SCHEMBL7476323

SCHEMBL7476323

[CH2]CN(C(C)C)S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.42

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
MMP1 P03956 11/20 0.42
MMP2 P08253 11/20 0.42
MMP9 P14780 11/20 0.42
MMP8 P22894 11/20 0.42
MMP13 P45452 11/20 0.42
CA2 P00918 9/20 0.42
CA1 P00915 8/20 0.42
F2 P00734 2/20 0.33
PRSS1 P07477 2/20 0.33
PRSS2 P07478 2/20 0.33
PRSS3 P35030 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6858453 0.78 CA2 (0.41) MMP1MMP2MMP9MMP8MMP13
SCHEMBL6864009 0.78 CA2 (0.41) MMP1MMP2MMP9MMP8MMP13
SCHEMBL6858456 0.78 CA2 (0.41) MMP1MMP2MMP9MMP8MMP13
SCHEMBL7624695 0.78 CA2 (0.41) MMP1MMP2MMP9MMP8MMP13
SCHEMBL5143705 0.77 CA2 (0.43) MMP1MMP2MMP9MMP8MMP13
SCHEMBL10506021 0.76 MMP1 (0.43) MMP1MMP2MMP9MMP8MMP13
SCHEMBL4936152 0.76 CA2 (0.38) MMP1MMP2MMP9MMP8MMP13
SCHEMBL7630351 0.75 CA2 (0.38) MMP1MMP2MMP9MMP8MMP13
SCHEMBL1524219 0.75 CA2 (0.38) MMP1MMP2MMP9MMP8MMP13
SCHEMBL6864920 0.75 CA2 (0.38) MMP1MMP2MMP9MMP8MMP13

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115175952-A Aqueous resin composition, aqueous coating material, and coated article DIC株式会社 2022-10-11 CN disclosed
EP-1167476-B1 Aqueous curable resin composition DAINIPPON INK & CHEMICALS (JP) 2013-04-17 EP disclosed
US-6482890-B2 TWO-PACK AQUEOUS CURABLE RESIN COMPRISING AQUEOUS DISPERSION CONTAINING GEL-LIKE RESIN PARTICLES HAVING FUNCTIONAL GROUP SELECTED FROM SALT OF TERTIARY AMINO GROUP AND SALT OF ACID GROUP, COMPOUND HAVING EPOXY AND HYDROLYZABLE SILYL GROUPS DAINIPPON INK AND CHEMICAL, INC. (JP) 2002-11-19 US disclosed
US-20020045683-A1 Aqueous curable resin composition DAINIPPON INK AND CHEMICAL, INC. (JP) 2002-04-18 US disclosed
EP-1167476-A1 Aqueous curable resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 2002-01-02 EP disclosed