Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 4/20 | 0.47 |
| ▸ | MAPT | P10636 | 3/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.47 |
| ▸ | GAA | P10253 | 3/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.47 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.47 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.47 |
| ▸ | CASP1 | P29466 | 3/20 | 0.46 |
| ▸ | TSHR | P16473 | 3/20 | 0.46 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.45 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.45 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.44 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | POLB | P06746 | 1/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | HKDC1 | Q2TB90 | 1/20 | 0.42 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.42 |
| ▸ | THRB | P10828 | 2/20 | 0.42 |
| ▸ | HPGD | P15428 | 2/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7865326 | 0.88 | HKDC1 (0.57) | CYP3A4MAPTKDM4EGAAALDH1A1 | |
| SCHEMBL10034886 | 0.86 | KDM4E (0.47) | CYP3A4MAPTKDM4EGAAALDH1A1 | |
| SCHEMBL158793 | 0.84 | NT5E (0.53) | CYP3A4MAPTKDM4EGAAALDH1A1 | |
| SCHEMBL15324899 | 0.83 | L3MBTL1 (0.62) | CYP3A4MAPTKDM4EGAAALDH1A1 | |
| SCHEMBL17774548 | 0.82 | L3MBTL1 (0.48) | CYP3A4MAPTKDM4EGAAALDH1A1 | |
| SCHEMBL6811093 | 0.82 | GAA (0.48) | CYP3A4MAPTKDM4EGAAALDH1A1 | |
| SCHEMBL13212960 | 0.78 | CASP1 (0.44) | CYP3A4MAPTKDM4EGAAALDH1A1 | |
| SCHEMBL11021570 | 0.76 | GAA (0.52) | CYP3A4KDM4EGAAALDH1A1CASP1 | |
| SCHEMBL278795 | 0.76 | ALPL (0.52) | GAAALDH1A1ESR2TSHRL3MBTL1 | |
| SCHEMBL30678708 | 0.76 | ALPL (0.52) | GAAALDH1A1ESR2TSHRL3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10511025-B2 | Electrode manufacturing method | UBE INDUSTRIES, LTD. (JP) | 2019-12-17 | — | — | US | disclosed |
| EP-2204484-B1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, HEAT INSULATION MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT-RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT-RESISTANT BAG FILTER | KANEKA CORP (JP) | 2019-05-15 | — | — | EP | disclosed |
| US-10292262-B2 | Reinforcing-plate-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2019-05-14 | — | — | US | disclosed |
| US-10045433-B2 | Conductive-layer-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2018-08-07 | — | — | US | disclosed |
| US-9957390-B2 | Resin composition for pigment-containing insulating film, and use thereof | KANEKA CORPORATION (JP) | 2018-05-01 | — | — | US | disclosed |
| US-9835942-B2 | Photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2017-12-05 | — | — | US | disclosed |
| US-20170290141-A1 | CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD | KANEKA CORPORATION | 2017-10-05 | — | — | US | disclosed |
| US-9723708-B2 | Conductive-layer-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2017-08-01 | — | — | US | disclosed |
| EP-2492331-B1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICES USING SAME | TORAY INDUSTRIES (JP) | 2017-07-12 | — | — | EP | disclosed |
| US-20170194645-A1 | ELECTRODE MANUFACTURING METHOD | UBE INDUSTRIES, LTD. (JP) | 2017-07-06 | — | — | US | disclosed |
| US-6686106-B2 | POLYIMIDESILOXANE COPOLYMERS | UBE INDUSTRIES, LTD. (JP) | 2004-02-03 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-6468639-B2 | PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL | UBE INDUSTRIES, LTD. (JP) | 2002-10-22 | — | — | US | disclosed |
| US-6461738-B2 | HEAT AND SOLVENT RESISTANCE | UBE INDUSTRIES, INC. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-20020076548-A1 | SINGLE-APPLICATION POLYIMIDOSILOXANE-BASED COATING MATERIAL AND CURED FILM | UBE INDUSTRIES, LTD. (JP) | 2002-06-20 | — | — | US | disclosed |
| US-20020001763-A1 | Photosensitive resin compositions, insulating films, and processes for formation of the films | UBE INDUSTRIES, LTD. | 2002-01-03 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| US-20010020081-A1 | Polyimide-based insulating film composition, insulating film and insulating film-forming method | UBE INDUSTRIES, LTD. (JP) | 2001-09-06 | — | — | US | disclosed |
| US-6117510-A | SUPPORT FILMS WITH POLYIMIDOSILOXANE COPOLYMER COATINGS | UBE INDUSTRIES, LTD. (JP) | 2000-09-12 | — | — | US | disclosed |
| US-5643986-A | STORAGE STABLE, PROTECTIVE FILMS | UBE INDUSTRIES, LTD. (JP) | 1997-07-01 | — | — | US | disclosed |