SCHEMBL717462

SCHEMBL717462

Nc1c(O)cccc1C(=O)c1cccc(O)c1N

nearest known ligand 0.72

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
G6PD P11413 1/20 0.72
CASP7 P55210 1/20 0.72
CASP6 P55212 1/20 0.72
KDM4E B2RXH2 5/20 0.53
HIF1A Q16665 3/20 0.53
TDP1 Q9NUW8 1/20 0.53
HPGD P15428 4/20 0.48
ALDH1A1 P00352 3/20 0.48
MAPT P10636 2/20 0.48
TSHR P16473 2/20 0.48
HSD17B10 Q99714 1/20 0.48
CA12 O43570 2/20 0.44
CA1 P00915 2/20 0.44
CA2 P00918 2/20 0.44
CA7 P43166 2/20 0.44
CA9 Q16790 2/20 0.44
CA14 Q9ULX7 2/20 0.44
SMN1; SMN2 Q16637 2/20 0.44
HMGB1 P09429 1/20 0.44
CA4 P22748 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11160377 0.94 G6PD (0.64) G6PDCASP7CASP6KDM4EHIF1A
SCHEMBL6466246 0.90 G6PD (0.60) G6PDCASP7CASP6KDM4EHIF1A
SCHEMBL9833888 0.87 G6PD (0.56) G6PDCASP7CASP6KDM4EHIF1A
SCHEMBL3125873 0.86 G6PD (0.66) G6PDCASP7CASP6KDM4EHIF1A
SCHEMBL30477210 0.84 CASP7 (1.00) G6PDCASP7CASP6KDM4EHIF1A
SCHEMBL21114369 0.84 CASP7 (1.00) G6PDCASP7CASP6KDM4EHIF1A
SCHEMBL29430959 0.84 CASP7 (1.00) G6PDCASP7CASP6KDM4EHIF1A
SCHEMBL88229 0.84 CASP7 (1.00) G6PDCASP7CASP6KDM4EHIF1A
SCHEMBL2020740 0.84 G6PD (0.69) G6PDCASP7CASP6KDM4EHIF1A
SCHEMBL120305 0.82 G6PD (0.67) G6PDCASP7CASP6KDM4EHIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9321017-B2 Gas-separation membrane NAGOYA INDUSTRIAL SCIENCE RESEARCH INSTITUTE (JP) 2016-04-26 US claimed
US-20150033945-A1 GAS-SEPARATION MEMBRANE NAGOYA INDUSTRIAL SCIENCE RESEARCH INSTITUTE (JP) 2015-02-05 US claimed
US-9321017-B2 Gas-separation membrane NAGOYA INDUSTRIAL SCIENCE RESEARCH INSTITUTE (JP) 2016-04-26 US disclosed
US-20150033945-A1 GAS-SEPARATION MEMBRANE NAGOYA INDUSTRIAL SCIENCE RESEARCH INSTITUTE (JP) 2015-02-05 US disclosed
US-8216727-B2 Aromatic hydrocarbon based proton exchange membrane and direct methanol fuel cell using same TOYO BOSEKI KABUSHIKI KAISHA (JP) 2012-07-10 US disclosed
US-20120052411-A9 AROMATIC HYDROCARBON BASED PROTON EXCHANGE MEMBRANE AND DIRECT METHANOL FUEL CELL USING SAME TOYO BOSEKI KABUSHIKI KAISHA (JP) 2012-03-01 US disclosed
US-20110311871-A1 NEGATIVE ELECTRODE FOR LITHIUM SECONDARY BATTERIES AND LITHIUM SECONDARY BATTERY SANYO ELECTRIC CO., LTD. (JP) 2011-12-22 US disclosed
US-8058565-B2 Wiring board, semiconductor device, and method for manufacturing wiring board NEC CORPORATION (JP) 2011-11-15 US disclosed
US-7981963-B2 Insulation material of reactive elastomer, epoxy resin, curing agent and crosslinked rubber NEC CORPORATION (JP) 2011-07-19 US disclosed
US-7799893-B2 Polybenzazole block copolymer SOLVAY (SOCIETE ANONYME) (BE) 2010-09-21 US disclosed
EP-1812497-B1 POLYBENZAZOLE BLOCK COPOLYMER SOLVAY (BE) 2009-06-17 EP disclosed
US-20040152862-A1 Optical resins and applications thereof HITACHI CHEMICAL CO., LTD. (JP) 2004-08-05 US disclosed
US-20040062969-A1 Polybenzazole compound having sulfo group and/or phosphono group, resin composition containing the same, molded resin, slid polymer electrolyte film, solid electrolyte film/electrode catalyst layer composite, and process for producing the composite TOYO BOSEKI KABUSHIKI KAISHA (JP) 2004-04-01 US disclosed
US-20040024124-A1 A curable blends comprising a cycloalkanone solvent, is easily desolventized during film formation, also epoxy resins; good workability, used in spin coating, screen printing, adhesive layer on printed circuits NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2004-02-05 US disclosed
EP-1384743-A1 Polybenzazole precursor film, polybenzazole film and method of producing the same Polymatech Co., Ltd. (JP) 2004-01-28 EP disclosed
EP-1354907-A1 POLYBENZAZOLE COMPOUND HAVING SULFO GROUP AND/OR PHOSPHONO GROUP, RESIN COMPOSITION CONTAINING THE SAME, MOLDED RESIN, SOLID POLYMER ELECTROLYTE FILM, SOLID ELECTROLYTE FILM/ELECTRODE CATALYST LAYER COMPOSITE, AND PROCESS FOR PRODUCING THE COMPOSITE Toyo Boseki Kabushiki Kaisha (JP) 2003-10-22 EP disclosed
US-20030166796-A1 Epoxy resin composition and cured object obtained therefrom NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2003-09-04 US disclosed
EP-1333077-A1 VARNISH CONTAINING POLYAMIDE RESIN AND USE THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2003-08-06 EP disclosed
US-20030091842-A1 Cover-lay film and printed circuit board having the same UBE INDUSTRIES, LTD. (JP) 2003-05-15 US disclosed
EP-1300444-A1 EPOXY RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM Nippon Kayaku Kabushiki Kaisha (JP) 2003-04-09 EP disclosed