Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 5/20 | 0.48 |
| ▸ | MAPT | P10636 | 5/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.48 |
| ▸ | HPGD | P15428 | 2/20 | 0.48 |
| ▸ | G6PD | P11413 | 2/20 | 0.48 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.48 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.48 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.48 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.48 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.48 |
| ▸ | PKM | P14618 | 1/20 | 0.48 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.48 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.48 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.48 |
| ▸ | CCR6 | P51684 | 1/20 | 0.48 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.48 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.48 |
| ▸ | MEN1 | O00255 | 2/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5532932 | 0.83 | KDM4E (0.48) | KDM4EMAPTALDH1A1HPGDG6PD | |
| SCHEMBL4388616 | 0.82 | KDM4E (0.68) | KDM4EMAPTALDH1A1HPGDG6PD | |
| SCHEMBL30693660 | 0.82 | KDM4E (0.68) | KDM4EMAPTALDH1A1HPGDG6PD | |
| SCHEMBL4950434 | 0.80 | KDM4E (0.50) | KDM4EMAPTALDH1A1HPGDG6PD | |
| SCHEMBL8894430 | 0.80 | KDM4E (0.50) | KDM4EMAPTALDH1A1HPGDG6PD | |
| SCHEMBL18941006 | 0.76 | CA1 (0.39) | KDM4EMAPTALDH1A1HPGDG6PD | |
| SCHEMBL31329331 | 0.75 | GAA (0.45) | KDM4EMAPTALDH1A1HPGDG6PD | |
| SCHEMBL31545845 | 0.75 | ALDH1A1 (0.75) | KDM4EMAPTALDH1A1HPGDG6PD | |
| Ethane SCHEMBL28289826 | 0.75 | KDM4E (0.48) | KDM4EMAPTALDH1A1HPGDG6PD | |
| SCHEMBL5533089 | 0.75 | KDM4E (0.40) | KDM4EMAPTALDH1A1HPGDG6PD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10162260-B2 | Photosensitive resin composition, protective film, and liquid crystal display element | CHI MEI CORPORATION (TW) | 2018-12-25 | — | — | US | disclosed |
| US-10067422-B2 | Photosensitive resin composition for forming interlayer insulating film, interlayer insulating film, and method for forming interlayer insulating film | TOKYO OHKA KOGYO CO. LTD. (JP) | 2018-09-04 | — | — | US | disclosed |
| US-9851638-B2 | Photosensitive polysiloxane composition and uses thereof | CHI MEI CORPORATION (TW) | 2017-12-26 | — | — | US | disclosed |
| US-20170255099-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING INTERLAYER INSULATING FILM, INTERLAYER INSULATING FILM, AND METHOD FOR FORMING INTERLAYER INSULATING FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-09-07 | — | — | US | disclosed |
| US-20170168390-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT | CHI MEI CORPORATION (TW) | 2017-06-15 | — | — | US | disclosed |
| US-20170023860-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF | CHI MEI CORP (TW) | 2017-01-26 | — | — | US | disclosed |
| US-9541832-B2 | Photosensitive resin composition, protective film and element having the same | CHI MEI CORPORATION (TW) | 2017-01-10 | — | — | US | disclosed |
| US-9422446-B2 | Photosensitive resin composition, protective film and element having the same | CHI MEI CORPORATION (TW) | 2016-08-23 | — | — | US | disclosed |
| US-9395627-B2 | Positive photosensitive resin composition and method for forming pattern by using the same | CHI MEI CORPORATION | 2016-07-19 | — | — | US | disclosed |
| US-9389509-B2 | Photosensitive polysiloxane composition, protecting film and element having the protecting film | CHI MEI CORPORATION (TW) | 2016-07-12 | — | — | US | disclosed |
| US-20120328799-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERNS BY USING THE SAME | CHI MEI CORPORATION (TW) | 2012-12-27 | — | — | US | disclosed |
| US-20120287393-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERNS BY USING THE SAME | CHI MEI COOPERATION (TW) | 2012-11-15 | — | — | US | disclosed |
| US-20120052439-A1 | PHOTO-CURING POLYSILOXANE COMPOSITION AND PROTECTIVE FILM FORMED FROM THE SAME | CHI MEI CORPORATION (TW) | 2012-03-01 | — | — | US | disclosed |
| EP-0848289-B1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO LTD (JP) | 2002-02-27 | — | — | EP | disclosed |
| US-5928837-A | Negative-working chemical-sensitization photoresist composition comprising oxime sulfonate compounds | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-07-27 | — | — | US | disclosed |
| EP-0848289-A1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-06-17 | — | — | EP | disclosed |
| US-5601961-A | QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-02-11 | — | — | US | disclosed |
| US-5576138-A | MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-11-19 | — | — | US | disclosed |
| US-5501936-A | IMPROVED RESOLUTION OF VERY FINE PATTERNS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-03-26 | — | — | US | disclosed |
| US-5478692-A | Fine patterning for electronics | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-12-26 | — | — | US | disclosed |