Biphenyl

Biphenyl

SCHEMBL713552

COc1ccc(OS(=O)(=O)C(F)(F)F)cc1.S.c1ccc(-c2ccccc2)cc1

nearest known ligand 0.51

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BACE1 P56817 1/20 0.51
CA1 P00915 2/20 0.49
CA2 P00918 2/20 0.49
CA9 Q16790 2/20 0.49
NFE2L2 Q16236 2/20 0.47
PPARG P37231 1/20 0.47
CA4 P22748 1/20 0.43
KCNH2 Q12809 1/20 0.43
LTA4H P09960 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
GAA P10253 1/20 0.42
KMT2A Q03164 1/20 0.42
HTT P42858 1/20 0.41
HDAC4 P56524 1/20 0.41
HDAC2 Q92769 1/20 0.41
HDAC8 Q9BY41 1/20 0.41
CXCR2 P25025 1/20 0.41
PKM P14618 1/20 0.41
NPC1 O15118 1/20 0.41
RAB9A P51151 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Biphenyl SCHEMBL115843 0.98 BACE1 (0.53) BACE1CA1CA2CA9NFE2L2
Biphenyl SCHEMBL4512202 0.97 BACE1 (0.51) BACE1CA1CA2CA9NFE2L2
Hydrogen Sulfide SCHEMBL5082548 0.91 CA1 (0.55) BACE1CA1CA2CA9NFE2L2
SCHEMBL1997269 0.89 CA1 (0.57) BACE1CA1CA2CA9NFE2L2
SCHEMBL24360466 0.87 CA2 (0.62) BACE1CA1CA2CA9KMT2A
Iodide SCHEMBL1859836 0.87 CA1 (0.55) BACE1CA1CA2CA9NFE2L2
SCHEMBL5532552 0.87 CA2 (0.62) BACE1CA1CA2CA9KMT2A
Biphenyl SCHEMBL709602 0.86 CA2 (0.49) CA1CA2CA9PPARGSMN1; SMN2
Biphenyl SCHEMBL28551760 0.85 CA1 (0.53) CA1CA2CA9NFE2L2PPARG
Trifluoromethanesulfonic Acid SCHEMBL27925853 0.85 BACE1 (0.50) BACE1KCNH2HDAC4HDAC2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 81 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026107261-A1 PURIFICATION OF PHOTORESIST POLYMER BY SURFACE-MODIFIED POROUS POLYETHYLENE MEMBRANE ENTEGRIS, INC. (US) 2026-05-21 WO claimed
CN-114193896-A Thermochromic film and preparation method and application thereof 广州光驭超材料有限公司 2022-03-18 CN claimed
US-7994050-B2 Method for forming dual damascene pattern HYNIX SEMICONDUCTOR INC. (KR) 2011-08-09 US claimed
US-20100311239-A1 Method for forming dual damascene pattern LEE KI LYOUNG 2010-12-09 US claimed
US-7811929-B2 Method for forming dual damascene pattern HYNIX SEMICONDUCTOR, INC. (KR) 2010-10-12 US claimed
US-7449538-B2 Hard mask composition and method for manufacturing semiconductor device HYNIX SEMICONDUCTOR INC. (KR) 2008-11-11 US claimed
US-20080268641-A1 Method for forming dual damascene pattern HYNIX SEMICONDUCTOR INC. 2008-10-30 US claimed
US-20070154838-A1 Hard Mask Composition and Method for Manufacturing Semiconductor Device HYNIX SEMICONDUCTOR INC. (KR) 2007-07-05 US claimed
WO-2026107261-A1 PURIFICATION OF PHOTORESIST POLYMER BY SURFACE-MODIFIED POROUS POLYETHYLENE MEMBRANE ENTEGRIS, INC. (US) 2026-05-21 WO disclosed
CN-117866135-B Self-crosslinking polymer and bottom anti-reflection coating composition as well as preparation method and application thereof 厦门恒坤新材料科技股份有限公司 2025-01-24 CN disclosed
CN-114341215-B Curable composition 株式会社日本触媒 2024-12-27 CN disclosed
CN-118930721-A Bottom anti-reflection film resin and composition, preparation method and pattern forming method thereof 厦门恒坤新材料科技股份有限公司 2024-11-12 CN disclosed
CN-118818901-A KrF negative photoresist and preparation method and patterning forming method thereof 厦门恒坤新材料科技股份有限公司 2024-10-22 CN disclosed
CN-116082914-B Organic anti-reflection coating composition, preparation method thereof and pattern forming method 厦门恒坤新材料科技股份有限公司 2024-04-30 CN disclosed
US-7449538-B2 Hard mask composition and method for manufacturing semiconductor device HYNIX SEMICONDUCTOR INC. (KR) 2008-11-11 US disclosed
US-20080268641-A1 Method for forming dual damascene pattern HYNIX SEMICONDUCTOR INC. 2008-10-30 US disclosed
CN-101059652-A Photocurable resin composition DONGJIN SEMICHEM CO LTD (KR) 2007-10-24 CN disclosed
US-20070154838-A1 Hard Mask Composition and Method for Manufacturing Semiconductor Device HYNIX SEMICONDUCTOR INC. (KR) 2007-07-05 US disclosed
US-20070148585-A1 Hyperbranched polymer, production method therefor and resist composition containing hyperbranched polymer LION CORPORATION. 2007-06-28 US disclosed
EP-1698645-A1 HYPERBRANCHED POLYMER, PROCESS FOR PRODUCING THE SAME AND RESIST COMPOSITION CONTAINING THE HYPERBRANCHED POLYMER Lion Corporation (JP) 2006-09-06 EP disclosed