SCHEMBL756681

SCHEMBL756681

CCCCC(C(=O)[O-])C(O)(CCCC)C(=O)[O-].CCCC[Sn+2]CCCC

nearest known ligand 0.37

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CA2 P00918 4/20 0.37
HSPD1 P10809 1/20 0.36
BLM P54132 1/20 0.36
HSPE1 P61604 1/20 0.36
CA1 P00915 2/20 0.34
CYP3A4 P08684 2/20 0.31
TSHR P16473 2/20 0.31
NFKB1 P19838 2/20 0.31
NPSR1 Q6W5P4 2/20 0.31
MEN1 O00255 1/20 0.31
HPGD P15428 1/20 0.31
RECQL P46063 1/20 0.31
KMT2A Q03164 1/20 0.31
HSD17B10 Q99714 1/20 0.31
USP2 O75604 1/20 0.30
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL756606 0.92 HSPD1 (0.43) CA2HSPD1BLMHSPE1CA1
SCHEMBL673661 0.92 HSPD1 (0.43) CA2HSPD1BLMHSPE1CA1
SCHEMBL673039 0.89 HSPD1 (0.43) CA2HSPD1BLMHSPE1CA1
SCHEMBL755930 0.79 CA2 (0.35) CA2CA1
SCHEMBL675591 0.78 HSPD1 (0.42) CA2HSPD1BLMHSPE1CA1
SCHEMBL673116 0.77 HSPD1 (0.43) CA2HSPD1BLMHSPE1CA1
SCHEMBL673787 0.77 CA2 (0.44) CA2HSPD1BLMHSPE1CA1
SCHEMBL9492990 0.73 HSPD1 (0.51) CA2HSPD1BLMHSPE1CA1
SCHEMBL673597 0.72 HSPD1 (0.40) HSPD1BLMHSPE1
SCHEMBL29960453 0.72 HSPD1 (0.39) CA2HSPD1BLMHSPE1CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240262965-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2024-08-08 US disclosed
CN-111989379-B Building with wall structure and method for manufacturing wall structure 思美定株式会社 2024-02-20 CN disclosed
WO-2023068083-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-04-27 WO disclosed
WO-2023048155-A1 ONE-PACK TYPE CURABLE COMPOSITION AND CURED PRODUCT 株式会社カネカ 2023-03-30 WO disclosed
WO-2023013487-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-02-09 WO disclosed
WO-2022203064-A1 (METH)ACRYLIC ACID ESTER-BASED COPOLYMER AND CURABLE COMPOSITION 株式会社カネカ 2022-09-29 WO disclosed
CN-115038753-A Composition, curable composition, cured product and storage method 株式会社钟化 2022-09-09 CN disclosed
WO-2021256180-A1 URETHANE ADHESIVE COMPOSITION シーカ・ハマタイト株式会社 2021-12-23 WO disclosed
WO-2020196228-A1 CURABLE COMPOSITION AND CURED PRODUCT 株式会社カネカ 2020-10-01 WO disclosed
WO-2019203034-A1 BUILDING HAVING WALL STRUCTURE AND METHOD FOR PRODUCING WALL STRUCTURE セメダイン株式会社 2019-10-24 WO disclosed
US-20060135709-A1 Curing composition KANEKA CORPORATION (JP) 2006-06-22 US disclosed
EP-1642932-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-04-05 EP disclosed
EP-1637565-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-03-22 EP disclosed
EP-1619219-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-01-25 EP disclosed
EP-1057861-B1 Use of a crosslinked product as a heat-sensitive elastic adhesive KANEKA CORP (JP) 2004-11-24 EP disclosed
EP-1004628-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2004-02-25 EP disclosed
US-6426392-B1 REACTING/CROSSLINKING ISOBUTYLENE AND DIALKYLTIN DIALKOXIDE; FOR USE AS SEALING; WORKABILITY, MATERIALS HANDLING; RECYCLABILITY; HIGH STRESS RELAXATION AND LOW MEMORY CHARACTERISTICS KANEKA CORPORATION (JP) 2002-07-30 US disclosed
US-6335412-B1 POLYSILOXANE-MODIFIED ISOBUTYLENE POLYMERS AS SEALANTS KANEKA CORPORATION (JP) 2002-01-01 US disclosed
EP-1057861-A2 Thermoplastic crosslinked product and heat-sensitive elastic adhesive KANEKA CORPORATION (JP) 2000-12-06 EP disclosed
EP-1004628-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2000-05-31 EP disclosed