Terephthalic Acid

Terephthalic Acid

SCHEMBL7550600

NCCCCCCN.O=C(O)CCCCC(=O)O.O=C(O)c1ccc(C(=O)O)cc1.O=C(O)c1cccc(C(=O)O)c1

nearest known ligand 0.55

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

OPRM1

The experimentally established mechanism targets of Terephthalic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 4/20 0.55
KMT2A Q03164 3/20 0.55
THRB P10828 2/20 0.55
MEN1 O00255 2/20 0.55
ALDH1A1 P00352 1/20 0.55
PLG P00747 1/20 0.55
ALOX15 P16050 1/20 0.55
SLC6A2 P23975 1/20 0.55
RECQL P46063 1/20 0.55
SLC6A3 Q01959 1/20 0.55
CYP2D6 P10635 1/20 0.52
NFKB1 P19838 1/20 0.52
BLM P54132 2/20 0.50
NPSR1 Q6W5P4 2/20 0.50
HDAC3 O15379 2/20 0.50
HDAC4 P56524 2/20 0.50
HDAC1 Q13547 2/20 0.50
HDAC7 Q8WUI4 2/20 0.50
HDAC2 Q92769 2/20 0.50
HDAC10 Q969S8 2/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Isophthalic Acid SCHEMBL6753323 0.97 LMNA (0.59) LMNAKMT2ATHRBMEN1ALDH1A1
Azelaic Acid SCHEMBL11379325 0.92 HDAC3 (0.58) LMNAKMT2AMEN1HDAC3HDAC4
Terephthalic Acid SCHEMBL3128260 0.92 UNG (0.49) KMT2AMEN1UNGCYP1A2TSHR
Sebacic Acid SCHEMBL5669870 0.92 HDAC3 (0.58) LMNAKMT2AMEN1HDAC3HDAC4
Sebacic Acid SCHEMBL5165477 0.92 HDAC3 (0.58) LMNAKMT2AMEN1HDAC3HDAC4
Terephthalic Acid SCHEMBL261197 0.90 LMNA (0.68) LMNAKMT2ATHRBMEN1ALDH1A1
Terephthalic Acid SCHEMBL3334284 0.90 HDAC3 (0.55) KMT2AMEN1HDAC3HDAC4HDAC1
Terephthalic Acid SCHEMBL262199 0.90 LMNA (0.68) LMNAKMT2ATHRBMEN1ALDH1A1
Terephthalic Acid SCHEMBL11416033 0.90 LMNA (0.68) LMNAKMT2ATHRBMEN1ALDH1A1
Azelaic Acid SCHEMBL10980744 0.88 HDAC3 (0.62) LMNANFKB1HDAC3HDAC4HDAC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20020084654-A1 Resin connector TOKAI RUBBER INDUSTRIES, LTD. (JP) 2002-07-04 US claimed
CN-115279833-B Polyamide resin composition 东洋纺MC株式会社 2024-05-17 CN disclosed
US-20220411581-A1 SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND METAL-PLATED MOLDED BODY TOYOBO CO., LTD. (JP) 2022-12-29 US disclosed
CN-115279833-A Polyamide resin composition 东洋纺株式会社 2022-11-01 CN disclosed
CN-111133038-B Molded article comprising semi-aromatic polyamide resin composition as component 东洋纺株式会社 2022-10-14 CN disclosed
CN-114585688-A Semi-aromatic polyamide resin composition and metal plating molded body 东洋纺株式会社 2022-06-03 CN disclosed
WO-2020166482-A1 CARBON FIBER-REINFORCED POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF 東洋紡株式会社 2020-08-20 WO disclosed
CN-111133038-A Molded article comprising semi-aromatic polyamide resin composition as component 东洋纺株式会社 2020-05-08 CN disclosed
US-10072137-B2 Polyamide resin composition having high melt point and being excellent in anti-vibration property upon water absorption TOYOBO CO., LTD. (JP) 2018-09-11 US disclosed
US-20160130424-A1 POLYAMIDE RESIN COMPOSITION HAVING HIGH MELT POINT AND BEING EXCELLENT IN ANTI-VIBRATION PROPERTY UPON WATER ABSORPTION TOYOBO CO., LTD. (JP) 2016-05-12 US disclosed
US-20020084654-A1 Resin connector TOKAI RUBBER INDUSTRIES, LTD. (JP) 2002-07-04 US disclosed