SCHEMBL7186111

SCHEMBL7186111

CCCC(CC)C(N)N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27888626 0.82 ALDH1A1 (0.44)
SCHEMBL218870 0.81 LMNA (0.40)
SCHEMBL704648 0.79
SCHEMBL1404786 0.79 LMNA (0.48)
SCHEMBL24967848 0.79
SCHEMBL20663119 0.79
SCHEMBL24668130 0.79 METAP1 (0.41)
SCHEMBL3362839 0.79
SCHEMBL516416 0.78 ALDH1A1 (0.41)
SCHEMBL28821798 0.78 METAP1 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118085273-A Polyamide resin and preparation method and application thereof 华峰集团有限公司 2024-05-28 CN disclosed
CN-114437342-B Preparation method of high-viscosity polyamide resin 华峰集团有限公司 2023-09-19 CN disclosed
CN-114437342-A Preparation method of high-viscosity polyamide resin 华峰集团有限公司 2022-05-06 CN disclosed
CN-108884212-A Maleimide resin, hardening resin composition and its hardening thing 日本化药株式会社 2018-11-23 CN disclosed
CN-108546403-A A kind of decoration construction technique 浙江建业幕墙装饰有限公司 2018-09-18 CN disclosed
CN-107043448-B The method that scene produces heat insulator in house decoration 浙江华博装饰工程有限公司 2018-04-20 CN disclosed
CN-107043448-A The method that scene produces heat insulator in house decoration 浙江华博装饰工程有限公司 2017-08-15 CN disclosed
CN-104072720-A ASYMMETRIC DIALDIMINE-CONTAINING POLYURETHANE COMPOSITION SIKA TECHNOLOGY AG 2014-10-01 CN disclosed
CN-101641383-A Polyurethane compositions containing asymmetric dialdimines SIKA TECHNOLOGY AG CH 2010-02-03 CN disclosed
US-6641804-B1 Resin and a diluent, the resin (T) providing a resin film having at least one resin selected from the group consisting of vinyl resins, polyester resins, polyamide resins, silicone resins, cationic urethane resins, ampholytic urethane resins SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2003-11-04 US disclosed
EP-1068859-A1 HAIR TREATMENT AND METHOD OF TREATING HAIR SANYO CHEMICAL INDUSTRIES, Ltd. (JP) 2001-01-17 EP disclosed
EP-0184152-B1 RESIN HAVING GROUPS CONTAINING BASIC NITROGEN, ITS PREPARATION AND APPLICATION BASF Lacke + Farben AG (DE) 1991-01-23 EP disclosed
US-4699937-A Synthetic resin carrying basic nitrogen groups, its preparation, coating materials produced using this resin, and cathodic electrocoating BASF FARBEN+FASERN AKTIENGESELLSCHAFT (DE) 1987-10-13 US disclosed
EP-0184152-A2 Resin having groups containing basic nitrogen, its preparation and application BASF Lacke + Farben AG (DE) 1986-06-11 EP disclosed