SCHEMBL739150

SCHEMBL739150

C=CC(=O)CCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Succinic Acid SCHEMBL28525310 0.89 LMNA (0.45)
SCHEMBL3629050 0.83 TSHR (0.56)
SCHEMBL806370 0.82
SCHEMBL9575278 0.80
SCHEMBL11666292 0.78 GPR84 (0.50)
SCHEMBL5935197 0.78 GPR84 (0.50)
SCHEMBL1988202 0.78 ALDH1A1 (0.50)
SCHEMBL6557587 0.78 ALDH1A1 (0.50)
SCHEMBL23631357 0.75 TSHR (0.48)
SCHEMBL22492168 0.75 TSHR (0.48)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 203 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119490653-A Photosensitive polyesteramide, preparation method, composition, polyimide film and application thereof 深圳职业技术大学 2025-02-21 CN claimed
CN-117555204-B Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board 明士(北京)新材料开发有限公司 2024-04-26 CN claimed
CN-117186403-B Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-117430812-B Photosensitive polyamic acid ester resin, resin composition and application 明士(北京)新材料开发有限公司 2024-03-19 CN claimed
CN-117555204-A Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board 明士(北京)新材料开发有限公司 2024-02-13 CN claimed
CN-117430812-A Photosensitive polyamic acid ester resin, resin composition and application 明士(北京)新材料开发有限公司 2024-01-23 CN claimed
CN-117384378-A Photosensitive polyamic acid ester resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2024-01-12 CN claimed
CN-116836388-B Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-15 CN claimed
CN-117186403-A Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-08 CN claimed
CN-116577965-B Negative photosensitive solid adhesive film and preparation method thereof 明士(北京)新材料开发有限公司 2023-10-03 CN claimed
CN-116836388-A Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-10-03 CN claimed
CN-116577965-A Negative photosensitive solid adhesive film and preparation method thereof 明士(北京)新材料开发有限公司 2023-08-11 CN claimed
CN-115437218-A Photosensitive resin with symmetrical and asymmetrical structures and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-12-06 CN claimed
CN-114995060-B Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-11-01 CN claimed
CN-114995060-A Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-09-02 CN claimed
CN-114280887-A Negative photosensitive solid glue film developed by alkaline water system and preparation method thereof 明士(北京)新材料开发有限公司 2022-04-05 CN claimed
US-5736068-A Triphenylene compounds and preparation of discotic liquid crystalline crosslinked polymers BASF AKTIENGESELLSCHAFT (DE) 1998-04-07 US claimed
JP-57072934-A None JP disclosed
JP-S5772934-A PREPARATION OF CYCLOPENETENONE DERVIATIVE SUMITOMO CHEM CO LTD 1982-05-07 JP disclosed
US-4133813-A Cyclic nitrile carbonate-containing compounds ATLANTIC RICHFIELD COMPANY (US) 1979-01-09 US disclosed