Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACMSD | Q8TDX5 | 2/20 | 0.48 |
| ▸ | ESR2 | Q92731 | 12/20 | 0.41 |
| ▸ | DEGS1 | O15121 | 1/20 | 0.40 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.40 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.40 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.40 |
| ▸ | ESR1 | P03372 | 5/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.39 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.39 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.39 |
| ▸ | QDPR | P09417 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29376163 | 1.00 | ACMSD (0.48) | ACMSDESR2DEGS1HDAC4HDAC2 | |
| SCHEMBL22216656 | 0.89 | ESR2 (0.41) | ACMSDESR2DEGS1ESR1CYP3A4 | |
| SCHEMBL2311005 | 0.85 | ESR2 (0.40) | ACMSDESR2DEGS1ESR1CYP3A4 | |
| SCHEMBL29375170 | 0.84 | ACMSD (0.44) | ACMSDHDAC4HDAC2HDAC8 | |
| SCHEMBL758073 | 0.84 | ACMSD (0.44) | ACMSDHDAC4HDAC2HDAC8 | |
| SCHEMBL10296816 | 0.82 | ESR2 (0.55) | ESR2DEGS1ESR1CYP3A4CYP2D6 | |
| SCHEMBL19806871 | 0.82 | ESR2 (0.41) | ACMSDESR2DEGS1ESR1CYP3A4 | |
| SCHEMBL760436 | 0.80 | ACMSD (0.49) | ACMSDHDAC4HDAC2HDAC8QDPR | |
| SCHEMBL29375107 | 0.80 | ACMSD (0.49) | ACMSDHDAC4HDAC2HDAC8QDPR | |
| SCHEMBL4056040 | 0.79 | ACMSD (0.54) | ACMSDESR2HDAC4HDAC2HDAC8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 101 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116360213-A | Resin composition and photoresist patterning method using the same | 深圳市容大感光科技股份有限公司 | 2023-06-30 | — | — | CN | disclosed |
| CN-109062007-B | Positive photosensitive polysiloxane composition and application thereof | 奇美实业股份有限公司 | 2023-03-10 | — | — | CN | disclosed |
| CN-108693710-B | Positive photosensitive polysiloxane composition | 奇美实业股份有限公司 | 2022-12-02 | — | — | CN | disclosed |
| CN-107561863-B | Positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2022-09-16 | — | — | CN | disclosed |
| CN-107870516-B | Positive photosensitive resin composition, patterned film and method for manufacturing bump | 奇美实业股份有限公司 | 2022-08-02 | — | — | CN | disclosed |
| CN-107179652-B | Positive photosensitive polysiloxane composition and application thereof | 奇美实业股份有限公司 | 2022-02-08 | — | — | CN | disclosed |
| CN-106154750-B | Photosensitive polysiloxane composition, protective film and element with protective film | 奇美实业股份有限公司 | 2021-09-14 | — | — | CN | disclosed |
| CN-106918989-B | Photosensitive polysiloxane composition, protective film and module with protective film | 奇美实业股份有限公司 | 2020-07-31 | — | — | CN | disclosed |
| CN-105319852-B | Photosensitive resin composition, protective film and element with protective film | 奇美实业股份有限公司 | 2020-06-26 | — | — | CN | disclosed |
| CN-106909028-B | Photosensitive resin composition, protective film and liquid crystal display element | 奇美实业股份有限公司 | 2020-06-05 | — | — | CN | disclosed |
| US-5853948-A | Positive photoresist compositions and multilayer resist materials using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-12-29 | — | — | US | disclosed |
| US-5738968-A | Positive photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-04-14 | — | — | US | disclosed |
| US-5728504-A | Positive photoresist compositions and multilayer resist materials using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-03-17 | — | — | US | disclosed |
| US-5702861-A | BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-12-30 | — | — | US | disclosed |
| US-5601961-A | QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-02-11 | — | — | US | disclosed |
| US-5576138-A | MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-11-19 | — | — | US | disclosed |
| US-5501936-A | IMPROVED RESOLUTION OF VERY FINE PATTERNS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-03-26 | — | — | US | disclosed |
| US-5478692-A | Fine patterning for electronics | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-12-26 | — | — | US | disclosed |
| US-5434031-A | Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-07-18 | — | — | US | disclosed |
| US-5401605-A | Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-03-28 | — | — | US | disclosed |