SCHEMBL4759903

SCHEMBL4759903

Nc1ccc(Oc2ccc(N)cc2C(=O)O)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.52
MAPT P10636 6/20 0.52
MEN1 O00255 4/20 0.52
KMT2A Q03164 4/20 0.52
KDM4E B2RXH2 3/20 0.52
TDP1 Q9NUW8 3/20 0.52
POLB P06746 3/20 0.52
CYP3A4 P08684 3/20 0.52
THRB P10828 2/20 0.52
RECQL P46063 2/20 0.52
HPGD P15428 2/20 0.52
USP2 O75604 1/20 0.52
PKM P14618 1/20 0.52
APEX1 P27695 1/20 0.52
BLM P54132 1/20 0.52
MCL1 Q07820 1/20 0.52
TNF P01375 1/20 0.52
HSPD1 P10809 1/20 0.52
CYP2C9 P11712 1/20 0.52
ALOX15 P16050 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30024982 1.00 ALDH1A1 (0.52) ALDH1A1MAPTMEN1KMT2AKDM4E
SCHEMBL2748501 0.91 CTNNB1 (0.54) ALDH1A1MAPTMEN1KMT2AKDM4E
SCHEMBL8901023 0.90 PNLIP (0.52) ALDH1A1MAPTMEN1KMT2AKDM4E
SCHEMBL711924 0.89 KDM4E (0.59) ALDH1A1MAPTMEN1KMT2AKDM4E
SCHEMBL20945312 0.86 KDM4E (0.65) ALDH1A1MAPTMEN1KMT2AKDM4E
SCHEMBL7549968 0.85 CFD (0.55) ALDH1A1MAPTMEN1KMT2AKDM4E
SCHEMBL28427163 0.83 POLB (0.47) ALDH1A1MAPTMEN1KMT2AKDM4E
SCHEMBL28036174 0.82 HTT (0.54) ALDH1A1MAPTMEN1KMT2AKDM4E
SCHEMBL10947890 0.82 KMT2A (0.72) ALDH1A1MAPTMEN1KMT2AKDM4E
SCHEMBL7125583 0.82 CTNNB1 (0.61) ALDH1A1MAPTMEN1KMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10928730-B2 Photosensitive resin composition, and polymer film made therefrom Zhen Ding Technology Co., Ltd. (TW) 2021-02-23 US claimed
US-10928730-B2 Photosensitive resin composition, and polymer film made therefrom Zhen Ding Technology Co., Ltd. (TW) 2021-02-23 US disclosed
WO-2021029243-A1 COLORED RESIN COMPOSITION, CURED PRODUCT AND LAMINATE 太陽ホールディングス株式会社 2021-02-18 WO disclosed
WO-2021028960-A1 COLORED RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE 太陽ホールディングス株式会社 2021-02-18 WO disclosed
EP-1087263-B1 Photosensitive resin composition and patterning method HITACHI CHEM DUPONT MICROSYS (JP) 2012-07-04 EP disclosed
JP-2008238788-A LAMINATED POLYIMIDE FILM, ITS MANUFACTURING PROCESS, AND FLEXIBLE CIRCUIT BOARD DU PONT TORAY CO LTD 2008-10-09 JP disclosed
JP-2008239930-A POLYAMIC ACID, POLYIMIDE FILM THEREFROM, AND MANUFACTURING METHOD THEREOF AS WELL AS FLEXIBLE CIRCUIT BOARD DU PONT TORAY CO LTD 2008-10-09 JP disclosed
EP-0814109-B1 Photosensitive polyimide precursor and its use for pattern formation HITACHI CHEMICAL CO LTD (JP) 2004-08-18 EP disclosed
EP-0814109-A1 Photosensitive polyimide precursor and its use for pattern formation HITACHI CHEMICAL COMPANY, LTD. (JP) 1997-12-29 EP disclosed