SCHEMBL758073

SCHEMBL758073

Oc1cccc(C(c2cc(C3CCCCC3)ccc2O)c2cc(C3CCCCC3)ccc2O)c1

nearest known ligand 0.44

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ACMSD Q8TDX5 2/20 0.44
HDAC4 P56524 1/20 0.43
HDAC2 Q92769 1/20 0.43
HDAC8 Q9BY41 1/20 0.43
SLC6A4 P31645 1/20 0.40
OPRM1 P35372 1/20 0.40
KDR P35968 1/20 0.40
SLC6A3 Q01959 1/20 0.40
KMO O15229 1/20 0.39
MGLL Q99685 1/20 0.39
SIGMAR1 Q99720 3/20 0.36
DRD4 P21917 2/20 0.36
DRD3 P35462 2/20 0.36
NFKB1 P19838 1/20 0.36
PRCP P42785 1/20 0.36
EBP Q15125 1/20 0.36
DRD2 P14416 1/20 0.36
OPRD1 P41143 1/20 0.36
OPRK1 P41145 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29375170 1.00 ACMSD (0.44) ACMSDHDAC4HDAC2HDAC8SLC6A4
SCHEMBL2311470 0.86 SLC6A4 (0.41) ACMSDHDAC4HDAC2HDAC8SLC6A4
SCHEMBL759437 0.84 ACMSD (0.48) ACMSDHDAC4HDAC2HDAC8
SCHEMBL29376163 0.84 ACMSD (0.48) ACMSDHDAC4HDAC2HDAC8
SCHEMBL30103811 0.81 SLC6A4 (0.40) HDAC4HDAC2HDAC8SLC6A4OPRM1
SCHEMBL28899040 0.81 SLC6A4 (0.40) HDAC4HDAC2HDAC8SLC6A4OPRM1
SCHEMBL760436 0.80 ACMSD (0.49) ACMSDHDAC4HDAC2HDAC8KMO
SCHEMBL29375107 0.80 ACMSD (0.49) ACMSDHDAC4HDAC2HDAC8KMO
SCHEMBL30899189 0.77 NUDT1 (0.44) HDAC4HDAC2HDAC8SLC6A4OPRM1
SCHEMBL29376176 0.77 NUDT1 (0.44) HDAC4HDAC2HDAC8SLC6A4OPRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116360213-A Resin composition and photoresist patterning method using the same 深圳市容大感光科技股份有限公司 2023-06-30 CN disclosed
CN-109062007-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
CN-108693710-B Positive photosensitive polysiloxane composition 奇美实业股份有限公司 2022-12-02 CN disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 CN disclosed
CN-107870516-B Positive photosensitive resin composition, patterned film and method for manufacturing bump 奇美实业股份有限公司 2022-08-02 CN disclosed
CN-107179652-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2022-02-08 CN disclosed
CN-106154750-B Photosensitive polysiloxane composition, protective film and element with protective film 奇美实业股份有限公司 2021-09-14 CN disclosed
CN-106918989-B Photosensitive polysiloxane composition, protective film and module with protective film 奇美实业股份有限公司 2020-07-31 CN disclosed
CN-105319852-B Photosensitive resin composition, protective film and element with protective film 奇美实业股份有限公司 2020-06-26 CN disclosed
CN-106909028-B Photosensitive resin composition, protective film and liquid crystal display element 奇美实业股份有限公司 2020-06-05 CN disclosed
US-6030741-A SOLVENT CONTAINING A MIXTURE OF HEPATANONE-2, ETHYL ACETATE AND A HIGH BOILING BENZYL SALICYLATE; RESIST PATTERN EXHIBITING PHOTOSENSITIVITY LESS VARIABLE RELATIVE TO ITS THICKNESS; SUPERIOR SHAPE-PROFILING TOKYO OHKA KOGYO CO., LTD. (JP) 2000-02-29 US disclosed
US-5853948-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-12-29 US disclosed
US-5738968-A Positive photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-04-14 US disclosed
US-5728504-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-03-17 US disclosed
US-5702861-A BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-5601961-A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-11 US disclosed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed
US-5478692-A Fine patterning for electronics TOKYO OHKA KOGYO CO., LTD. (JP) 1995-12-26 US disclosed
US-5434031-A Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive TOKYO OHKA KOGYO CO., LTD. (JP) 1995-07-18 US disclosed