SCHEMBL757811

SCHEMBL757811

O=C(O)c1ccc(-c2cccc3c2C(=O)OC3=O)cc1C(=O)O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TYMS P04818 1/20 0.50
ACMSD Q8TDX5 5/20 0.42
MCL1 Q07820 3/20 0.42
FABP4 P15090 6/20 0.40
HNF4A P41235 3/20 0.40
ALDH1A1 P00352 2/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
LMNA P02545 1/20 0.39
MAPT P10636 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C9 P11712 1/20 0.39
TSHR P16473 1/20 0.39
CYP2C19 P33261 1/20 0.39
SOS1 Q07889 1/20 0.39
HIF1A Q16665 1/20 0.39
FTO Q9C0B1 1/20 0.37
DHFR P00374 1/20 0.37
CDC25A P30304 1/20 0.37
CDC25B P30305 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10036095 0.84 TYMS (0.44) TYMSACMSDMCL1FABP4HNF4A
SCHEMBL14321815 0.83 TYMS (0.49) TYMSACMSDMCL1FABP4HNF4A
SCHEMBL1142632 0.79 TYMS (0.50) TYMSACMSDMCL1HNF4AALDH1A1
SCHEMBL5177942 0.79 TTR (0.47) TYMSHNF4AL3MBTL1TSHR
SCHEMBL1245664 0.78 TYMS (0.50) TYMSACMSDMCL1HNF4ADHFR
SCHEMBL617136 0.78 ALDH1A1 (0.56) TYMSHNF4AALDH1A1L3MBTL1LMNA
SCHEMBL1246295 0.78 TYMS (0.49) TYMSACMSDMCL1HNF4AL3MBTL1
SCHEMBL14956911 0.77 TYMS (0.47) TYMSACMSDMCL1HNF4ACYP1A2
SCHEMBL9281315 0.77 ACMSD (0.56) ACMSDMCL1HNF4AALDH1A1DHFR
SCHEMBL31416073 0.77 TDP1 (0.52) TYMSHNF4AALDH1A1L3MBTL1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150145106-A1 ELECTRONIC DEVICE MANUFACTURE USING LOW-k DIELECTRIC MATERIALS ASPEN AEROGELS, INC. 2015-05-28 US claimed
US-20130279126-A1 AROMATIC POLYIMIDE FILM, MANUFACTURING METHOD AND APPLICATION THEREOF TAIMIDE TECHNOLOGY INCORPORATION (TW) 2013-10-24 US claimed
EP-0040042-B1 PROCESS FOR PRODUCING AROMATIC POLYIMIDE FILAMENTS UBE INDUSTRIES, LTD. (JP) 1984-10-10 EP claimed
US-4460526-A Process for producing aromatic polyimide hollow filaments UBE INDUSTRIES, LTD. (JP) 1984-07-17 US claimed
US-4370290-A PREPARING A SPINNING DOPE SOLUTION, EXTRUSION, SOLIDIFYING AND DRAWING UBE INDUSTRIES, LTD. (JP) 1983-01-25 US claimed
EP-0040042-A2 Process for producing aromatic polyimide filaments UBE INDUSTRIES, LTD. (JP) 1981-11-18 EP claimed
JP-11237760-A None JP disclosed
WO-2023157770-A1 COMPOUND PRODUCTION METHOD 株式会社カネカ 2023-08-24 WO disclosed
CN-112940250-B Photosensitive resin composition and photosensitive resin film 武汉柔显科技股份有限公司 2022-09-23 CN disclosed
CN-112940250-A Resin, photosensitive resin composition, and photosensitive resin film 武汉柔显科技股份有限公司 2021-06-11 CN disclosed
US-10065969-B2 Method for producing carboxylic acid anhydride, method for producing carboxylic imide, and method for manufacturing electrophotographic photosensitive member CANON KABUSHIKI KAISHA (JP) 2018-09-04 US disclosed
US-20160376285-A1 METHOD FOR PRODUCING CARBOXYLIC ACID ANHYDRIDE, METHOD FOR PRODUCING CARBOXYLIC IMIDE, AND METHOD FOR MANUFACTURING ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER CANON KABUSHIKI KAISHA (JP) 2016-12-29 US disclosed
US-20150175740-A1 PROCESSING-FRIENDLY DIANHYDRIDE HARDENER FOR EPOXY RESIN SYSTEMS BASED ON 5,5'-CARBONYLBIS(ISOBENZOFURAN-1,3-DIONE) EVONIK INDUSTRIES AG (DE) 2015-06-25 US disclosed
US-7001970-B2 Method of manufacturing an enamel having a low coefficient of friction, and an electrical conductor coated in such an enamel ESSEX EUROPE (FR) 2006-02-21 US disclosed
US-20050214675-A1 Positive-type photosensitive composition FUJI PHOTO FILM CO., LTD. 2005-09-29 US disclosed
EP-1577111-A1 Positive-type photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2005-09-21 EP disclosed
US-20030215650-A1 Method of manufacturing an enamel having a low coefficient of friction, and an electrical conductor coated in such an enamel ESSEX EUROPE (FR) 2003-11-20 US disclosed
JP-H11237760-A IMAGE FORMING POWDER TONER BROTHER IND LTD 1999-08-31 JP disclosed
US-5460746-A Low temperature fusion, high strength, solvent-free, heat resistant prepregs UBE INDUSTRIES, LTD. (JP) 1995-10-24 US disclosed
US-5460746-A Low temperature fusion, high strength, solvent-free, heat resistant prepregs UBE INDUSTRIES, LTD. (JP) 1995-10-24 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10065969-B2 Method for producing carboxylic acid anhydride, method for producing carboxylic imide, and method for manufacturing electrophotographic photosensitive member CA7, CA4, CA6 TYMS 3363/4885ACMSD 55/4885MCL1 3380/4885
US-20160376285-A1 METHOD FOR PRODUCING CARBOXYLIC ACID ANHYDRIDE, METHOD FOR PRODUCING CARBOXYLIC IMIDE, AND METHOD FOR MANUFACTURING ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER CA7, CA4, CA6 TYMS 3363/4885ACMSD 55/4885MCL1 3380/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.