Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NR4A1 | P22736 | 1/20 | 0.52 |
| ▸ | IDO1 | P14902 | 1/20 | 0.52 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.52 |
| ▸ | KDM4E | B2RXH2 | 6/20 | 0.52 |
| ▸ | HPGD | P15428 | 1/20 | 0.52 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.52 |
| ▸ | POLB | P06746 | 3/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.50 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.50 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.50 |
| ▸ | PPM1B | O75688 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.45 |
| ▸ | GFER | P55789 | 1/20 | 0.45 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.45 |
| ▸ | PYGL | P06737 | 1/20 | 0.44 |
| ▸ | MAPT | P10636 | 4/20 | 0.44 |
| ▸ | APEX1 | P27695 | 2/20 | 0.44 |
| ▸ | MEN1 | O00255 | 2/20 | 0.44 |
| ▸ | THRB | P10828 | 2/20 | 0.44 |
| ▸ | USP2 | O75604 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4213704 | 0.93 | POLB (0.57) | NR4A1IDO1ALDH1A1KDM4EHPGD | |
| SCHEMBL7554668 | 0.93 | KDM4E (0.53) | NR4A1IDO1ALDH1A1KDM4EHPGD | |
| SCHEMBL147211 | 0.84 | SMN1; SMN2 (0.54) | ALDH1A1KDM4EHPGDPOLBTDP1 | |
| SCHEMBL712251 | 0.83 | KDM4E (0.61) | NR4A1IDO1ALDH1A1KDM4EPOLB | |
| SCHEMBL1554060 | 0.82 | KMT2A (0.59) | NR4A1IDO1ALDH1A1KDM4EPOLB | |
| SCHEMBL25513185 | 0.81 | ALDH1A1 (0.71) | IDO1ALDH1A1KDM4EHPGDHSD17B10 | |
| Nitrogen SCHEMBL28644591 | 0.81 | SMN1; SMN2 (0.51) | ALDH1A1KDM4EHPGDPOLBTDP1 | |
| SCHEMBL25845502 | 0.81 | ALDH1A1 (0.46) | IDO1ALDH1A1KDM4EHPGDHSD17B10 | |
| SCHEMBL7468648 | 0.81 | KDM4E (0.67) | IDO1ALDH1A1KDM4EHPGDHSD17B10 | |
| SCHEMBL29426403 | 0.80 | POLB (0.70) | ALDH1A1KDM4EHSD17B10POLBTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 109 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101423606-B | Negative photosensitive polyimide material and preparation method thereof | BYD CO LTD | 2012-05-02 | — | — | CN | claimed |
| CN-101423606-A | Negative photosensitive polyimide material and preparation method thereof | BYD CO LTD (CN) | 2009-05-06 | — | — | CN | claimed |
| CN-114174422-B | Resin composition and use thereof | DIC株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-116847983-A | Laminated structure and flexible printed circuit board | 太阳控股株式会社 | 2023-10-03 | — | — | CN | disclosed |
| WO-2023153390-A1 | PHOTOSENSITIVE RESIN SHEET, CURED FILM, AND MULTILAYER WIRING SUBSTRATE | 東レ株式会社 | 2023-08-17 | — | — | WO | disclosed |
| US-20220155684-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT | TORAY INDUSTRIES, INC. (JP) | 2022-05-19 | — | — | US | disclosed |
| CN-110809607-B | Resin composition, laminate, method for producing same, electrode, secondary battery, and electric double layer capacitor | 东丽株式会社 | 2022-05-17 | — | — | CN | disclosed |
| CN-114174422-A | Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board | DIC株式会社 | 2022-03-11 | — | — | CN | disclosed |
| EP-3933906-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT | Toray Industries, Inc. (JP) | 2022-01-05 | — | — | EP | disclosed |
| CN-109792019-B | Separator for nonaqueous electrolyte battery and nonaqueous electrolyte battery | 东丽株式会社 | 2021-12-03 | — | — | CN | disclosed |
| US-10992009-B2 | Nonaqueous electrolyte battery separator and nonaqueous electrolyte battery | TORAY INDUSTRIES, INC. | 2021-04-27 | — | — | US | disclosed |
| CN-1416452-A | Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof | HITACHI CHEMICAL CO LTD (JP) | 2003-05-07 | — | — | CN | disclosed |
| US-20030082925-A1 | Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics | HITACHI CHEMICAL CO., LTD. (JP) | 2003-05-01 | — | — | US | disclosed |
| US-20030026998-A1 | Atomic oxygen-resistant film | UBE INDUSTRIES, LTD. (JP) | 2003-02-06 | — | — | US | disclosed |
| US-6468639-B2 | PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL | UBE INDUSTRIES, LTD. (JP) | 2002-10-22 | — | — | US | disclosed |
| US-6461738-B2 | HEAT AND SOLVENT RESISTANCE | UBE INDUSTRIES, INC. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-20020076548-A1 | SINGLE-APPLICATION POLYIMIDOSILOXANE-BASED COATING MATERIAL AND CURED FILM | UBE INDUSTRIES, LTD. (JP) | 2002-06-20 | — | — | US | disclosed |
| US-20020001763-A1 | Photosensitive resin compositions, insulating films, and processes for formation of the films | UBE INDUSTRIES, LTD. | 2002-01-03 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| US-20010020081-A1 | Polyimide-based insulating film composition, insulating film and insulating film-forming method | UBE INDUSTRIES, LTD. (JP) | 2001-09-06 | — | — | US | disclosed |