SCHEMBL711924

SCHEMBL711924

Nc1ccc(Oc2ccc(N)cc2C(=O)O)c(C(=O)O)c1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 7/20 0.59
ALDH1A1 P00352 5/20 0.59
KMT2A Q03164 4/20 0.59
MAPT P10636 3/20 0.59
MEN1 O00255 3/20 0.59
TDP1 Q9NUW8 3/20 0.59
POLB P06746 3/20 0.59
HPGD P15428 3/20 0.59
THRB P10828 2/20 0.59
RECQL P46063 2/20 0.59
CYP3A4 P08684 2/20 0.59
MCL1 Q07820 2/20 0.59
USP2 O75604 1/20 0.59
PKM P14618 1/20 0.59
APEX1 P27695 1/20 0.59
BLM P54132 1/20 0.59
TNF P01375 1/20 0.59
HSPD1 P10809 1/20 0.59
CYP2C9 P11712 1/20 0.59
ALOX15 P16050 1/20 0.59

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28036174 0.93 HTT (0.54) KDM4EALDH1A1KMT2AMAPTMEN1
SCHEMBL28310121 0.91 KMT2A (0.59) KDM4EALDH1A1KMT2AMAPTMEN1
SCHEMBL30024982 0.89 ALDH1A1 (0.52) KDM4EALDH1A1KMT2AMAPTMEN1
SCHEMBL4759903 0.89 ALDH1A1 (0.52) KDM4EALDH1A1KMT2AMAPTMEN1
SCHEMBL23121425 0.88 MAPT (0.51) KDM4EALDH1A1KMT2AMAPTMEN1
SCHEMBL2748501 0.87 CTNNB1 (0.54) KDM4EALDH1A1KMT2AMAPTMEN1
SCHEMBL20945312 0.86 KDM4E (0.65) KDM4EALDH1A1KMT2AMAPTMEN1
SCHEMBL98371 0.84 ALDH1A1 (0.73) KDM4EALDH1A1KMT2AMAPTMEN1
SCHEMBL28409341 0.84 NCOA1 (0.54) KDM4EALDH1A1KMT2AMAPTMEN1
SCHEMBL8901023 0.83 PNLIP (0.52) KDM4EALDH1A1KMT2AMAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023153390-A1 PHOTOSENSITIVE RESIN SHEET, CURED FILM, AND MULTILAYER WIRING SUBSTRATE 東レ株式会社 2023-08-17 WO disclosed
US-20220155684-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT TORAY INDUSTRIES, INC. (JP) 2022-05-19 US disclosed
EP-3933906-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT Toray Industries, Inc. (JP) 2022-01-05 EP disclosed
WO-2021029243-A1 COLORED RESIN COMPOSITION, CURED PRODUCT AND LAMINATE 太陽ホールディングス株式会社 2021-02-18 WO disclosed
WO-2021028960-A1 COLORED RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE 太陽ホールディングス株式会社 2021-02-18 WO disclosed
WO-2020196139-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT 東レ株式会社 2020-10-01 WO disclosed
US-10511025-B2 Electrode manufacturing method UBE INDUSTRIES, LTD. (JP) 2019-12-17 US disclosed
EP-2204484-B1 POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, HEAT INSULATION MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT-RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT-RESISTANT BAG FILTER KANEKA CORP (JP) 2019-05-15 EP disclosed
US-10292262-B2 Reinforcing-plate-integrated flexible printed circuit board KANEKA CORPORATION (JP) 2019-05-14 US disclosed
US-10045433-B2 Conductive-layer-integrated flexible printed circuit board KANEKA CORPORATION (JP) 2018-08-07 US disclosed
US-20040048978-A1 Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board KANEKA CORPORATION (JP) 2004-03-11 US disclosed
US-20040023043-A1 Dicing tape UBE INDUSTRIES, LTD., A JAPANESE CORPORATION (JP) 2004-02-05 US disclosed
US-6686106-B2 POLYIMIDESILOXANE COPOLYMERS UBE INDUSTRIES, LTD. (JP) 2004-02-03 US disclosed
US-20040019016-A1 Polycyclic compounds containing a central trivalent atom to which is attached either direct or indirectly via a linker a two or three ring system and a ring system contining sulphamate group as substituent; steroid sulfatase inhibitor RICHTER GEDEON NYRT. (HU) 2004-01-29 US disclosed
US-20030026998-A1 Atomic oxygen-resistant film UBE INDUSTRIES, LTD. (JP) 2003-02-06 US disclosed
US-6468639-B2 PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL UBE INDUSTRIES, LTD. (JP) 2002-10-22 US disclosed
US-6461738-B2 HEAT AND SOLVENT RESISTANCE UBE INDUSTRIES, INC. (JP) 2002-10-08 US disclosed
US-20020076548-A1 SINGLE-APPLICATION POLYIMIDOSILOXANE-BASED COATING MATERIAL AND CURED FILM UBE INDUSTRIES, LTD. (JP) 2002-06-20 US disclosed
US-20020001763-A1 Photosensitive resin compositions, insulating films, and processes for formation of the films UBE INDUSTRIES, LTD. 2002-01-03 US disclosed
US-20010020081-A1 Polyimide-based insulating film composition, insulating film and insulating film-forming method UBE INDUSTRIES, LTD. (JP) 2001-09-06 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20040019016-A1 Polycyclic compounds containing a central trivalent atom to which is attached either direct or indirectly via a linker a two or three ring system and a ring system contining sulphamate group as substituent; steroid sulfatase inhibitor STS, CYP21A2, SULT1E1 KDM4E 258/4885ALDH1A1 1098/4885KMT2A 676/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.