SCHEMBL7218155

SCHEMBL7218155

C=CCC1(COc2ccccc2)CO1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.38
RECQL P46063 2/20 0.36
MAPT P10636 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
KCNA3 P22001 1/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
KDM4E B2RXH2 1/20 0.35
GLA P06280 1/20 0.33
GAA P10253 1/20 0.33
HTT P42858 1/20 0.33
RAB9A P51151 1/20 0.33
HTR1A P08908 3/20 0.33
ADRA1A P35348 2/20 0.33
AOC3 Q16853 1/20 0.33
ALDH1A1 P00352 2/20 0.32
TAAR1 Q96RJ0 1/20 0.32
POLB P06746 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7269669 0.84 KCNA3 (0.44) RECQLTDP1KCNA3HTR1AADRA1A
SCHEMBL4451944 0.77 LTA4H (0.41) RECQLTDP1KCNA3HTR1AALDH1A1
SCHEMBL27760167 0.77 TAAR1 (0.44) RECQLTDP1KCNA3AOC3ALDH1A1
SCHEMBL476346 0.76 TDP1 (0.38) RECQLMAPTTDP1KCNA3SMN1; SMN2
SCHEMBL9491322 0.72 MEN1 (0.33) THRBRECQLMAPTNPSR1TDP1
SCHEMBL246844 0.72 TDP1 (0.54) TDP1SMN1; SMN2MEN1KMT2AGLA
SCHEMBL11235793 0.72 MEN1 (0.40) THRBRECQLMAPTNPSR1KCNA3
SCHEMBL11399029 0.71 LTA4H (0.39) TDP1KCNA3HTR1AADRA1DMAOA
SCHEMBL16689102 0.70 PDE9A (0.39) THRBRECQLTDP1KCNA3SMN1; SMN2
SCHEMBL11013902 0.69 ALDH1A1 (0.42) RECQLTDP1KCNA3MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 101 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110643321-B Electronic material glue solution and application thereof 苏州益可泰电子材料有限公司 2022-03-29 CN claimed
CN-110713616-B Material for electronics and use thereof 苏州益可泰电子材料有限公司 2022-03-29 CN claimed
CN-110684352-B Prepolymer for high-performance friction material and application thereof 江苏立一新材料科技有限公司 2022-01-25 CN claimed
CN-110746775-B Prepolymer for flame-retardant wear-resistant material and application thereof 江苏立一新材料科技有限公司 2021-12-31 CN claimed
CN-110734546-B Self-repairing wear-resistant material and application thereof 江苏立一新材料科技有限公司 2021-12-10 CN claimed
CN-110746776-B Flame-retardant wear-resistant material and application thereof 江苏立一新材料科技有限公司 2021-12-10 CN claimed
CN-110724380-B Prepolymer for self-repairing wear-resistant material and application thereof 江苏立一新材料科技有限公司 2021-12-03 CN claimed
CN-110684353-B High-performance friction material and application thereof 江苏立一新材料科技有限公司 2021-12-03 CN claimed
CN-110330650-B Bismaleimide resin prepolymer and application thereof 苏州大学 2021-07-09 CN claimed
CN-110330647-B Remodelable shape memory bismaleimide resin and application thereof 苏州大学 2021-06-18 CN claimed
CN-110713616-A Material for electronics and use thereof 苏州益可泰电子材料有限公司 2020-01-21 CN claimed
CN-110684352-A Prepolymer for high-performance friction material and application thereof 江苏立一新材料科技有限公司 2020-01-14 CN claimed
CN-110684353-A High-performance friction material and application thereof 江苏立一新材料科技有限公司 2020-01-14 CN claimed
CN-110643321-A Electronic material glue solution and application thereof 苏州益可泰电子材料有限公司 2020-01-03 CN claimed
CN-110607070-A Prepolymer for heat-resistant friction material and application thereof 江苏立一新材料科技有限公司 2019-12-24 CN claimed
CN-110561856-A Electronic material and application thereof 苏州益可泰电子材料有限公司 2019-12-13 CN claimed
CN-110330648-A Bimaleimide resin performed polymer and its application can be remolded 苏州大学 2019-10-15 CN claimed
CN-110330647-A It can remodelled shape memory bimaleimide resin and its application 苏州大学 2019-10-15 CN claimed
CN-110330650-A Bimaleimide resin performed polymer and its application 苏州大学 2019-10-15 CN claimed
CN-110330649-A Bimaleimide resin and its application can be remolded 苏州大学 2019-10-15 CN claimed