Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR6 | P50406 | 4/20 | 1.00 |
| ▸ | PKM | P14618 | 3/20 | 1.00 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 1.00 |
| ▸ | TSHR | P16473 | 3/20 | 0.70 |
| ▸ | LMNA | P02545 | 2/20 | 0.70 |
| ▸ | MPO | P05164 | 1/20 | 0.70 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.70 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.70 |
| ▸ | MEN1 | O00255 | 2/20 | 0.57 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.57 |
| ▸ | NPC1 | O15118 | 1/20 | 0.56 |
| ▸ | GAA | P10253 | 3/20 | 0.55 |
| ▸ | MAPT | P10636 | 2/20 | 0.55 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.53 |
| ▸ | RAB9A | P51151 | 1/20 | 0.53 |
| ▸ | CA12 | O43570 | 2/20 | 0.48 |
| ▸ | CA1 | P00915 | 2/20 | 0.48 |
| ▸ | CA2 | P00918 | 2/20 | 0.48 |
| ▸ | CA9 | Q16790 | 2/20 | 0.48 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30771551 | 1.00 | HTR6 (1.00) | HTR6PKMALDH1A1TSHRLMNA | |
| SCHEMBL6659575 | 0.91 | ALDH1A1 (0.83) | HTR6PKMALDH1A1TSHRLMNA | |
| SCHEMBL29484233 | 0.91 | ALDH1A1 (0.83) | HTR6PKMALDH1A1TSHRLMNA | |
| SCHEMBL29462648 | 0.91 | ALDH1A1 (0.83) | HTR6PKMALDH1A1TSHRLMNA | |
| SCHEMBL636445 | 0.91 | ALDH1A1 (0.83) | HTR6PKMALDH1A1TSHRLMNA | |
| Hydrochloric Acid SCHEMBL7873578 | 0.89 | ALDH1A1 (0.79) | HTR6PKMALDH1A1TSHRLMNA | |
| SCHEMBL950448 | 0.85 | HTR6 (0.74) | HTR6PKMALDH1A1TSHRLMNA | |
| SCHEMBL30166976 | 0.85 | HTR6 (0.74) | HTR6PKMALDH1A1TSHRLMNA | |
| SCHEMBL28822994 | 0.83 | ALDH1A1 (0.71) | HTR6PKMALDH1A1TSHRLMNA | |
| SCHEMBL27677623 | 0.83 | ALDH1A1 (0.71) | HTR6PKMALDH1A1TSHRLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260035513-A1 | RESIN COMPOSITION, REINFORCED COMPOSITE MATERIAL, SHAPED PRODUCT, AND METHOD OF RECOVERING REINFORCING FIBER FROM REINFORCED COMPOSITE MATERIAL | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| EP-4578892-A1 | RESIN COMPOSITION, COMPOSITE REINFORCING MATERIAL, MOLDED BODY, AND METHOD FOR RECOVERING REINFORCING FIBERS FROM COMPOSITE REINFORCING MATERIAL | Asahi Kasei Kabushiki Kaisha (JP) | 2025-07-02 | — | — | EP | disclosed |
| WO-2022168723-A1 | ORGANIC RESIN COMPOSITION SHEET FOR COVERING ELECTRONIC COMPONENT AND METHOD FOR PROCESSING ELECTRONIC COMPONENT USING SAME | 東レ株式会社 | 2022-08-11 | — | — | WO | disclosed |
| CN-112368641-A | Photosensitive resin composition, photosensitive sheet, cured film of photosensitive resin composition and photosensitive sheet, method for producing cured film, and electronic component | 东丽株式会社 | 2021-02-12 | — | — | CN | disclosed |
| CN-111936555-A | Resin, resin precursor, and resin precursor solution | 引能仕株式会社 | 2020-11-13 | — | — | CN | disclosed |
| WO-2019181699-A1 | RESIN, RESIN PRECURSOR AND RESIN PRECURSOR SOLUTION | ＪＸＴＧエネルギー株式会社 | 2019-09-26 | — | — | WO | disclosed |
| US-8138580-B2 | Adhesive composition for electronic components, and adhesive sheet for electronic components using the same | TORAY INDUSTRIES, INC. (JP) | 2012-03-20 | — | — | US | disclosed |
| US-20100193961-A1 | ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENTS, AND ADHESIVE SHEET FOR ELECTRONIC COMPONENTS USING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2010-08-05 | — | — | US | disclosed |
| EP-2192167-A1 | ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENTS AND ADHESIVE SHEET FOR ELECTRONIC COMPONENTS USING THE SAME | Toray Industries, Inc. (JP) | 2010-06-02 | — | — | EP | disclosed |
| US-20080131639-A1 | Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same | TORAY INDUSTRIES, INC. (JP) | 2008-06-05 | — | — | US | disclosed |
| US-20030232165-A1 | Surface protective film for adhesive resin and process for producing the same | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-12-18 | — | — | US | disclosed |
| US-20020025431-A1 | Tape automated bonding (TAB); adhesive strength, moderate elastic modulus and coefficient of expansion; adhesive layer of a thermoplastic resin and a polyepoxide having skeleton containing one of dicyclopentadiene, terpene, or biphenyl | TORAY INDUSTRIES | 2002-02-28 | — | — | US | disclosed |
| US-6307008-B1 | CYCLIC TETRAACIDS WITH AROMATIC DIAMINES AS ADHESIVES FOR SEMICONDUCTORS AND ADHESIVES | SAEHAN INDUSTRIES CORPORATION (KR) | 2001-10-23 | — | — | US | disclosed |
| US-6303219-B1 | USED FOR MOUNTING A SEMICONDUCTOR INTEGRATED CIRCUIT; STRENGTH; RELIABILITY | TORAY INDUSTRIES, INC. (JP) | 2001-10-16 | — | — | US | disclosed |
| US-5847071-A | Photosensitive resin composition | HITACHI, CHEMICAL CO., LTD. (JP) | 1998-12-08 | — | — | US | disclosed |
| EP-0823729-A1 | ADHESIVE SHEET FOR SEMICONDUCTOR CONNECTING SUBSTRATE, ADHESIVE-BACKED TAPE FOR TAB, ADHESIVE-BACKED TAPE FOR WIRE-BONDING CONNECTION, SEMICONDUCTOR CONNECTING SUBSTRATE, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 1998-02-11 | — | — | EP | disclosed |
| US-5668248-A | POLYAMIC ACID ESTERS | HITACHI CHEMICAL CO., LTD. (JP) | 1997-09-16 | — | — | US | disclosed |
| EP-0705863-A1 | Two stage melt polymerization process for making polybenzimidazoles | HOECHST CELANESE CORPORATION (US) | 1996-04-10 | — | — | EP | disclosed |
| US-5472823-A | Polyamic acids | HITACHI CHEMICAL CO., LTD. (JP) | 1995-12-05 | — | — | US | disclosed |
| US-4717764-A | Two stage melt polymerization process for making polymers containing aromatic amide groups | CELANESE CORPORATION (US) | 1988-01-05 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260035513-A1 | RESIN COMPOSITION, REINFORCED COMPOSITE MATERIAL, SHAPED PRODUCT, AND METHOD OF RECOVERING REINFORCING FIBER FROM REINFORCED COMPOSITE MATERIAL | TAF1, TAF1L, TAF9 | HTR6 2574/4885PKM 4046/4885ALDH1A1 2356/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.