SCHEMBL766058

SCHEMBL766058

Nc1ccc(C(c2ccc(N)c(O)c2)(C(F)(F)F)C(F)(F)F)cc1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 3/20 0.50
ESR2 Q92731 2/20 0.50
HSD17B10 Q99714 3/20 0.46
ALOX15 P16050 3/20 0.46
CYP3A4 P08684 1/20 0.46
MEN1 O00255 3/20 0.42
KMT2A Q03164 3/20 0.42
GAA P10253 2/20 0.42
MAPT P10636 2/20 0.42
KDM4E B2RXH2 2/20 0.42
POLB P06746 1/20 0.42
RAB9A P51151 1/20 0.42
ALDH1A1 P00352 4/20 0.39
PKM P14618 2/20 0.39
RECQL P46063 1/20 0.39
AR P10275 1/20 0.37
HPGD P15428 2/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
TSHR P16473 1/20 0.34
TDP1 Q9NUW8 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29399630 1.00 ESR1 (0.50) ESR1ESR2HSD17B10ALOX15CYP3A4
SCHEMBL29412586 1.00 ESR1 (0.50) ESR1ESR2HSD17B10ALOX15CYP3A4
SCHEMBL4295432 0.93 ALDH1A1 (0.52) ESR1ESR2HSD17B10ALOX15CYP3A4
SCHEMBL9687133 0.91 ESR1 (0.44) ESR1ESR2HSD17B10ALOX15CYP3A4
SCHEMBL9327243 0.85 SRD5A2 (0.44) ESR1ESR2HSD17B10MEN1KMT2A
SCHEMBL29360962 0.83 ALDH1A1 (0.59) ESR1ESR2HSD17B10ALOX15MEN1
SCHEMBL29379543 0.83 ALDH1A1 (0.59) ESR1ESR2HSD17B10ALOX15MEN1
SCHEMBL5958751 0.83 HSD17B10 (0.46) ESR1ESR2HSD17B10ALOX15CYP3A4
SCHEMBL26579 0.83 ALDH1A1 (0.59) ESR1ESR2HSD17B10ALOX15MEN1
SCHEMBL3947426 0.83 HSD17B10 (0.50) ESR1ESR2HSD17B10ALOX15CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 637 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024216910-A1 HIGH-CHEMICAL-RESISTANCE POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND USE THEREOF 明士(北京)新材料开发有限公司 2024-10-24 WO claimed
EP-2063002-B1 Method for depositing and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO LTD (KR) 2011-11-23 EP claimed
EP-1455007-B1 Method for depositing and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO LTD (KR) 2010-06-02 EP claimed
EP-2063002-A2 Method for depositing and patterning carbon nanotubes using chemical self-assembly process Samsung Electronics Co., Ltd. (KR) 2009-05-27 EP claimed
US-6960425-B2 Method for laminating and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-11-01 US claimed
US-6875554-B2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2005-04-05 US claimed
EP-1455007-A2 Method for depositing and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-09-08 EP claimed
US-20040142285-A1 Method for laminating and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO., LTD. 2004-07-22 US claimed
US-6001534-A A PHOTOPOLYMERIZABLE POLYIMIDE-SILOXANE COPOLYMER SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-12-14 US claimed
US-5478914-A Polyimides and processes for preparaing the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-12-26 US claimed
US-5399655-A Acid-labile poly(amic acetal ester) E. I. DU PONT DE NEMOURS AND COMPANY (US) 1995-03-21 US claimed
US-20260147277-A1 TRANSFER FILM, PATTERN FORMING METHOD, LAMINATE, AND SEMICONDUCTOR PACKAGE FUJIFILM CORPORATION (JP) 2026-05-28 US disclosed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
EP-3633455-B1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2026-04-08 EP disclosed
US-4886874-A BLOCK POLYMER CONTAINING PHENYLENEDIAMINE AND OXYDIANILINE UNITS KANEGAFUCHI CHEMICAL IND. CO., LTD. (JP) 1989-12-12 US disclosed
US-4845183-A MOLDING MATERIALS; FOR DIELECTRICS OR COATING SOLUTIONS; TOUGHNESS, FLEXIBILITY, TRANSPARENT HOECHST CELANESE CORPORATION (US) 1989-07-04 US disclosed
EP-0317942-A2 Heat resistant polyamides and polybenzoxazoles from bis-[(aminohydroxyphenyl hexafluoro-isopropyl] diphenyl ethers HOECHST CELANESE CORPORATION (US) 1989-05-31 EP disclosed
EP-0277547-A2 Polyimide having thermal dimensional stability Kanegafuchi Chemical Industry Co., Ltd. (JP) 1988-08-10 EP disclosed
EP-0276405-A2 Polyimide having a thermal dimensional stability Kanegafuchi Chemical Industry Co., Ltd. (JP) 1988-08-03 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 ESR1 3154/4885ESR2 1998/4885HSD17B10 3992/4885
US-20260147277-A1 TRANSFER FILM, PATTERN FORMING METHOD, LAMINATE, AND SEMICONDUCTOR PACKAGE LCP1, PCNA, FDFT1 ESR1 769/4885ESR2 2353/4885HSD17B10 2181/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.