SCHEMBL718001

SCHEMBL718001

C=CC(=C)c1ccc(OC(C)=O)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ELANE P08246 5/20 0.55
HSD17B10 Q99714 1/20 0.53
LMNA P02545 4/20 0.52
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
ESR1 P03372 1/20 0.47
PGR P06401 1/20 0.47
CHRM2 P08172 1/20 0.47
ADORA3 P0DMS8 1/20 0.47
AR P10275 1/20 0.47
CHRM1 P11229 1/20 0.47
SLC6A2 P23975 1/20 0.47
SLC6A3 Q01959 1/20 0.47
MAPT P10636 4/20 0.47
POLB P06746 2/20 0.47
PKM P14618 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.46
KDM4E B2RXH2 1/20 0.46
TTR P02766 1/20 0.46
TP53 P04637 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14903558 0.83 ELANE (0.56) ELANEHSD17B10LMNAMEN1KMT2A
SCHEMBL28705673 0.80 THRB (0.59) ELANEHSD17B10LMNAMEN1KMT2A
SCHEMBL1088052 0.80 LMNA (0.65) ELANEHSD17B10LMNAMEN1KMT2A
SCHEMBL29261849 0.80 ELANE (0.53) ELANEHSD17B10LMNAMEN1KMT2A
SCHEMBL13618052 0.78 MAPT (0.53) HSD17B10LMNAESR1ADORA3MAPT
SCHEMBL9339013 0.78 ELANE (0.83) ELANEHSD17B10LMNAMEN1KMT2A
SCHEMBL269329 0.77 LMNA (0.80) ELANEHSD17B10LMNAMEN1KMT2A
SCHEMBL1089254 0.76 ELANE (0.62) ELANEHSD17B10LMNAMEN1KMT2A
SCHEMBL4902491 0.76 ELANE (0.53) ELANEHSD17B10LMNAMEN1KMT2A
SCHEMBL5831549 0.76 ELANE (0.67) ELANEHSD17B10LMNAMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 108 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-121586750-A Composition for forming silicon-containing underlayer film for directional self-assembly 日产化学株式会社 2026-02-27 CN disclosed
US-20250206901-A1 BRUSH MATERIAL FOR SELF-ASSEMBLED FILM NISSAN CHEMICAL CORPORATION (JP) 2025-06-26 US disclosed
CN-120019330-A Underlying film material for self-assembled materials 日产化学株式会社 2025-05-16 CN disclosed
US-20250147413-A1 METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-05-08 US disclosed
US-20250101145-A1 BLOCK COPOLYMERS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2025-03-27 US disclosed
WO-2025047871-A1 UNDERLAYER FILM MATERIAL FOR SELF-ASSEMBLED MATERIALS 日産化学株式会社 2025-03-06 WO disclosed
WO-2025041813-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ASSEMBLY 日産化学株式会社 2025-02-27 WO disclosed
US-20250011616-A1 METHOD FOR PRODUCING STRUCTURE BODY INCLUDING PHASE-SEPARATED STRUCTURE, AND COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-09 US disclosed
US-20250011622-A1 BLOCK COPOLYMER, UNDERCOAT AGENT, RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, AND METHOD FOR PRODUCING STRUCTURE BODY INCLUDING PHASE-SEPARATED STRUCTURE TOKYO OHKA KOGYO CO LTD (JP) 2025-01-09 US disclosed
US-20240425694-A1 RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, AND METHOD FOR PRODUCING STRUCTURE BODY INCLUDING PHASE-SEPARATED STRUCTURE TOKYO OHKA KOGYO CO., LTD. (JP) 2024-12-26 US disclosed
US-20140234589-A1 METHODS OF PATTERNING BLOCK COPOLYMER LAYERS AND PATTERNED STRUCTURES SAMSUNG ELECTRONICS CO., LTD. (KR) 2014-08-21 US disclosed
US-20140193614-A1 METHOD OF PATTERNING BLOCK COPOLYMER LAYER AND PATTERNED STRUCTURE Yonsei University, University - Industry Foundation(UIF) (KR) 2014-07-10 US disclosed
US-20140187054-A1 METHODS OF PATTERNING BLOCK COPOLYMER LAYERS SAMSUNG ELECTRONICS CO., LTD. (KR) 2014-07-03 US disclosed
US-20140127626-A1 RESIST COMPOSITION FOR NEGATIVE DEVELOPMENT WHICH IS USED FOR FORMATION OF GUIDE PATTERN, GUIDE PATTERN FORMATION METHOD, AND METHOD FOR FORMING PATTERN ON LAYER CONTAINING BLOCK COPOLYMER RIKEN (JP) 2014-05-08 US disclosed
US-20140113236-A1 SOLVENT DEVELOPABLE NEGATIVE RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND METHOD FOR FORMING PATTERN OF LAYER INCLUDING BLOCK COPOLYMER RIKEN (JP) 2014-04-24 US disclosed
US-20140030652-A1 PRIMER AND PATTERN FORMING METHOD FOR LAYER INCLUDING BLOCK COPOLYMER RIKEN (JP) 2014-01-30 US disclosed
US-20130313223-A1 METHOD FOR PRODUCING SUBSTRATE HAVING SURFACE NANOSTRUCTURE TOKYO OHKA KOGYO CO., LTD. (JP) 2013-11-28 US disclosed
US-20130240481-A1 BLOCK COPOLYMER-CONTAINING COMPOSITION AND METHOD OF REDUCING PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-09-19 US disclosed
US-20130210231-A1 METHOD OF FORMING CONTACT HOLE PATTERN RIKEN (JP) 2013-08-15 US disclosed
US-20120048738-A1 SUBSTRATE PROVIDED WITH METAL NANOSTRUCTURE ON SURFACE THEREOF AND METHOD OF PRODUCING THE SAME TOKYO OHKA KOGYO CO., LTD. (JP) 2012-03-01 US disclosed