有限公司 2019-02-12 CN disclosed
CN-109306169-A A kind of hydridization organic matter and the organic silicon fibre retardant of nano silica and preparation method thereof 铨盛(云浮)新型聚合物有限公司 2019-02-05 CN disclosed
CN-109293856-A A kind of the organosilicon toughener and its synthetic method of polymer overmold nano-inorganic substance 铨盛聚碳科技股份有限公司 2019-02-01 CN disclosed
CN-109293853-A A kind of organic silicon fibre retardant and preparation method thereof containing epoxy group 铨盛聚碳科技股份有限公司 2019-02-01 CN disclosed
CN-109233160-A A kind of organic silicon fibre retardant and preparation method thereof containing PTFE and nano silica 铨盛聚碳科技股份有限公司 2019-01-18 CN disclosed
CN-106029677-A Acid, solvent, and thermal resistant metal-organic frameworks 国立研究开发法人产业技术综合研究所 2016-10-12 CN disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed