SCHEMBL7536066

SCHEMBL7536066

CCCc1ccc(/C=C/c2ccccc2)cc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RELA Q04206 3/20 0.52
TRPA1 O75762 1/20 0.47
MAOB P27338 2/20 0.46
NFE2L2 Q16236 1/20 0.46
CYP19A1 P11511 1/20 0.46
MAOA P21397 1/20 0.46
CYP24A1 Q07973 1/20 0.45
CYP1A2 P05177 2/20 0.44
CYP3A4 P08684 1/20 0.44
THPO P40225 1/20 0.44
HIF1A Q16665 1/20 0.44
MTOR P42345 1/20 0.44
RAB9A P51151 1/20 0.44
CHAT P28329 2/20 0.43
PPARG P37231 2/20 0.43
PPARA Q07869 2/20 0.43
KDM4E B2RXH2 2/20 0.43
ALDH1A1 P00352 2/20 0.43
GMNN O75496 1/20 0.43
LMNA P02545 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6546309 1.00 RELA (0.52) RELATRPA1MAOBNFE2L2CYP19A1
SCHEMBL14003991 0.89 RELA (0.52) RELATRPA1MAOBNFE2L2CYP19A1
SCHEMBL7538660 0.88 HSD11B1 (0.49) RELATRPA1CYP3A4PPARGPPARA
SCHEMBL30312758 0.88 HSD11B1 (0.49) RELATRPA1CYP3A4PPARGPPARA
SCHEMBL6546888 0.88 HSD11B1 (0.49) RELATRPA1CYP3A4PPARGPPARA
SCHEMBL7539291 0.86 CYSLTR2 (0.53) RELATRPA1CYP3A4HIF1AKDM4E
SCHEMBL7539299 0.86 CYSLTR2 (0.53) RELATRPA1CYP3A4HIF1AKDM4E
SCHEMBL14003993 0.85 RELA (0.47) RELATRPA1CYP24A1KDM4EALDH1A1
SCHEMBL7537271 0.84 HTR2A (0.54) TRPA1CYP3A4HIF1AKDM4EALDH1A1
SCHEMBL7537266 0.84 HTR2A (0.54) TRPA1CYP3A4HIF1AKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20020015906-A1 Polymer for photoresist, method of production thereof and photoresist composition containing polymer SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-02-07 US disclosed