Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CTNNB1 | P35222 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 2/20 | 0.47 |
| ▸ | GAA | P10253 | 1/20 | 0.47 |
| ▸ | ESRRA | P11474 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.44 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.44 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
| ▸ | NPC1 | O15118 | 1/20 | 0.44 |
| ▸ | HPGD | P15428 | 1/20 | 0.44 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.44 |
| ▸ | RAB9A | P51151 | 1/20 | 0.44 |
| ▸ | NFKB2 | Q00653 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.44 |
| ▸ | RELA | Q04206 | 1/20 | 0.44 |
| ▸ | BRD4 | O60885 | 1/20 | 0.43 |
| ▸ | MMP2 | P08253 | 1/20 | 0.43 |
| ▸ | PARP10 | Q53GL7 | 1/20 | 0.42 |
| ▸ | CFTR | P13569 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31372448 | 0.98 | CTNNB1 (0.46) | CTNNB1MAPTGAAESRRAALDH1A1 | |
| SCHEMBL28482644 | 0.98 | CTNNB1 (0.46) | CTNNB1MAPTGAAESRRAALDH1A1 | |
| SCHEMBL27737105 | 0.92 | MAPT (0.61) | CTNNB1MAPTGAAESRRAALDH1A1 | |
| SCHEMBL1464919 | 0.89 | MMP2 (0.52) | CTNNB1MAPTGAAESRRAALDH1A1 | |
| SCHEMBL9859607 | 0.88 | MAPT (0.61) | MAPTGAAALDH1A1HSD17B10MEN1 | |
| SCHEMBL25437438 | 0.86 | CTNNB1 (0.45) | CTNNB1MAPTGAAESRRAALDH1A1 | |
| SCHEMBL8586971 | 0.83 | MAPT (0.46) | CTNNB1MAPTGAAESRRAALDH1A1 | |
| SCHEMBL28609067 | 0.81 | CTNNB1 (0.42) | CTNNB1MAPTGAAESRRAALDH1A1 | |
| SCHEMBL10390477 | 0.81 | AKR1C3 (0.60) | MAPTGAAKDM4ENPC1RAB9A | |
| SCHEMBL7776603 | 0.80 | LTA4H (0.52) | MAPTGAAALDH1A1SMN1; SMN2KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025127140-A1 | COMPOSITION | ダイキン工業株式会社 | 2025-06-19 | — | — | WO | disclosed |
| CN-108690193-B | Polyimide, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-108690552-B | Adhesive, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2022-04-19 | — | — | CN | disclosed |
| CN-107793991-B | Copper-clad laminate for flexible printed wiring board, and flexible printed wiring board | 荒川化学工业株式会社 | 2022-03-08 | — | — | CN | disclosed |
| CN-112011308-A | Composition, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2020-12-01 | — | — | CN | disclosed |
| EP-0729996-B1 | Polyimide and process for producing the same | TOMOEGAWA PAPER CO LTD (JP) | 2002-06-12 | — | — | EP | disclosed |
| US-6184337-B1 | HEAT RESISTANCE; FOR USE IN SEMICONDUCTORS | TOMOEGAWA PAPER CO., LTD. (JP) | 2001-02-06 | — | — | US | disclosed |
| US-5851616-A | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO., LTD. (JP) | 1998-12-22 | — | — | US | disclosed |
| US-5725948-A | POLYIMIDE FROM A BISMALEIMIDE AND A DIAMINE | TOMOEGAWA PAPER CO., LTD. (JP) | 1998-03-10 | — | — | US | disclosed |
| US-5696235-A | CONTAINING A BISMALEIMIDE; HEAT RESISTANCE, PROCESSABILITY; SOLUBLE IN VARIOUS ORGANIC SOLVENTS | TOMOEGAWA PAPER CO., LTD. (JP) | 1997-12-09 | — | — | US | disclosed |
| US-5663287-A | SOLUBLE IN ORGANIC SOLVENTS AND EXCELS IN HEAT RESISTANCE | TOMOEGAWA PAPER CO., LTD. (JP) | 1997-09-02 | — | — | US | disclosed |
| US-5608013-A | Polyimides and thermosetting resin compositions containing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1997-03-04 | — | — | US | disclosed |
| EP-0729996-A1 | Polyimide and process for producing the same | TOMOEGAWA PAPER CO. LTD. (JP) | 1996-09-04 | — | — | EP | disclosed |
| EP-0456515-B1 | Polyimides and thermosetting resin compositions containing the same | HITACHI CHEMICAL CO LTD (JP) | 1995-11-08 | — | — | EP | disclosed |
| EP-0456515-A1 | Polyimides and thermosetting resin compositions containing the same | Hitachi Chemical Co., Ltd. (JP) | 1991-11-13 | — | — | EP | disclosed |