SCHEMBL729501

SCHEMBL729501

c1cc(OCC2CO2)c2cccc(OCC3CO3)c2c1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.65
GLA P06280 1/20 0.65
TP53 P04637 3/20 0.58
TSHR P16473 3/20 0.58
HIF1A Q16665 2/20 0.58
CYP3A4 P08684 1/20 0.58
SMN1; SMN2 Q16637 1/20 0.58
TDP1 Q9NUW8 1/20 0.55
PDK1 Q15118 1/20 0.44
PKM P14618 3/20 0.43
MAPT P10636 2/20 0.43
HPGD P15428 2/20 0.43
MEN1 O00255 2/20 0.43
KMT2A Q03164 2/20 0.43
CYP1A2 P05177 1/20 0.43
PPARG P37231 1/20 0.43
LMNA P02545 1/20 0.43
GAA P10253 1/20 0.43
SLC6A2 P23975 2/20 0.40
HTR2A P28223 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19859437 0.92 ALDH1A1 (0.65) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL29417583 0.92 ALDH1A1 (0.65) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL1715947 0.92 ALDH1A1 (0.65) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL18789871 0.91 ALDH1A1 (0.70) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL16557207 0.91 ALDH1A1 (0.56) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL17996084 0.90 ALDH1A1 (0.54) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL11084313 0.90 ALDH1A1 (0.54) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL5026215 0.89 ALDH1A1 (0.62) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL5433989 0.89 ALDH1A1 (0.62) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL29402954 0.89 ALDH1A1 (0.62) ALDH1A1GLATP53TSHRHIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 183 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-4325515-A None JP disclosed
JP-4306224-A None JP disclosed
JP-4306223-A None JP disclosed
US-20260078256-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT POLYPLASTICS-EVONIK CORPORATION (JP) 2026-03-19 US disclosed
EP-4663696-A2 POLYAMIDE PARTICLES, PRODUCTION PROCESS THEREFOR, RESIN COMPOSITION, AND MOLDED ARTICLE Polyplastics-Evonik Corporation (JP) 2025-12-17 EP disclosed
EP-3489282-B1 POLYAMIDE PARTICLES, PRODUCTION PROCESS THEREFOR, RESIN COMPOSITION, AND MOLDED ARTICLE POLYPLASTICS EVONIK CORP (JP) 2025-10-01 EP disclosed
EP-4624533-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT Polyplastics-Evonik Corporation (JP) 2025-10-01 EP disclosed
EP-4606839-A2 PROCESS FOR PRODUCING A RESIN COMPOSITION Polyplastics-Evonik Corporation (JP) 2025-08-27 EP disclosed
EP-3467015-B1 PROCESS FOR PRODUCING A RESIN COMPOSITION POLYPLASTICS EVONIK CORP (JP) 2025-06-11 EP disclosed
CN-112724596-B Curable composition and cured product 盛势达技研株式会社 2025-04-18 CN disclosed
EP-0501734-B1 Epoxy resin composition for encapsulating a semiconductor device TORAY INDUSTRIES (JP) 1997-10-15 EP disclosed
US-5567749-A CURABLE DIGLYCIDYL BIPHENYL AND NAPHTHALENE COMPOUND WITH ONE OR MORE POLYPHENOL COMPOUND CURING AGENT TO FORM POLYEPOXIDES; WATERPROOFING, NONCRACKING TORAY INDUSTRIES, INC. 1996-10-22 US disclosed
EP-0450944-B1 An epoxy resin composition for encapsulating a semiconductor device TORAY INDUSTRIES (JP) 1995-10-11 EP disclosed
US-5360837-A Semiconductor device-encapsulating epoxy resin composition TORAY INDUSTRIES, INC. (JP) 1994-11-01 US disclosed
JP-H04325515-A RESIN COMPOSITION FOR SEMICONDUCTOR SEALING TORAY IND INC 1992-11-13 JP disclosed
JP-H04306223-A EPOXY RESIN COMPOSITION TORAY IND INC 1992-10-29 JP disclosed
JP-H04306224-A EPOXY RESIN COMPOSITION TORAY IND INC 1992-10-29 JP disclosed
EP-0501734-A2 Semiconductor device-encapsulating epoxy resin composition TORAY INDUSTRIES, INC. (JP) 1992-09-02 EP disclosed
EP-0450944-A2 An epoxy resin composition for encapsulating a semiconductor device TORAY INDUSTRIES, INC. (JP) 1991-10-09 EP disclosed
US-3960980-A Method of producing elastomer resins BRIDGESTONE TIRE COMPANY LIMITED (JA) 1976-06-01 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260078256-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT MACF1, GIGYF2, YIF1A ALDH1A1 1490/4885GLA 1560/4885TP53 4705/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.