Known targets — ChEMBL curated mechanism
GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ
The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC22A1 | O15245 | 3/20 | 0.86 |
| ▸ | SLC22A2 | O15244 | 1/20 | 0.86 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.75 |
| ▸ | TP53 | P04637 | 1/20 | 0.75 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.75 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.75 |
| ▸ | TSHR | P16473 | 1/20 | 0.75 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.75 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.75 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.75 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.75 |
| ▸ | DNM1 | Q05193 | 7/20 | 0.67 |
| ▸ | APAF1 | O14727 | 1/20 | 0.55 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.55 |
| ▸ | RAD52 | P43351 | 1/20 | 0.55 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL3485498 | 1.00 | SLC22A1 (0.86) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3484887 | 1.00 | SLC22A1 (0.86) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3485332 | 1.00 | SLC22A1 (0.86) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL876408 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3486043 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL875909 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3485233 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3485231 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3485321 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Tetrahexylammonium SCHEMBL5469443 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9803108-B1 | Aqueous compositions of stabilized aminosilane group containing silica particles | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2017-10-31 | — | — | US | claimed |
| US-10781343-B2 | Acid polishing composition and method of polishing a substrate having enhanced defect inhibition | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2020-09-22 | — | — | US | disclosed |
| US-20200239734-A1 | ACID POLISHING COMPOSITION AND METHOD OF POLISHING A SUBSTRATE HAVING ENHANCED DEFECT INHIBITION | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2020-07-30 | — | — | US | disclosed |
| US-10316218-B2 | Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2019-06-11 | — | — | US | disclosed |
| US-20190092970-A1 | AQUEOUS LOW ABRASIVE SILICA SLURRY AND AMINE CARBOXYLIC ACID COMPOSITIONS FOR USE IN SHALLOW TRENCH ISOLATION AND METHODS OF MAKING AND USING THEM | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2019-03-28 | — | — | US | disclosed |
| US-10221336-B2 | Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them | rohm and Hass Electronic Materials CMP Holdings, Inc. (US) | 2019-03-05 | — | — | US | disclosed |
| US-20180362805-A1 | AQUEOUS SILICA SLURRY COMPOSITIONS FOR USE IN SHALLOW TRENCH ISOLATION AND METHODS OF USING THEM | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2018-12-20 | — | — | US | disclosed |
| US-10119048-B1 | Low-abrasive CMP slurry compositions with tunable selectivity | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2018-11-06 | — | — | US | disclosed |
| US-9803108-B1 | Aqueous compositions of stabilized aminosilane group containing silica particles | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2017-10-31 | — | — | US | disclosed |
| US-9803108-B1 | Aqueous compositions of stabilized aminosilane group containing silica particles | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2017-10-31 | — | — | US | disclosed |
| US-9783702-B1 | Aqueous compositions of low abrasive silica particles | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC. (US) | 2017-10-10 | — | — | US | disclosed |
| US-9275899-B2 | Chemical mechanical polishing composition and method for polishing tungsten | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2016-03-01 | — | — | US | disclosed |
| US-20150380295-A1 | CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR POLISHING TUNGSTEN | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-12-31 | — | — | US | disclosed |
| US-8865013-B2 | Method for chemical mechanical polishing tungsten | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2014-10-21 | — | — | US | disclosed |
| US-8568610-B2 | Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2013-10-29 | — | — | US | disclosed |
| US-8513126-B2 | Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2013-08-20 | — | — | US | disclosed |
| US-20130045598-A1 | Method for chemical mechanical polishing tungsten | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2013-02-21 | — | — | US | disclosed |
| US-20120070990-A1 | Slurry Composition Having Tunable Dielectric Polishing Selectivity And Method Of Polishing A Substrate | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2012-03-22 | — | — | US | disclosed |
| US-20120070989-A1 | Stabilized, Concentratable Chemical Mechanical Polishing Composition And Method Of Polishing A Substrate | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2012-03-22 | — | — | US | disclosed |