SCHEMBL760436

SCHEMBL760436

Oc1ccccc1C(c1cc(C2CCCCC2)ccc1O)c1cc(C2CCCCC2)ccc1O

nearest known ligand 0.49

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ACMSD Q8TDX5 2/20 0.49
HDAC4 P56524 1/20 0.47
HDAC2 Q92769 1/20 0.47
HDAC8 Q9BY41 1/20 0.47
KMO O15229 1/20 0.40
QDPR P09417 3/20 0.39
PDK2 Q15119 1/20 0.39
GABRA1 P14867 1/20 0.35
GABRB2 P47870 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
BACE1 P56817 2/20 0.35
PGAM1 P18669 1/20 0.34
EPHX2 P34913 1/20 0.34
NUDT1 P36639 1/20 0.34
HSP90AA1 P07900 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29375107 1.00 ACMSD (0.49) ACMSDHDAC4HDAC2HDAC8KMO
SCHEMBL2312929 0.88 HDAC4 (0.43) ACMSDHDAC4HDAC2HDAC8KMO
SCHEMBL4056040 0.80 ACMSD (0.54) ACMSDHDAC4HDAC2HDAC8KMO
SCHEMBL29376163 0.80 ACMSD (0.48) ACMSDHDAC4HDAC2HDAC8QDPR
SCHEMBL759437 0.80 ACMSD (0.48) ACMSDHDAC4HDAC2HDAC8QDPR
SCHEMBL758073 0.80 ACMSD (0.44) ACMSDHDAC4HDAC2HDAC8KMO
SCHEMBL29375170 0.80 ACMSD (0.44) ACMSDHDAC4HDAC2HDAC8KMO
SCHEMBL3390002 0.79 ACMSD (0.53) ACMSDHDAC4HDAC2HDAC8KMO
SCHEMBL7804685 0.78 HDAC4 (0.43) ACMSDHDAC4HDAC2HDAC8KMO
SCHEMBL2530090 0.78 HDAC4 (0.39) HDAC4HDAC2HDAC8KMOGABRA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109062007-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
CN-108693710-B Positive photosensitive polysiloxane composition 奇美实业股份有限公司 2022-12-02 CN disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 CN disclosed
CN-107870516-B Positive photosensitive resin composition, patterned film and method for manufacturing bump 奇美实业股份有限公司 2022-08-02 CN disclosed
CN-107179652-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2022-02-08 CN disclosed
CN-106154750-B Photosensitive polysiloxane composition, protective film and element with protective film 奇美实业股份有限公司 2021-09-14 CN disclosed
CN-106918989-B Photosensitive polysiloxane composition, protective film and module with protective film 奇美实业股份有限公司 2020-07-31 CN disclosed
CN-105319852-B Photosensitive resin composition, protective film and element with protective film 奇美实业股份有限公司 2020-06-26 CN disclosed
CN-106909028-B Photosensitive resin composition, protective film and liquid crystal display element 奇美实业股份有限公司 2020-06-05 CN disclosed
CN-106918994-B Photosensitive resin composition for black matrix and application thereof 奇美实业股份有限公司 2020-04-28 CN disclosed
US-6030741-A SOLVENT CONTAINING A MIXTURE OF HEPATANONE-2, ETHYL ACETATE AND A HIGH BOILING BENZYL SALICYLATE; RESIST PATTERN EXHIBITING PHOTOSENSITIVITY LESS VARIABLE RELATIVE TO ITS THICKNESS; SUPERIOR SHAPE-PROFILING TOKYO OHKA KOGYO CO., LTD. (JP) 2000-02-29 US disclosed
US-5853948-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-12-29 US disclosed
US-5738968-A Positive photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-04-14 US disclosed
US-5728504-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-03-17 US disclosed
US-5702861-A BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-5601961-A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-11 US disclosed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed
US-5478692-A Fine patterning for electronics TOKYO OHKA KOGYO CO., LTD. (JP) 1995-12-26 US disclosed
US-5434031-A Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive TOKYO OHKA KOGYO CO., LTD. (JP) 1995-07-18 US disclosed