SCHEMBL716944

SCHEMBL716944

Nc1ccc(Oc2ccc(Oc3ccc(N)c(O)c3)cc2)cc1O

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NR4A1 P22736 1/20 0.58
MMP2 P08253 1/20 0.53
MMP14 P50281 1/20 0.53
MEN1 O00255 4/20 0.52
KMT2A Q03164 4/20 0.52
ESR1 P03372 1/20 0.52
ESR2 Q92731 1/20 0.52
CYP3A4 P08684 2/20 0.52
ALOX15 P16050 1/20 0.52
HSD17B10 Q99714 1/20 0.52
GAA P10253 3/20 0.52
MAPT P10636 3/20 0.52
KDM4E B2RXH2 2/20 0.52
POLB P06746 1/20 0.52
RAB9A P51151 1/20 0.52
ALDH1A1 P00352 3/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
MITF O75030 1/20 0.46
GFER P55789 1/20 0.46
NLRP1 Q9C000 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19809245 1.00 NR4A1 (0.58) NR4A1MMP2MMP14MEN1KMT2A
SCHEMBL30040301 0.98 NR4A1 (0.61) NR4A1MMP2MMP14MEN1KMT2A
SCHEMBL436522 0.98 NR4A1 (0.61) NR4A1MMP2MMP14MEN1KMT2A
SCHEMBL563890 0.96 MEN1 (0.61) NR4A1MMP2MMP14MEN1KMT2A
Hydrochloric Acid SCHEMBL10770715 0.95 NR4A1 (0.58) NR4A1MMP2MMP14MEN1KMT2A
SCHEMBL1348470 0.94 CYP3A4 (0.58) NR4A1MMP2MMP14MEN1KMT2A
SCHEMBL564520 0.94 ALDH1A1 (0.58) NR4A1MMP2MMP14MEN1KMT2A
SCHEMBL27510157 0.93 NR4A1 (0.56) NR4A1MMP2MMP14MEN1KMT2A
SCHEMBL564952 0.92 LTA4H (0.59) NR4A1MMP2MMP14MEN1KMT2A
SCHEMBL30233344 0.92 LTA4H (0.59) NR4A1MMP2MMP14MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9975996-B2 Positive photosensitive resin composition and polyhydroxyamide resin NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-05-22 US claimed
US-20160185905-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2016-06-30 US claimed
EP-2011842-B1 PHOTOSENSITIVE INK COMPOSITION FOR SCREEN PRINTING AND METHOD OF FORMING POSITIVE RELIEF PATTERN WITH USE THEREOF PI R & D CO LTD (JP) 2014-02-26 EP claimed
US-8349537-B2 Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof PI R&D CO., LTD. (JP) 2013-01-08 US claimed
US-20110111351-A1 Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof WIN MAW SOE 2011-05-12 US claimed
US-20090186295-A1 Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof PI R&D CO., LTD. (JP) 2009-07-23 US claimed
EP-2011842-A1 PHOTOSENSITIVE INK COMPOSITION FOR SCREEN PRINTING AND METHOD OF FORMING POSITIVE RELIEF PATTERN WITH USE THEREOF PI R & D Co., Ltd. (JP) 2009-01-07 EP claimed
EP-1262509-B1 IMIDE-BENZOXAZOLE POLYCONDENSATE AND PROCESS FOR PRODUCING THE SAME PI R & D CO LTD (JP) 2007-01-10 EP claimed
US-6890626-B1 Imide-benzoxazole polycondensate and process for producing the same PI R&D CO., LTD. (JP) 2005-05-10 US claimed
US-6875554-B2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2005-04-05 US claimed
CN-119585651-A Composition for forming wavelength conversion film 日产化学株式会社 2025-03-07 CN disclosed
WO-2025047700-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM AND USE THEREOF 日産化学株式会社 2025-03-06 WO disclosed
WO-2025047702-A1 COMPOSITION FOR PATTERNING AND USE OF SAME 日産化学株式会社 2025-03-06 WO disclosed
WO-2024214539-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM, AND COMPOUND 日産化学株式会社 2024-10-17 WO disclosed
CN-118525024-A Condensed ring thiophene compound and composition for forming wavelength conversion film containing same 国立大学法人东海国立大学机构 2024-08-20 CN disclosed
EP-1329769-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2003-07-23 EP disclosed
EP-1241527-A1 POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2002-09-18 EP disclosed
EP-0424940-B1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL IND LTD (JP) 1998-01-14 EP disclosed
US-5288588-A Containing diamine substituted with phenolic hydroxyl, carboxyl, thiophenol and/or sulfonic groups NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1994-02-22 US disclosed
EP-0424940-A2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1991-05-02 EP disclosed