SCHEMBL7554668

SCHEMBL7554668

Nc1cc(Oc2ccc(N)c(C(=O)O)c2)ccc1C(=O)O

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 3/20 0.53
KMT2A Q03164 2/20 0.53
GFER P55789 1/20 0.53
RXFP1 Q9HBX9 1/20 0.53
POLB P06746 3/20 0.52
TDP1 Q9NUW8 2/20 0.52
MEN1 O00255 1/20 0.52
USP2 O75604 1/20 0.52
MAPT P10636 1/20 0.52
THRB P10828 1/20 0.52
PKM P14618 1/20 0.52
APEX1 P27695 1/20 0.52
RECQL P46063 1/20 0.52
BLM P54132 1/20 0.52
MCL1 Q07820 1/20 0.52
IDO1 P14902 1/20 0.50
NR4A1 P22736 1/20 0.50
GLA P06280 1/20 0.50
KEAP1 Q14145 1/20 0.50
ALDH1A1 P00352 5/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL712251 0.93 KDM4E (0.61) KDM4EKMT2AGFERRXFP1POLB
SCHEMBL714478 0.93 NR4A1 (0.52) KDM4EKMT2AGFERRXFP1POLB
SCHEMBL1554060 0.91 KMT2A (0.59) KDM4EKMT2AGFERRXFP1POLB
SCHEMBL1027446 0.86 KMT2A (0.61) KDM4EKMT2AGFERRXFP1POLB
SCHEMBL1553285 0.86 KDM4E (0.55) KDM4EKMT2AGFERRXFP1POLB
SCHEMBL5078313 0.86 POLB (0.57) KDM4EKMT2AGFERRXFP1POLB
SCHEMBL4213704 0.86 POLB (0.57) KDM4EKMT2AGFERPOLBMEN1
SCHEMBL710634 0.86 KMT2A (0.63) KDM4EKMT2AGFERRXFP1POLB
SCHEMBL2426327 0.83 KEAP1 (0.66) KDM4EKMT2AGFERRXFP1POLB
SCHEMBL10583194 0.83 BRAF (0.56) KDM4EKMT2AGFERRXFP1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6492030-B1 SILOXANE DENATURED POLYIMIDE, DI- OR TRIALLYL COMPOUND AND DIMALEIMIDE COMPOUND; ADHERES TO METALS WITH LOW DIELECTRIC CONSTANT AND DISSIPATION FACTOR; FASTER SIGNAL PROCESSING; HIGH FREQUENCY ELECTRONICS WITH MINIATURIZED CIRCUITS TOMOEGAWA PAPER CO., LTD. (JP) 2002-12-10 US disclosed
US-6473288-B2 Adhesive sheet and electrostatic chucking device TOMOEGAWA PAPER CO. (JP) 2002-10-29 US disclosed
US-20020004134-A1 Adhesive sheet and electrostatic chucking device TOMOEGAWA PAPER CO., LTD. 2002-01-10 US disclosed
US-6329050-B1 SUBSTRATE WITH ADHESIVE LAYER FOR ELECTRONICS WITH POLYIMIDES TOMOEGAWA PAPER CO., LTD. (JP) 2001-12-11 US disclosed
US-6187874-B1 Adhesive for electronic parts and adhesive tape for electronic parts TOMOEGAWA PAPER CO., LTD. (JP) 2001-02-13 US disclosed