Known targets — ChEMBL curated mechanism
GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ
The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30409572 | 0.95 | — | — | |
| Hydrochloric Acid SCHEMBL965718 | 0.90 | — | — | |
| Bromide SCHEMBL3391850 | 0.90 | — | — | |
| Iodide SCHEMBL3391558 | 0.90 | — | — | |
| Fluoride Ion SCHEMBL31683192 | 0.90 | — | — | |
| SCHEMBL7181523 | 0.90 | — | — | |
| SCHEMBL7183290 | 0.79 | TSHR (0.35) | — | |
| SCHEMBL1717736 | 0.79 | TSHR (0.35) | — | |
| SCHEMBL7183389 | 0.79 | TSHR (0.35) | — | |
| SCHEMBL7174808 | 0.76 | TSHR (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12630744-B2 | Polishing compositions and methods of use thereof | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2026-05-19 | — | — | US | claimed |
| EP-4688987-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2026-02-11 | — | — | EP | claimed |
| EP-4626996-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2025-10-08 | — | — | EP | claimed |
| US-20250257286-A1 | CLEANING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2025-08-14 | — | — | US | claimed |
| WO-2024206301-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-10-03 | — | — | WO | claimed |
| US-20240327675-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2024-10-03 | — | — | US | claimed |
| WO-2024118398-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-06-06 | — | — | WO | claimed |
| US-20240174892-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2024-05-30 | — | — | US | claimed |
| US-12630744-B2 | Polishing compositions and methods of use thereof | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2026-05-19 | — | — | US | disclosed |
| US-20260071095-A1 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE | FUJIMI INCORPORATED (JP) | 2026-03-12 | — | — | US | disclosed |
| EP-4688987-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2026-02-11 | — | — | EP | disclosed |
| US-20250320381-A1 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | FUJIMI INCORPORATED (JP) | 2025-10-16 | — | — | US | disclosed |
| EP-4626996-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2025-10-08 | — | — | EP | disclosed |
| US-20250282977-A1 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | FUJIMI INCORPORATED (JP) | 2025-09-11 | — | — | US | disclosed |
| WO-2024118398-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-06-06 | — | — | WO | disclosed |
| US-20240174892-A1 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2024-05-30 | — | — | US | disclosed |
| WO-2020203345-A1 | COATING STRIPPING AGENT AND COATING STRIPPING METHOD | 王子ホールディングス株式会社 | 2020-10-08 | — | — | WO | disclosed |
| US-6649728-B2 | Polymerization catalysts or curing agents comprising phosphorus compounds such as tetraethylphosphonium tetrafluoroborate, used improve storage stability coating mixtures | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-11-18 | — | — | US | disclosed |
| US-20030109378-A1 | Catalyst for curing epoxy resins, method for making the same, epoxy resin composition, and powder coating composition | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-06-12 | — | — | US | disclosed |
| US-4003701-A | PRINTING A THIOATED FABRIC USING MICROWAVE ENERGY | SCOTT PAPER COMPANY (US) | 1977-01-18 | — | — | US | disclosed |