SCHEMBL756606

SCHEMBL756606

CCCCCCCCCCCCCC(C(=O)[O-])C(O)(CCCCCCCCCCCCC)C(=O)[O-].CCCC[Sn+2]CCCC

nearest known ligand 0.43

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
HSPD1 P10809 1/20 0.43
BLM P54132 1/20 0.43
HSPE1 P61604 1/20 0.43
CA2 P00918 1/20 0.41
CA1 P00915 2/20 0.39
MEN1 O00255 1/20 0.37
HPGD P15428 1/20 0.37
RECQL P46063 1/20 0.37
KMT2A Q03164 1/20 0.37
HSD17B10 Q99714 1/20 0.37
USP2 O75604 1/20 0.36
LMNA P02545 1/20 0.36
GPR84 Q9NQS5 5/20 0.35
CES2 O00748 1/20 0.34
FFAR4 Q5NUL3 1/20 0.33
FFAR1 O14842 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL673661 1.00 HSPD1 (0.43) HSPD1BLMHSPE1CA2CA1
SCHEMBL673039 0.97 HSPD1 (0.43) HSPD1BLMHSPE1CA2CA1
SCHEMBL756681 0.92 CA2 (0.37) HSPD1BLMHSPE1CA2CA1
SCHEMBL675591 0.86 HSPD1 (0.42) HSPD1BLMHSPE1CA2CA1
SCHEMBL673116 0.86 HSPD1 (0.43) HSPD1BLMHSPE1CA2CA1
SCHEMBL673787 0.86 CA2 (0.44) HSPD1BLMHSPE1CA2CA1
SCHEMBL673597 0.80 HSPD1 (0.40) HSPD1BLMHSPE1
SCHEMBL674661 0.80 HSPD1 (0.41) HSPD1BLMHSPE1CA2MEN1
SCHEMBL9492990 0.80 HSPD1 (0.51) HSPD1BLMHSPE1CA2CA1
SCHEMBL29959755 0.78 HSPD1 (0.39) HSPD1BLMHSPE1CA2CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240262965-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2024-08-08 US disclosed
WO-2023068083-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-04-27 WO disclosed
WO-2023013487-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-02-09 WO disclosed
WO-2021256180-A1 URETHANE ADHESIVE COMPOSITION シーカ・ハマタイト株式会社 2021-12-23 WO disclosed
US-20210087438-A1 ADHESIVE COMPOSITION FOR BATTERIES AND ADHESIVE MEMBER FOR BATTERIES USING SAME TOAGOSEI CO., LTD. (JP) 2021-03-25 US disclosed
WO-2019203034-A1 BUILDING HAVING WALL STRUCTURE AND METHOD FOR PRODUCING WALL STRUCTURE セメダイン株式会社 2019-10-24 WO disclosed
EP-3178872-B1 MODIFIED SILICONE RESIN FOAMED BODY KANEKA CORP (JP) 2019-06-19 EP disclosed
US-20170226305-A1 MODIFIED SILICONE RESIN FOAMED BODY KANEKA CORPORATION (JP) 2017-08-10 US disclosed
EP-3178872-A1 MODIFIED SILICONE RESIN FOAMED BODY Kaneka Corporation (JP) 2017-06-14 EP disclosed
EP-1642932-B1 CURING COMPOSITION KANEKA CORP (JP) 2012-03-21 EP disclosed
US-20060135709-A1 Curing composition KANEKA CORPORATION (JP) 2006-06-22 US disclosed
EP-1642932-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-04-05 EP disclosed
EP-1637565-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-03-22 EP disclosed
EP-1619219-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-01-25 EP disclosed
EP-1057861-B1 Use of a crosslinked product as a heat-sensitive elastic adhesive KANEKA CORP (JP) 2004-11-24 EP disclosed
EP-1004628-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2004-02-25 EP disclosed
US-6426392-B1 REACTING/CROSSLINKING ISOBUTYLENE AND DIALKYLTIN DIALKOXIDE; FOR USE AS SEALING; WORKABILITY, MATERIALS HANDLING; RECYCLABILITY; HIGH STRESS RELAXATION AND LOW MEMORY CHARACTERISTICS KANEKA CORPORATION (JP) 2002-07-30 US disclosed
US-6335412-B1 POLYSILOXANE-MODIFIED ISOBUTYLENE POLYMERS AS SEALANTS KANEKA CORPORATION (JP) 2002-01-01 US disclosed
EP-1057861-A2 Thermoplastic crosslinked product and heat-sensitive elastic adhesive KANEKA CORPORATION (JP) 2000-12-06 EP disclosed
EP-1004628-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2000-05-31 EP disclosed